A silver-plated product having a higher hardness and more excellent wear resistance than those of conventional silver-plated products, and a method for producing the same. In a method for producing a silver-plated product by forming a surface layer of silver on a base material by electroplating at a current density in a silver-plating solution which is an aqueous solution containing silver potassium cyanide or silver cyanide, potassium cyanide or sodium cyanide, and a benzimidazole (such as 2-mercaptobenzmimidazole or 2-mercaptobenzimidazole sulfonic acid sodium salt dihydrate), the ratios of the concentrations of silver potassium cyanide or silver cyanide, potassium cyanide or sodium cyanide, and the imidazole to the current density during the silver-plating (or the ratios of the concentrations of silver potassium cyanide or silver cyanide and the imidazole to the current density during the silver plating, and the concentration of potassium cyanide or sodium cyanide) are set to be predetermined ranges, respectively.

A silver-plated product is produced by forming a surface layer of silver on a base material by electroplating at a liquid temperature of 10 to 35° C. and a current density of 3 to 15 A/dm.sup.2 in a silver plating solution so as to satisfy (32.6x−300)≦y≦(32.6x+200) assuming that a product of a concentration of potassium cyanide in the silver plating solution and a current density is y (g.Math.A/L.Math.dm.sup.2) and that a liquid temperature of the silver plating solution is x (° C.), the silver plating solution containing 80 to 110 g/L of silver, 70 to 160 g/L of potassium cyanide and 55 to 70 mg/L of selenium.

A silver-plated product having a higher hardness and more excellent wear resistance than those of conventional silver-plated products, and a method for producing the same. In a method for producing a silver-plated product by forming a surface layer of silver on a base material by electroplating at a current density in a silver-plating solution which is an aqueous solution containing silver potassium cyanide or silver cyanide, potassium cyanide or sodium cyanide, and a benzimidazole (such as 2-mercaptobenzmimidazole or 2-mercaptobenzimidazole sulfonic acid sodium salt dihydrate), the ratios of the concentrations of silver potassium cyanide or silver cyanide, potassium cyanide or sodium cyanide, and the imidazole to the current density during the silver-plating (or the ratios of the concentrations of silver potassium cyanide or silver cyanide and the imidazole to the current density during the silver plating, and the concentration of potassium cyanide or sodium cyanide) are set to be predetermined ranges, respectively.

A silver-plated product is produced by forming a surface layer of silver on a base material by electroplating at a liquid temperature of 10 to 35° C. and a current density of 3 to 15 A/dm.sup.2 in a silver plating solution so as to satisfy (32.6x−300)≤y≤(32.6x+200) assuming that a product of a concentration of potassium cyanide in the silver plating solution and a current density is y (g.Math.A/L.Math.dm.sup.2) and that a liquid temperature of the silver plating solution is x (° C.), the silver plating solution containing 80 to 110 g/L of silver, 70 to 160 g/L of potassium cyanide and 55 to 70 mg/L of selenium.

In a contact member, a mesh-like contact including one or more layers of a metal other than a noble metal is embedded in such a manner as to be exposed from one of the surfaces of a rubbery elastic body. The contact member includes a highly conductive metal coat layer only in the regions of the mesh-like contact which are exposed from the rubbery elastic body, the coat layer having conductivity higher than that of the metal on the outermost surfaces of the mesh-like contact.

An electrical contact material may include a first contact that contacts a negative electrode; a third contact that contacts a positive electrode; and a second contact that is provided between the first contact and the third contact, wherein different plating materials are respectively attached to the first contact, the second contact, and the third contact.

A silver-plated product is produced by forming a surface layer of silver on a base material by electroplating at a liquid temperature of 10 to 35 C. and a current density of 3 to 15 A/dm.sup.2 in a silver plating solution so as to satisfy (32.6x300)y(32.6x+200) assuming that a product of a concentration of potassium cyanide in the silver plating solution and a current density is y (g.Math.A/L.Math.dm.sup.2) and that a liquid temperature of the silver plating solution is x ( C.), the silver plating solution containing 80 to 110 g/L of silver, 70 to 160 g/L of potassium cyanide and 55 to 70 mg/L of selenium.

A silver-plated product is produced by forming a surface layer of silver on a base material by electroplating at a liquid temperature of 10 to 35 C. and a current density of 3 to 15 A/dm.sup.2 in a silver plating solution so as to satisfy (32.6x300)y(32.6x+200) assuming that a product of a concentration of potassium cyanide in the silver plating solution and a current density is y (g.Math.A/L.Math.dm.sup.2) and that a liquid temperature of the silver plating solution is x ( C.), the silver plating solution containing 80 to 110 g/L of silver, 70 to 160 g/L of potassium cyanide and 55 to 70 mg/L of selenium.

A modular auxiliary switch includes a housing including a first housing part and a separate second housing part secured to the first housing part. A printed circuit board is housed in one of the first and second housing parts, and has a first side facing the first housing part and a second opposite side facing the second housing part. An actuator mechanism is housed in the first housing part and is coupled to the printed circuit board. A separate first electrical contactor is selectively mounted to the printed circuit board so that a first electrical contact surface of the first electrical contactor overlaps and is in direct contact with one of the first side and the second side to define a first electrical contact pad on the printed circuit board.

In a contact member, a mesh-like contact including one or more layers of a metal other than a noble metal is embedded in such a manner as to be exposed from one of the surfaces of a rubbery elastic body. The contact member includes a highly conductive metal coat layer only in the regions of the mesh-like contact which are exposed from the rubbery elastic body, the coat layer having conductivity higher than that of the metal on the outermost surfaces of the mesh-like contact.