The present invention provides a polyvinyl acetal resin which leaves less fine undissolved matter when dissolved in an organic solvent and thus can improve productivity particularly when used as a binder for a ceramic green sheet, and which can also provide a ceramic green sheet having excellent toughness and enables production of a highly reliable multilayer ceramic capacitor. Provided is a polyvinyl acetal resin having: a wavenumber A (cm.sup.−1) of a peak within a range of 3,100 to 3,700 cm.sup.−1 in an IR absorption spectrum measured using an infrared spectrophotometer; and a hydroxy group content (mol %), the wavenumber A of the peak and the hydroxy group content satisfying relations of the following formulas (1) and (2):

[(3,470−A)/Hydroxy group content]≤5.5  (1)

(3,470−A)≤185  (2)

wherein A is a wavenumber which is lower than 3,470 cm.sup.−1 and at which a transmittance a (%) satisfying [100−(100−X)/2] is exhibited, where X (%) is a minimum transmittance of the peak within the wavenumber range of 3,100 to 3,700 cm.sup.−1.

The present invention concerns a layer structure comprising: a substrate having a glass or ceramic surface, a layer A at least partially covering the glass or ceramic surface of the substrate, wherein layer A comprises a glass in which at least two mutually different elements are contained as oxides, and a layer B at least partially covering the layer A. Layer B comprises: a resistance alloy having a temperature coefficient of electrical resistance less than 150 ppm/K, and optionally a glass containing at least two mutually different elements as oxides. Layer B contains not more than 20 weight percent of glass based on the total weight of layer B.

The invention relates to a production method for an electrical resistance element (for example a shunt) with the following steps: —providing a resistance alloy in powder form, and—forming the resistance element from the powdered resistance material. The invention also relates to a correspondingly produced resistance element.

In an example 3D printing method, an electrical conductivity value for a resistor is identified. Based upon the identified electrical conductivity value, a predetermined amount of a conductive agent is selectively applied to at least a portion of a build material layer in order to introduce a predetermined volume percentage of a conductive material to the resistor. Based upon the identified electrical conductivity value and the predetermined volume percent of the conductive material, a predetermined amount of a resistive agent is selectively applied to the at least a portion of the build material layer in order to introduce a predetermined volume percentage of a resistive material to the resistor. The build material layer is exposed to electromagnetic radiation, whereby the at least the portion coalesces to form a layer of the resistor.

The invention relates to a production method for an electrical resistance element (for example a shunt) with the following steps: -providing a resistance alloy in powder form, and -forming the resistance element from the powdered resistance material. The invention also relates to a correspondingly produced resistance element.

A resistor includes materials including copper, nickel, and lanthanum boride. A content of the materials is 40% by mass or more with respect to a total material content of the resistor. The copper includes copper particles having a particle diameter of 2.5 m or more. In addition, a circuit board includes a substrate, the resistor on the substrate, a metal layer on the resistor and a glass layer on the resistor. Further, an electronic device includes the circuit board and an electronic component on the metal layer.

The present invention concerns a layer structure comprising: a substrate having a glass or ceramic surface, a layer A at least partially covering the glass or ceramic surface of the substrate, wherein layer A comprises a glass in which at least two mutually different elements are contained as oxides, and a layer B at least partially covering the layer A. Layer B comprises: a resistance alloy having a temperature coefficient of electrical resistance less than 150 ppm/K, and optionally a glass containing at least two mutually different elements as oxides. Layer B contains not more than 20 weight percent of glass based on the total weight of layer B.

A heating paste composition, and a sheet heating element, a heating roller, a heating unit and a heating module, which use the composition, are disclosed. In one aspect, the heating paste composition includes 0.2 parts to 6 parts by weight of carbon nanotube particles, 0.5 parts to 30 parts by weight of graphite particles, 5 parts to 30 parts by weight of a binder mixture, 29 parts to 80 parts by weight of an organic solvent and 0.5 parts to 5 parts by weight of a dispersant, wherein the weights are with respect to 100 parts by weight of the heating paste composition.

A resistor includes materials including copper, nickel, and lanthanum boride. A content of the materials is 40% by mass or more with respect to a total material content of the resistor. The copper includes copper particles having a particle diameter of 2.5 m or more. In addition, a circuit board includes a substrate, the resistor on the substrate, a metal layer on the resistor and a glass layer on the resistor. Further, an electronic device includes the circuit board and an electronic component on the metal layer.

In an example 3D printing method, an electrical conductivity value for a resistor is identified. Based upon the identified electrical conductivity value, a predetermined amount of a conductive agent is selectively applied to at least a portion of a build material layer in order to introduce a predetermined volume percentage of a conductive material to the resistor. Based upon the identified electrical conductivity value and the predetermined volume percent of the conductive material, a predetermined amount of a resistive agent is selectively applied to the at least a portion of the build material layer in order to introduce a predetermined volume percentage of a resistive material to the resistor. The build material layer is exposed to electromagnetic radiation, whereby the at least the portion coalesces to form a layer of the resistor.