An apparatus having a first interface of a first type supporting a plurality of data ports, a second interface of a second type supporting at least a portion of the plurality data ports, and a third interface of the second type. The apparatus also including a switching module coupled to a control port of the first interface and configured for selectably coupling the plurality of data ports to at least one of the second interface and the third interface based on a signal at the control port.

An example module includes: a radio to communicate with a sensor; a communication interface to communicate with a second module; a chassis to mate with the second module; and a processor connected to the radio, the communication interface, and a memory, the processor to execute instructions stored in the memory. The instructions are to: receive, via the radio, sensor data from the sensor; process the sensor data to generate processed sensor data; and transmit the processed sensor data to a remote device.

A data processing apparatus includes a first chip and a second chip that are stacked-packaged. The first chip includes a general-purpose processor, a bus, and at least one first dedicated processing unit (DPU). The general-purpose processor and the at least one first dedicated processing unit are connected to the bus. The general-purpose processor is configured to generate a data processing task. The second chip includes a second dedicated processing unit. At least one of one or more units in the at least one first dedicated processing unit and the second dedicated processing unit can process at least a part of the data processing task based on a computing function.

A memory module adapter card can adapt multiple compression-attached memory modules (CAMMs) to a dual inline memory module (DIMM) connector. Multiplexer circuitry on the adapter card enables multiplexing data amongst the memory modules attached to the adapter card during a same burst access sequence.

A method including creating a first bus guide and a second bus guide of a plurality of bus guides for an integrated circuit is disclosed. The method includes routing the first bus guide and the second bus guide through a plurality of layout blocks of the integrated circuit. The method includes annotating the first bus guide or the second bus guide to identify a plurality of areas for placing a plurality of repeaters within the first bus guide or the second bus guide. The method includes, based on the annotated first bus guide and the second bus guide, generating, by at least one processor, a plurality of guidance directories corresponding to a plurality of routes through the plurality of layout blocks for placing the plurality of repeaters at the plurality of layout blocks on the identified plurality of areas on the first bus guide or the second bus guide.

A method including creating a first bus guide and a second bus guide of a plurality of bus guides for an integrated circuit is disclosed. The method includes routing the first bus guide and the second bus guide through a plurality of layout blocks of the integrated circuit. The method includes annotating the first bus guide or the second bus guide to identify a plurality of areas for placing a plurality of repeaters within the first bus guide or the second bus guide. The method includes, based on the annotated first bus guide and the second bus guide, generating, by at least one processor, a plurality of guidance directories corresponding to a plurality of routes through the plurality of layout blocks for placing the plurality of repeaters at the plurality of layout blocks on the identified plurality of areas on the first bus guide or the second bus guide.

In order to be able to arrange a master module (M), slave modules (S), and conventional plug modules (K) in a freely configurable manner in a modular plug system, a modular frame (22) is provided with a circuit board (1) which includes at least one continuous conductor path and preferably more than one connection pad.

An example module includes: a radio to communicate with a sensor; a communication interface to communicate with a second module; a chassis to mate with the second module; and a processor connected to the radio, the communication interface, and a memory, the processor to execute instructions stored in the memory. The instructions are to: receive, via the radio, sensor data from the sensor; process the sensor data to generate processed sensor data; and transmit the processed sensor data to a remote device.

A memory module may include: a plurality of stacked memory chips; a memory controller; and an interposer connected between the plurality of memory chips and the memory controller.

In order to be able to arrange a master module (M), slave modules (S), and conventional plug modules (K) in a freely configurable manner in a modular plug system, a modular frame (22) is provided with a circuit board (1) which includes at least one continuous conductor path and preferably more than one connection pad.