G11C2013/0076

Resistive random access memory, and method for manufacturing resistive random access memory

A resistive random access memory includes a memory cell including a resistive element having a resistance which varies according to a write operation and stores data according to the resistance of the resistive element, a reference resistive element having a resistance set to a first value, a voltage line set to a first voltage during a first write operation in which the resistance of the resistive element is varied from a second value higher than the first value to the first value, and a voltage control circuit arranged between first ends of the two resistive elements. The voltage control circuit adjusts a value of the first voltage supplied from the voltage line so as to reduce a difference between currents flowing through the two resistive elements during the first write operation, and supply the adjusted first voltage to the first ends of the two resistive elements.

NON-VOLATILE SEMICONDUCTOR MEMORY DEVICE
20180012655 · 2018-01-11 · ·

A non-volatile semiconductor memory device includes a memory array 20, including a plurality of memory elements; a selection part, selecting the memory elements of the memory array based on address data; a mode selection part 30, selecting any one of a RAM mode and a flash mode, where the RAM mode is a mode adapted to overwrite data of the memory element according to writing data, and the flash mode is a mode adapted to overwrite data of the memory element when the writing data is a first value and prohibit overwrite when the writing data is a second value; and a write control part, writing the writing data to the selected memory element according to the RAM mode or the flash mode selected by the mode selection part 30.

Modified write voltage for memory devices

Methods, systems, and devices for a modified write voltage for memory devices are described. In an example, the memory device may determine a first set of memory cells to be switched from a first logic state (e.g., a SET state) to a second logic state (e.g., a RESET state) based on a received write command. The memory device may perform a read operation to determine a subset of the first set of memory cells (e.g., a second set of memory cells) having a conductance threshold satisfying a criteria based on a predicted drift of the memory cells. The memory device may apply a RESET pulse to each of the memory cells within the first set of memory cells, where the RESET pulse applied to the second set of memory cells is modified to decrease voltage threshold drift in the RESET state.

CROSS-POINT MEMORY READ TECHNIQUE TO MITIGATE DRIFT ERRORS

A read technique for both SLC (single level cell) and MLC (multi-level cell) cross-point memory can mitigate drift-related errors with minimal or no drift tracking. In one example, a read at a higher magnitude voltage is applied first, which causes the drift for cells in a lower threshold voltage state to be reset. In one example, the read at the first voltage can be a full float read to minimize disturb. A second read can then be performed at a lower voltage without the need to adjust the read voltage due to drift.

Pseudo physically unclonable functions (PUFS) using one or more addressable arrays of elements having random/pseudo-random values

An integrated circuit device can include a plurality of nonvolatile memory elements having values that vary randomly or pseudo-randomly from one another; a selection circuit configured to select a plurality of nonvolatile memory elements that vary randomly or pseudo-randomly in response to a received challenge value; and sense circuits configured to generate a response value based on the values of the selected nonvolatile memory elements. Related methods and systems are also disclosed.

Neural network data updates using in-place bit-addressable writes within storage class memory

Methods and apparatus are disclosed for managing the storage of dynamic neural network data within bit-addressable memory devices, such phase change memory (PCM) arrays or other storage class memory (SCM) arrays. In some examples, a storage controller determines an expected amount of change within data to be updated. If the amount is below a threshold, an In-place Write is performed using bit-addressable writes via individual SET and RESET pulses. Otherwise, a modify version of an In-place Write is performed where a SET pulse is applied to preset a portion of memory to a SET state so that individual bit-addressable writes then may be performed using only RESET pulses to encode the updated data. In other examples, a storage controller separately manages static and dynamic neural network data by storing the static data in a NAND-based memory array and instead storing the dynamic data in a SCM array.

VARIABLE RESISTANCE MEMORY DEVICE
20230032616 · 2023-02-02 · ·

A variable resistance memory device includes: a memory cell including a first and second sub memory cell; and a first, second and third conductor. The first sub memory cell is above the first conductor, and includes a first variable resistance element and a first bidirectional switching element. The second sub memory cell is above the second conductor, and includes a second variable resistance element and a second bidirectional switching element. The second conductor is above the first sub memory cell. The third conductor is above the second sub memory cell. The variable resistance memory device is configured to receive first data and to write the first data to the memory cell when the first data does not match second data read from the memory cell.

Memory device and operating method thereof

A memory device includes a plurality of memory cells, each including a switching device and an information storage device connected to the switching device and having a phase change material, the plurality of memory cells connected to a plurality of word lines and a plurality of bit lines, a decoder circuit determining at least one of the plurality of memory cells to be a selected memory cell, and a program circuit configured to input a programming current to the selected memory cell to perform a programming operation and configured to detect a resistance of the selected memory cell to adjust a magnitude of the programming current.

Mixed conducting volatile memory element for accelerated writing of nonvolatile memristive device

An embodiment in the application may include an analog memory structure, and methods of writing to such a structure, including a volatile memory element in series with a non-volatile memory element. The analog memory structure may change resistance upon application of a voltage. This may enable accelerated writing of the analog memory structure.

ON-THE-FLY PROGRAMMING AND VERIFYING METHOD FOR MEMORY CELLS BASED ON COUNTERS AND ECC FEEDBACK

The present invention relates to a method of operating memory cells, comprising reading a previous user data from the memory cells; writing a new user data and merging the new user data with the previous user data into write registers; generating mask register information, and wherein the mask register information indicates bits of the previous user data stored in the memory cells to be switched or not to be switched in their logic values; counting numbers of a first logic value and a second logic value to be written using the mask register information, respectively; storing the numbers of the first logic value and the second logic value into a first counter and a second counter, respectively; and applying a programming pulse to the memory cells according to the mask register information.