Patent classifications
H
ELECTRICITY
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H01
ELECTRIC ELEMENTS
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H01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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H01L2224/01
Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
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H01L2224/42
Wire connectors; Manufacturing methods related thereto
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H01L2224/44
Structure, shape, material or disposition of the wire connectors prior to the connecting process
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H01L2224/45
of an individual wire connector
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H01L2224/456
with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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H01L2224/45663
the principal constituent melting at a temperature of greater than 1550°C
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H01L2224/45679
Niobium (Nb) as principal constituent
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H01L2224/45679

AI WIRING MATERIAL
20240105668 · 2024-03-28 ·

There is provided a novel Al wiring material that achieves both of a suppression of chip damage and a thermal shock resistance. In aspect 1, the Al wiring material includes an Al core material and an Al coating layer formed on a surface of the Al core material, and satisfies 1.2?H.sub.1h/H.sub.1s where H.sub.1h is a Vickers hardness of the Al core material (Hv) and H.sub.1s is a Vickers hardness of the Al coating layer (Hv). In aspect 2, the Al wiring material includes an Al core material and an Al coating layer formed on a surface of the Al core material, and satisfies 1.2?H.sub.2h/H.sub.2s where H.sub.2s is a Vickers hardness of the Al core material (Hv) and H.sub.2h is a Vickers hardness of the Al coating layer (Hv).