A semiconductor manufacturing equipment has an outer case housing including a lower case extension to support a semiconductor panel. The lower case extension is fixed in position within the outer case housing. An inner case housing having an upper case extension is disposed within the outer case housing in proximity to the lower case extension. A mechanism draws the upper case extension toward the lower case extension and locks the semiconductor panel in place between the upper case extension and lower case extension. The mechanism has a cam assembly disposed above the inner case housing and operatable with a handle to rotate the cam assembly and apply pressure to the inner case housing and upper case extension to lock the semiconductor panel in place between the upper case extension and lower case extension. A spring or other elastic mechanism is disposed under the inner case housing to load the pressure.

A semiconductor manufacturing equipment has an outer case housing including a lower case extension to support a semiconductor panel. The lower case extension is fixed in position within the outer case housing. An inner case housing having an upper case extension is disposed within the outer case housing in proximity to the lower case extension. A mechanism draws the upper case extension toward the lower case extension and locks the semiconductor panel in place between the upper case extension and lower case extension. The mechanism has a cam assembly disposed above the inner case housing and operatable with a handle to rotate the cam assembly and apply pressure to the inner case housing and upper case extension to lock the semiconductor panel in place between the upper case extension and lower case extension. A spring or other elastic mechanism is disposed under the inner case housing to load the pressure.

A packaging container for transporting ceramic substrates according to the present embodiment includes a bottom portion in a rectangular shape, and four side portions connected to four edges of the bottom portion respectively. Side protrusions having a height of 2 mm or more and protruding inward are provided on at least two opposite side portions among the four side portions. The bottom portion is provided with a bottom protrusion having a height of 2 mm or more and protruding inward.

A carrier includes a jig and a case. The jig is configured to hold at least one consumable to be loaded into or unloaded from a container. The case is configured to store the jig and the consumable held by the jig.

A sheet affixing apparatus has a frame stocker for housing a plurality of annular frames stacked therein. The frame stocker includes a support stage for supporting the stack of annular frames placed thereon, a plurality of abutting members for positioning the annular frames in a predetermined position on the support stage, the abutting members being erected around the support stage, an openable and closable door for separating an area that houses the support stage and the abutting members therein, the openable and closable door being disposed laterally of the support stage, a sensor for detecting when the openable and closable door is closed, an entry member movable into and out of the recesses of the annular frames placed on the support stage, in ganged relation to opening and closing movement of the openable and closable door, and a control unit.

The invention relates to a packaging unit for substrates, a packaging stack having packaging units of this type and a method for packaging substrates. The packaging unit for substrates comprises a first substrate, a spacer and a second substrate. The spacer is placed on the first substrate and the second substrate is placed on the spacer. A respective metal deposit is applied to a surface of the first substrate and to a surface of the second substrate and a respective adhesive point is arranged on the two metal deposits. The spacer is placed on the first substrate in such a way that the spacer is only in contact with the first substrate outside of the adhesive point. The spacer is bridge-shaped. At least the first substrate comprises a plurality of individual substrates arranged next to one another and the spacer borders the individual substrates.

A substrate case includes a shaft portion around which a sheet-shaped substrate having a circuit area in which a circuit manufacturing process is performed is wound; and a cover portion that accommodates the substrate in the state of being wound around the shaft portion, the shaft portion having a holding portion that holds an area different from the circuit area at a winding start portion of the substrate.

A transfer device includes a controller configured or programmed to perform at least one of a first control to make a maximum acceleration when moving a FOUP to a front end side smaller than a maximum acceleration when moving to a back end side, a second control to make a maximum deceleration when moving the FOUP to the front end side greater than a maximum deceleration when moving to the back end side, a third control to make the absolute value of the maximum deceleration when moving the FOUP to the front end side greater than the absolute value of the maximum acceleration, and a fourth control to make the absolute value of the maximum acceleration when moving the FOUP to the back end side greater than the absolute value of the maximum deceleration.

A transfer device includes a controller configured or programmed to perform at least one of a first control to make a maximum acceleration when moving a FOUP to a front end side smaller than a maximum acceleration when moving to a back end side, a second control to make a maximum deceleration when moving the FOUP to the front end side greater than a maximum deceleration when moving to the back end side, a third control to make the absolute value of the maximum deceleration when moving the FOUP to the front end side greater than the absolute value of the maximum acceleration, and a fourth control to make the absolute value of the maximum acceleration when moving the FOUP to the back end side greater than the absolute value of the maximum deceleration.

The present invention relates to a packaging unit for a substrate, a package stack with such packaging units and a process for packaging a substrate. The packaging unit for a substrate comprises a first shell, a substrate and a second shell. The substrate is inserted into the first shell, and the second shell is mounted on the first shell so that a first side of the substrate is surrounded by the first shell and an opposite, second side of the substrate is covered by the second shell. A metal deposit is applied to the second side of the substrate and an adhesive point is arranged on the metal deposit. The second shell is supported on the first shell in such a way that the second shell is only in contact with the substrate outside the adhesive point.