A method for manufacturing a miniature resistor includes the steps of: providing a foil sheet; forming intersecting rows of slits to define a patterned foil sheet having a matrix array of resistor blanks that are interconnected at intersections of the intersecting rows; forming a resin film on a bottom surface of the patterned foil sheet; forming a plurality of protruding blocks on each resistor blanks; forming an encapsulating layer on atop surface of each resistor blanks without covering outer surfaces of the protruding blocks; performing a die cutting process to obtain individual resistor blanks; and forming two external electrodes respectively on the protruding blocks and on two side surfaces of the individual resistor blanks to obtain the miniature resistor.

A method for manufacturing a miniature resistor includes the steps of: providing a foil sheet; forming intersecting rows of slits to define a patterned foil sheet having a matrix array of resistor blanks that are interconnected at intersections of the intersecting rows; forming a resin film on a bottom surface of the patterned foil sheet; forming a plurality of protruding blocks on each resistor blanks; forming an encapsulating layer on atop surface of each resistor blanks without covering outer surfaces of the protruding blocks; performing a die cutting process to obtain individual resistor blanks; and forming two external electrodes respectively on the protruding blocks and on two side surfaces of the individual resistor blanks to obtain the miniature resistor.

An NTC component comprising a first electrode (1) and a second electrode (2) is specified. The NTC component further comprises an NTC element (3) disposed between the first electrode (1) and the second electrode (2), wherein the NTC element (3) comprises a ceramic having the general composition AB.sub.2O.sub.4, and where A and B each comprise one or more of the materials Mn, Ni, Co and Cu, and B additionally comprises one or more of the materials Fe, Y, Pr, Al, In, Ga and Sb.

An NTC component comprising a first electrode (1) and a second electrode (2) is specified. The NTC component further comprises an NTC element (3) disposed between the first electrode (1) and the second electrode (2), wherein the NTC element (3) comprises a ceramic having the general composition AB.sub.2O.sub.4, and where A and B each comprise one or more of the materials Mn, Ni, Co and Cu, and B additionally comprises one or more of the materials Fe, Y, Pr, Al, In, Ga and Sb.

The invention relates to a composite material strip for producing an electric component, in particular a resistor, in particular a low-resistance current-measuring resistor, comprising a first material strip (4) made of a copper-containing material, in particular a copper-containing conductor material, for later forming a first connection part of the electric component and comprising a second material strip (3) for later forming a second connection part of the electric component. The first material strip (4) and the second material strip (3) are electrically and mechanically connected together along a longitudinal seam, wherein the second material strip (3) consists of an aluminum-containing material, in particular an aluminum-containing conductor material. The invention further relates to a corresponding production method and to a corresponding component.

A method for manufacturing a miniature resistor includes the steps of: providing a foil sheet; forming intersecting rows of slits to define a patterned foil sheet having a matrix array of resistor blanks that are interconnected at intersections of the intersecting rows; forming a resin film on a bottom surface of the patterned foil sheet; forming a plurality of protruding blocks on each resistor blanks; forming an encapsulating layer on atop surface of each resistor blanks without covering outer surfaces of the protruding blocks; performing a die cutting process to obtain individual resistor blanks; and forming two external electrodes respectively on the protruding blocks and on two side surfaces of the individual resistor blanks to obtain the miniature resistor.

A method for manufacturing a miniature resistor includes the steps of: providing a foil sheet; forming intersecting rows of slits to define a patterned foil sheet having a matrix array of resistor blanks that are interconnected at intersections of the intersecting rows; forming a resin film on a bottom surface of the patterned foil sheet; forming a plurality of protruding blocks on each resistor blanks; forming an encapsulating layer on atop surface of each resistor blanks without covering outer surfaces of the protruding blocks; performing a die cutting process to obtain individual resistor blanks; and forming two external electrodes respectively on the protruding blocks and on two side surfaces of the individual resistor blanks to obtain the miniature resistor.

The invention relates to a shunt resistor (2) for detecting the status of an electrical energy storage unit (1), wherein the shunt resistor (2) comprises a first layer (4), a second layer (6) and a third layer (8). According to the invention, the layers (4, 6, 8) are arranged in a layered manner in a stacking direction (V), wherein the second layer (6) is arranged between the first layer (4) and the third layer (8), and wherein the layers (4, 6, 8) are in physical contact with one another at one of the sides having the greatest respective surface area, and wherein the layers (4, 6, 8) are arranged at least partially overlapping.

An object is to provide a resistor manufacturing method and a resistor capable of suppressing variation in the thickness of a thermally conductive layer intervening between a resistive body and electrode plates. The method of manufacturing the resistor according to the present invention includes a step of forming an uncured first thermally conductive layer on a surface of a resistive body, a step of curing the first thermally conductive layer, a step of laminating an uncured second thermally conductive layer on a surface of the first thermally conductive layer, and a step of bending electrode plates respectively disposed at both sides of the resistive body, curing the second thermally conductive layer, and performing adhesion between the resistive body and the electrode plates via the first thermally conductive layer and the second thermally conductive layer.

The invention relates to a shunt resistor (2) for detecting the status of an electrical energy storage unit (1), wherein the shunt resistor (2) comprises a first layer (4), a second layer (6) and a third layer (8). According to the invention, the layers (4, 6, 8) are arranged in a layered manner in a stacking direction (V), wherein the second layer (6) is arranged between the first layer (4) and the third layer (8), and wherein the layers (4, 6, 8) are in physical contact with one another at one of the sides having the greatest respective surface area, and wherein the layers (4, 6, 8) are arranged at least partially overlapping.