A piezoelectric vibrator that includes a piezoelectric resonator, a substrate having opposite first and second principal surfaces, and an electrically conductive holding member holding the piezoelectric resonator on the first principal surface of the substrate such that the piezoelectric resonator is able to be excited. The electrically conductive holding member contains a first filler containing an electrically conductive material as a main component and a second filler containing an electrically insulating material as a main component and having a smaller Young's modulus than the first filler. In a plan view in a direction normal to the first principal surface of the substrate, the second filler is more densely disposed in an outer peripheral region of the electrically conductive holding member than in a central region of the electrically conductive holding member.

A piezoelectric vibrator that includes a piezoelectric resonator, a substrate having opposite first and second principal surfaces, and an electrically conductive holding member holding the piezoelectric resonator on the first principal surface of the substrate such that the piezoelectric resonator is able to be excited. The electrically conductive holding member contains a first filler containing an electrically conductive material as a main component and a second filler containing an electrically insulating material as a main component and having a smaller Young's modulus than the first filler. In a plan view in a direction normal to the first principal surface of the substrate, the second filler is more densely disposed in an outer peripheral region of the electrically conductive holding member than in a central region of the electrically conductive holding member.

A MEMS device is disclosed. In an embodiment a MEMS device includes a substrate having an active region and at least one integrated electrical and mechanical connection element configured to electrically and mechanically mount the MEMS device to a carrier, wherein the connection element comprises a stress-reducing structure.

A MEMS device is disclosed. In an embodiment a MEMS device includes a substrate having an active region and at least one integrated electrical and mechanical connection element configured to electrically and mechanically mount the MEMS device to a carrier, wherein the connection element comprises a stress-reducing structure.

Provided herein is a solder paste having low viscosity and easy coatability, and that provides high reinforcement for electronic components while satisfying both high room-temperature adhesion and high repairability, and forming a cured product of excellent properties, for example, high insulation against humidity. Amount structure including an electronic component mounted with the solder paste is also provided. The solder paste contains a solder powder and a flux. The flux contains an epoxy resin, a reactive diluent, a curing agent, an organic acid, and a rubber modified epoxy resin. The reactive diluent contains a compound having two or more epoxy groups, and has a viscosity of 150 mPa.Math.s or more and 700 mPa.Math.s or less. The reactive diluent has a total chlorine content of 0.5 weight % or less, and is contained in a proportion of 5 weight % or more and 45 weight % or less with respect to a total weight of the flux.

A piezoelectric vibrator that includes a piezoelectric resonator, a substrate having opposite first and second principal surfaces, and an electrically conductive holding member holding the piezoelectric resonator on the first principal surface of the substrate such that the piezoelectric resonator is able to be excited. The electrically conductive holding member contains a first filler containing an electrically conductive material as a main component and a second filler containing an electrically insulating material as a main component and having a smaller Young's modulus than the first filler. In a plan view in a direction normal to the first principal surface of the substrate, the second filler is more densely disposed in an outer peripheral region of the electrically conductive holding member than in a central region of the electrically conductive holding member.

A piezoelectric vibrator that includes a piezoelectric resonator, a substrate having opposite first and second principal surfaces, and an electrically conductive holding member holding the piezoelectric resonator on the first principal surface of the substrate such that the piezoelectric resonator is able to be excited. The electrically conductive holding member contains a first filler containing an electrically conductive material as a main component and a second filler containing an electrically insulating material as a main component and having a smaller Young's modulus than the first filler. In a plan view in a direction normal to the first principal surface of the substrate, the second filler is more densely disposed in an outer peripheral region of the electrically conductive holding member than in a central region of the electrically conductive holding member.