A die attach system is provided. The die attach system includes: a support structure for supporting a substrate; a die supply source including a plurality of die for attaching to the substrate; and a bond head for bonding a die from the die supply source to the substrate, the bond head including a bond tool having a contact portion for contacting the die during a transfer from the die supply source to the substrate, the bond head including a spring portion engaged with the bond tool such that the spring portion is configured to compress during pressing of the die against the substrate using the contact portion of the bond tool.

The present invention provides structures and methods that enable the construction of micro-LED chiplets formed on a sapphire substrate that can be micro-transfer printed. Such printed structures enable low-cost, high-performance arrays of electrically connected micro-LEDs useful, for example, in display systems. Furthermore, in an embodiment, the electrical contacts for printed LEDs are electrically interconnected in a single set of process steps. In certain embodiments, formation of the printable micro devices begins while the semiconductor structure remains on a substrate. After partially forming the printable micro devices, a handle substrate is attached to the system opposite the substrate such that the system is secured to the handle substrate. The substrate may then be removed and formation of the semiconductor structures is completed. Upon completion, the printable micro devices may be micro transfer printed to a destination substrate.

A light-emitting device includes a carrier, a light-emitting element and a connection structure. The carrier includes a first electrical conduction portion. The light-emitting element includes a first light-emitting layer capable of emitting first light and a first contact electrode formed under the light-emitting layer. The first contact electrode is corresponded to the first electrical conduction portion. The connection structure includes a first electrical connection portion and a protective portion surrounding the first contact electrode and the first electrical connection portion. The first electrical connection portion includes an upper portion, a lower portion and a neck portion arranged between the upper portion and the lower portion. An edge of the upper portion is protruded beyond the neck portion, and an edge of the lower portion is protruded beyond the upper portion.

A transfer substrate is configured to transfer a plurality of micro components from a first substrate to a second substrate. The transfer substrate comprises a base and a plurality of transfer heads. The base includes an upper surface. The plurality of transfer heads is disposed on the upper surface of the base, wherein each transfer head includes a first surface and a second surface opposite to each other and the transfer heads contact the base with the first surfaces thereof. A plurality of adhesion lumps is separated from each other, wherein each adhesion lump is disposed on the second surface of one of the transfer heads. A CTE of the base is different from CTEs of the transfer heads.

The present invention relates to a film-shaped firing material (1) which contains: sinterable metal particles (10); a binder component (20) that is a solid at room temperature; and a liquid component (30) that is a liquid at room temperature, the liquid component having a boiling point from 300 to 450° C.

Provide are a transfer system and a transfer method. The transfer system is configured to transfer chips and includes a temporary substrate and a transfer device. The temporary substrate has a first surface and a second surface opposite to each other. There is a first angle between the second surface and the first surface. The transfer device has a transfer substrate and a plurality of transfer heads provided on the transfer substrate. The transfer substrate has a third surface and a fourth surface opposite to each other, and there is a second angle between the fourth surface and the third surface. The plurality of transfer heads are located at intervals on the fourth surface, and a side surface of the above-mentioned transfer head that faces away from the transfer substrate is parallel to the fourth surface.

An adhesive structure is provided, which includes a plastic substrate, and an adhesive layer on the plastic substrate. The adhesive layer includes a releasable adhesive. The adhesive layer has a Young's modulus of 5 MPa to 14 MPa and an adhesive force to glass of 200 gf/25 mm to 2000 gf/25 mm. The adhesive structure can be used to transfer a device.

A method of using an optoelectronic semiconductor stamp to manufacture an optoelectronic semiconductor device comprises the following steps: a preparation step: preparing at least one optoelectronic semiconductor stamp group and a target substrate, wherein each optoelectronic semiconductor stamp group comprises at least one optoelectronic semiconductor stamp, each optoelectronic semiconductor stamp comprises a plurality of optoelectronic semiconductor components disposed on a heat conductive substrate, each optoelectronic semiconductor component has at least one electrode, and the target substrate has a plurality of conductive portions; an align-press step: aligning and attaching at least one optoelectronic semiconductor stamp to the target substrate, so that the electrodes are pressed on the corresponding conductive portions; and a bonding step: electrically connecting the electrodes to the corresponding conductive portions.

In an embodiment a component composite includes an auxiliary carrier, a plurality of components, a retaining structure and an electrically conductive sacrificial layer, wherein each of the components has a connection layer which faces the sacrificial layer and is electrically conductively connected to the sacrificial layer, wherein the sacrificial layer is arranged in vertical direction between the auxiliary carrier and the components, and wherein the sacrificial layer is to be removable and the components are mechanically connected to the auxiliary carrier only via the retaining structure in addition to the sacrificial layer.

A method of transferring a plurality of micro LEDs formed on a substrate including transferring the micro LEDs onto a first carrier substrate having a first adhesive material layer, reducing an adhesiveness of the first adhesive material layer by curing the first adhesive material layer, transferring the micro LEDs from the first carrier substrate onto a second carrier substrate having a second adhesive material layer, bonding at least a portion of the micro LEDs on the second carrier substrate to pads of a circuit board using a metal bonding layer, and separating the second carrier substrate from the micro LEDs bonded onto the circuit board.