Patent classifications
H
ELECTRICITY
Load children
H01
ELECTRIC ELEMENTS
Load children
H01L
SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
Load children
2224/00
Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
Load children Filter patents View analytics View as hierarchy Open in page
H01L2224/01
Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
Load children Filter patents View analytics View as hierarchy Open in page
H01L2224/42
Wire connectors; Manufacturing methods related thereto
Load children Filter patents View analytics View as hierarchy Open in page
H01L2224/47
Structure, shape, material or disposition of the wire connectors after the connecting process
Load children Filter patents View analytics View as hierarchy Open in page
H01L2224/48
of an individual wire connector
Load children Filter patents View analytics View as hierarchy Open in page
H01L2224/48475
connected to auxiliary connecting means on the bonding areas, e.g. pre-ball, wedge-on-ball, ball-on-ball
Load children Filter patents View analytics View as hierarchy Open in page
H01L2224/48476
between the wire connector and the bonding area
Load children Filter patents View analytics View as hierarchy Open in page
H01L2224/48477
being a pre-ball (i.e. a ball formed by capillary bonding)
Load children Filter patents View analytics View as hierarchy Open in page
H01L2224/48484
being a plurality of pre-balls disposed side-to-side
Load children Filter patents View analytics View as hierarchy Open in page
H01L2224/48485
the connecting portion being a wedge bond, i.e. wedge on pre-ball
Load children Filter patents View analytics View as hierarchy Open in page

H01L2224/48485

BUMP-FORMING DEVICE, BUMP-FORMING METHOD, AND NON-TRANSITORY COMPUTER-READABLE MEDIUM
20240055388 · 2024-02-15 · ·

A bump-forming device (1) includes a bonding tool (15) and a bonding controller (10). The bonding controller is configured to execute a crimping step (S14), a delivery step (S15), a pressing step (S16), and a cutting step (S17), and of the trajectories of the bonding tool (15), at least the trajectory in the delivery step (S15) is determined on the basis of a first parameter relating to a wire (w) and a second parameter relating to the shape of the bonding tool (15).