H01L27/0274

Device including integrated electrostatic discharge protection component

A device includes standard cells in a layout of an integrated circuit, the standard cells includes first and second standard cells sharing a first active region and a second active region. The first standard cell includes first and second gates. The first gate includes a first gate finger and a second gate finger that are arranged over the first active region, for forming the first transistor and the second transistor. The second gate is separate from the first gate, the second gate includes a third gate finger and a fourth gate finger that are arranged over the second active region, for forming the third transistor and the fourth transistor. The second standard cell includes a third gate arranged over the first active region and the second active region, for forming the fifth transistor and the sixth transistor. The first to fourth transistors operate as an electrostatic discharge protection circuit.

Low-voltage electrostatic discharge (ESD) protection circuit, integrated circuit and method for ESD protection thereof

An electrostatic discharge protection circuit for an integrated circuit and a method for electrostatic discharge protection thereof are disclosed. The integrated circuit includes a power source, a ground, a signal input, and a signal output. The integrated circuit further comprises one or more essentially identically configured electrostatic discharge protection circuits, configured to provide electrostatic discharge protection between any two of the power source, the ground, the signal input, and the signal output. A method of providing electrostatic discharge protection includes providing one or more essentially identically configured electrostatic discharge protection circuits coupled between and providing electrostatic discharge protection for any two of the power source, the ground, the signal input, and the signal output. The disclosed integrated circuit and method provide advantages of simplifying the integrated circuit design and reducing design time.

ELECTRONIC DEVICE
20230238379 · 2023-07-27 · ·

Abstract of Disclosure An electronic device includes a diode, a driving circuit, a first signal line, a second signal line, a first electrostatic protection circuit and a second electrostatic protection circuit. The diode has a first end and a second end. The first signal line is coupled between the first end and the driving circuit. The second signal line is coupled between the second end and the driving circuit. The first electrostatic protection circuit is coupled to the first signal line. The second electrostatic protection circuit is coupled to the second signal line.

Fin Field-Effect Transistor, ESD Protection Circuit, Filter Circuit, and Electronic Device
20230230974 · 2023-07-20 ·

A FinFET includes at least two fins arranged in parallel, a plurality of valid gates, and a first dummy polycrystalline silicon. The at least two fins extend in a first direction, and the plurality of valid gates and the first dummy polycrystalline silicon extend in a second direction and cover surfaces of the at least two fins. The first dummy polycrystalline silicon is located on one side of the plurality of valid gates, and fins on both sides of each of the plurality of valid gates are respectively a source terminal and a drain terminal of the FinFET. The plurality of valid gates is coupled to a gate terminal of the FinFET. The first dummy polycrystalline silicon is coupled between the gate terminal of the FinFET and a resistor potential terminal.

NITRIDE-BASED BIDIRECTIONAL SWITCHING DEVICE FOR BATTERY MANAGEMENT AND METHOD FOR MANUFACTURING THE SAME
20230231399 · 2023-07-20 ·

A nitride-based bidirectional switching device is provided for working with a battery protection controller having a power input terminal, a discharge over-current protection (DO) terminal, a charge over-current protection (CO) terminal, a voltage monitoring (VM) terminal and a ground terminal. The nitride-based bidirectional switching device comprises a nitride-based bidirectional switching element and an adaption module configured for receiving a DO signal and a CO signal from the battery protection controller and generating a main control signal for controlling the bidirectional switching element. By implementing the adaption circuit, the nitride-based bidirectional switching element can work with conventional battery protection controller for battery charging and discharging management. Therefore, a nitride-based battery management system can be realized with higher operation frequency as well as a more compact size.

Integrated circuit and method of manufacturing same

A Schmitt trigger circuit includes a first and second set of transistors, a first and second feedback transistor, and a first and second circuit. The first set of transistors is connected between a first voltage supply and an output node. The first voltage supply has a first voltage. The second set of transistors is connected between the output node and a second voltage supply. The second voltage supply has a second voltage. The first feedback transistor is connected to the output node, a first node and a second node. The second feedback transistor is connected to the output node, a third node and a fourth node. The first circuit is coupled to and configured to supply the second supply voltage to the second node. The second circuit is coupled to and configured to supply the first supply voltage to the fourth node.

Memory device including alignment layer and semiconductor process method thereof

A memory device includes a well, a first gate layer, a second gate layer, a doped region, a blocking layer and an alignment layer. The first gate layer is formed on the well. The second gate layer is formed on the well. The doped region is formed within the well and located between the first gate layer and the second gate layer. The blocking layer is formed to cover the first gate layer, the first doped region and a part of the second gate layer and used to block electrons from excessively escaping. The alignment layer is formed on the blocking layer and above the first gate layer, the doped region and the part of the second gate layer. The alignment layer is thinner than the blocking layer, and the alignment layer is thinner than the first gate layer and the second gate layer.

Latch-up immunization techniques for integrated circuits

In an integrated circuit supporting complementary metal oxide semiconductor (CMOS) integrated circuits, latch-up immunity is supported by surrounding a hot n-well with an n-well strap spaced from the hot n-well by a specified distance in accordance with design rules. The n-well strap is positioned between the hot n-well and other n-well or n-type diffusion structures.

INTEGRATED CIRCUIT AND METHOD OF MANUFACTURING SAME
20230089792 · 2023-03-23 ·

A Schmitt trigger circuit includes a first and second set of transistors, a first and second feedback transistor, and a first and second circuit. The first set of transistors is connected between a first voltage supply and an output node. The first voltage supply has a first voltage. The second set of transistors is connected between the output node and a second voltage supply. The second voltage supply has a second voltage. The first feedback transistor is connected to the output node, a first node and a second node. The second feedback transistor is connected to the output node, a third node and a fourth node. The first circuit is coupled to and configured to supply the second supply voltage to the second node. The second circuit is coupled to and configured to supply the first supply voltage to the fourth node.

Systems and methods for protecting a semiconductor device

Circuits and methods for protecting a device are provided. A first device to be protected includes a gate dielectric of a first thickness. A second device includes a gate dielectric of a second thickness that is less than the first thickness. A gate is shared by the first device and the second device.