A method for fabricating a semiconductor device includes providing a semiconductor die, arranging an electrical connector over the semiconductor die, the electrical connector including a conductive core, an absorbing feature arranged on a first side of the conductive core, and a solder layer arranged on a second side of the conductive core, opposite the first side and facing the semiconductor die, and soldering the electrical connector onto the semiconductor die by heating the solder layer with a laser, wherein the laser irradiates the absorbing feature and absorbed energy is transferred from the absorbing feature through the conductive core to the solder layer.

A bonding arrangement comprising a bonding tool, having a tool shank which is designed to extend in a longitudinal direction of the tool, and a tool tip which connects to the tool shank. A first end side of the bonding tool is provided on the tool tip, which is designed to come into contact with a connection part. A second end side of the bonding tool is provided on the tool shank. The bonding tool has a casing surface connecting the first end side and the second end side, said bonding arrangement comprising a laser generator for providing a laser beam and comprising a light guide designed to guide the laser beam to the bonding tool. A functional recess is formed on the bonding tool on the casing side and the light guide is associated with the bonding too on the casing side from the outside and at a distance.

A device for heating and determining the actual temperature of a bonding tool of an ultrasonic bonder, comprising the bending tool, which has a first end face, a second end face, a lateral surface, which connects the first end face to the second end face, and an absorption region, comprising a temperature measuring unit for determining an actual temperature of the bonding tool at a temperature measuring point, which is provided on the lateral surface of the bonding tool and preferably at a tip of the bonding tool, and comprising a laser generator, a laser beam being provided with the aid of the laser generator, and the laser beam striking the bonding tool in the absorption region, and the bonding tool being heated as a result of the absorption of the laser beam.

An apparatus for detecting the temperature of a bonding tool during laser-assisted ultrasonic bonding, comprising an automatic bonding machine having the bonding tool, having a displacement and/or positioning module for the bonding tool and having a device for exciting the bonding tool to ultrasonically vibrate, comprising a laser generator for providing a laser beam, and comprising an optical waveguide for guiding the laser beam from the laser generator to the bonding tool, wherein the optical waveguide has a multi-part design, that a deflecting and beam-splitting unit is provided between at least two adjacent parts of the optical waveguide and that furthermore a temperature sensor is provided.

A method and a device for establishing a wire connection between a first contact surface and at least one further contact surface. A contact end of a wire is positioned in a contact position relative to the first contact surface with a wire guiding tool. Subsequently, a mechanical, electrically conductive connection is established between the first contact surface and the contact end with a first solder material connection, and subsequently the wire guiding tool is moved to the further contact surface thus forming a wire section and establishing a further mechanical, electrically conductive connection between the wire section end and the further contact surface with a further solder material connection.

The invention relates to a bonding arrangement comprising a bonding tool including a tool shank, which is designed as elongated in a tool longitudinal direction, and including a tool tip, which adjoins the tool shank, and comprising a light guide designed to conduct a laser beam, the light guide being provided in a longitudinal recess of the bonding tool, the longitudinal recess extending from an end face of the bonding tool opposite the tool tip in the direction of the tool tip, a functional recess being formed on the lateral surface of the bonding tool, and the longitudinal recess being made to extend up to the functional recess. The invention further relates to a bonding tool having a functional application as well as the use of the bonding arrangement according to the invention and/or the bonding tool for ultrasonic bonding.

A production method for a bonding tool with a body that has an elongated tool shank of the bonding tool and a tool tip adjoining the tool shank, and with a blind hole that is provided in the region of an elongated tool shank of the bonding tool and that is carried into the region of a tool tip, wherein a contact surface of the bonding tool is provided on the tool tip, comprising the following production steps: first a through opening is produced that is carried through the tool shank to the tool tip; then the through opening is closed in the region of the tool tip by a terminating element inserted into the body.

A curtain airbag device mounting structure includes: a first pillar forming a part of a front pillar and extends substantially along a vehicle height direction; a second pillar forming another part of the front pillar, the second pillar being disposed on a rear side of a vehicle relative to the first pillar at a predetermined distance from the first pillar and extending substantially along the vehicle height direction; a transparent member bridged between the first pillar and the second pillar; and a curtain airbag device including a curtain airbag stored along a roof side rail and the second pillar, the curtain airbag being configured to inflate and deploy in a curtain-like fashion over a side portion of a cabin of the vehicle in case of a collision of the vehicle.

A method and a device for establishing a wire connection between a first contact surface and at least one further contact surface. A contact end of a wire is positioned in a contact position relative to the first contact surface with a wire guiding tool. Subsequently, a mechanical, electrically conductive connection is established between the first contact surface and the contact end with a first solder material connection, and subsequently the wire guiding tool is moved to the further contact surface thus forming a wire section and establishing a further mechanical, electrically conductive connection between the wire section end and the further contact surface with a further solder material connection.

A method for fabricating a semiconductor device includes providing a semiconductor die, arranging an electrical connector over the semiconductor die, the electrical connector including a conductive core, an absorbing feature arranged on a first side of the conductive core, and a solder layer arranged on a second side of the conductive core, opposite the first side and facing the semiconductor die, and soldering the electrical connector onto the semiconductor die by heating the solder layer with a laser, wherein the laser irradiates the absorbing feature and absorbed energy is transferred from the absorbing feature through the conductive core to the solder layer.