A semiconductor device includes a base having a first surface on which the semiconductor element is mounted and a second surface opposite to the first surface, a first edge portion having a step from the first surface toward the second surface in a first region of a peripheral edge of the base, a first terminal that is arranged at a position facing the first edge portion when viewed from a thickness direction of the base, a conductive member for electrically connecting the semiconductor element and the first terminal to each other, and a resin material for sealing a part of the base, the semiconductor element, and a part of the first terminal.

An electronic package, a semiconductor package structure and a method for manufacturing the same are provided. The electronic package includes a carrier, a first electronic component, an electrical extension structure, and an encapsulant. The carrier has a first face and a second face opposite to the first face. The first electronic component is adjacent to the first face of the carrier. The electrical extension structure is adjacent to the first face of the carrier and defines a space with the carrier for accommodating the first electronic component, the electrical extension structure is configured to connect the carrier with an external electronic component. The encapsulant encapsulates the first electronic component and at least a portion of the electrical extension structure.

A light-emitting substrate, a method of manufacturing a light-emitting substrate, and a display device are provided. The light-emitting substrate includes: a first substrate, wherein the first substrate includes a first base substrate, a light-emitting diode arranged on the first base substrate, and a first conductive pad arranged on the first base substrate; a second substrate arranged opposite to the first substrate, wherein the second substrate includes a second base substrate, and a second conductive pad arranged on the second base substrate; and a bonding wire structure including a bonding wire, wherein the first conductive pad is located on a surface of the first substrate away from the second substrate, the second conductive pad is located on a surface of the second substrate away from the first substrate, and the bonding wire is configured to electrically connect the first conductive pad and the second conductive pad.

[Problem] An object of the present invention is to miniaturize and integrate plural power semiconductors in an electronic circuit in a low cost without occurrence of a problem of a heat dissipation or the like.

[Means for solving the problem] The present invention is a power semiconductor module that comprises plural arrangements of power semiconductor elements comprising a power semiconductor bare chip which one electrode portion thereof is connected to a metal plate which at least one external connecting terminal is formed and other external connecting terminals which are electrically connected to other electrode portions of the power semiconductor bare chip, and that are contained in a same package, comprises wherein the power semiconductor elements are basically same outline, electrodes of the bare chip of the power semiconductor elements are mutually connected between the power semiconductor elements with a metal connector or a wiring, and the package is a resin mold package that seals the power semiconductor elements with an electrical insulating resin.

An electronic package, a semiconductor package structure and a method for manufacturing the same are provided. The electronic package includes a carrier, a first electronic component, an electrical extension structure, and an encapsulant. The carrier has a first face and a second face opposite to the first face. The first electronic component is adjacent to the first face of the carrier. The electrical extension structure is adjacent to the first face of the carrier and defines a space with the carrier for accommodating the first electronic component, the electrical extension structure is configured to connect the carrier with an external electronic component. The encapsulant encapsulates the first electronic component and at least a portion of the electrical extension structure.

A light-emitting substrate, a method of manufacturing a light-emitting substrate, and a display device are provided. The light-emitting substrate includes: a first substrate, wherein the first substrate includes a first base substrate, a light-emitting diode arranged on the first base substrate, and a first conductive pad arranged on the first base substrate; a second substrate arranged opposite to the first substrate, wherein the second substrate includes a second base substrate, and a second conductive pad arranged on the second base substrate; and a bonding wire structure including a bonding wire, wherein the first conductive pad is located on a surface of the first substrate away from the second substrate, the second conductive pad is located on a surface of the second substrate away from the first substrate, and the bonding wire is configured to electrically connect the first conductive pad and the second conductive pad.

An electronic device that includes a substrate and a die disposed on the substrate, the die having an active surface. Wire bonds are attached from the active surface of the die to the substrate. A radiation barrier is attached to the substrate and disposed over the die. The radiation barrier is configured to mitigate electromagnetic radiation exposure to the die. A mold compound is formed over the die, the wire bonds, and the radiation barrier.

A power semiconductor module that comprises plural arrangements of power semiconductor elements comprising a power semiconductor bare chip which one electrode portion thereof is connected to a metal plate which at least one external connecting terminal is formed and other external connecting terminals which are electrically connected to other electrode portions of the power semiconductor bare chip, and that are contained in a same package, comprises wherein the power semiconductor elements are basically same outline, electrodes of the bare chip of the power semiconductor elements are mutually connected between the power semiconductor elements with a metal connector or a wiring, and the package is a resin mold package that seals the power semiconductor elements with an electrical insulating resin.

A light-emitting substrate is provided, including first and second substrates opposite to each other, and a bonding wire structure including a bonding wire. The first substrate includes: a first base substrate and a first conductive pad. The second substrate includes a second base substrate and a second conductive pad. The first conductive pad is on a surface of the first substrate away from the second substrate, the second conductive pad is on a surface of the second substrate away from the first substrate. The bonding wire is soldered to the first conductive pad at a first solder joint and to the second conductive pad at a second solder joint. The bonding wire includes, at each of the first solder joint and the second solder joint, a portion having an angle with a plane where the first base substrate is located and/or having a curved arc.

In a semiconductor module that includes four semiconductor chips Q1 to Q4, four wiring patterns, first and second power source terminals and first and second intermediate point terminals thus forming a bridge circuit in the semiconductor. The bridge circuit is formed where the chip Q1 and the chip Q3 are disposed on a high side and the chip Q2 and the chip Q4 are disposed on a low side. In a recessed portion that is formed in the wiring pattern, a wiring pattern on which a protruding portion having a first oblique side and a second oblique side is formed is disposed. Oblique sides parallel to the first oblique side and the second oblique side are formed on wiring patterns. The chips Q2, Q4 are obliquely arranged along the respective oblique sides. The wiring pattern functions as a current path from the intermediate point terminals to the power source terminal.