Patent classifications
H01L27/14672
Imaging element, stacked imaging element, and solid-state imaging apparatus
An imaging element includes a photoelectric conversion unit including a first electrode 11, a photoelectric conversion layer 13, and a second electrode 12 that are stacked, in which the photoelectric conversion unit further includes a charge storage electrode 14 arranged apart from the first electrode 11 and arranged to face the photoelectric conversion layer 13 through an insulating layer 82, and when photoelectric conversion occurs in the photoelectric conversion layer 13 after light enters the photoelectric conversion layer 13, an absolute value of a potential applied to a part 13.sub.C of the photoelectric conversion layer 13 facing the charge storage electrode 14 is a value larger than an absolute value of a potential applied to a region 13.sub.B of the photoelectric conversion layer 13 positioned between the imaging element and an adjacent imaging element.
Photodetector adapted to provide additional color information
An apparatus for forming a color image of a scene and a method for utilizing that apparatus are disclosed. The apparatus includes a plurality of pixel sensors. Each pixel sensor includes a first photodetector includes first main photodiode and a first floating diffusion node. The first main photodiode is characterized by a first light conversion efficiency as a function of wavelength of a light signal incident thereon. The first floating diffusion node includes a parasitic photodiode characterized by a second light conversion efficiency as a function of the wavelength. The second light conversion efficiency is different from the first light conversion efficiency as a function of wavelength. A controller generates an intensity of light in each of a plurality of wavelength bands for the pixel sensor utilizing a measurement of the light signal by each of the first main photodiode and the first parasitic photodiode in that photodetector.
Imaging system, pixel array of imaging system and image sensor
An image sensor including a pixel array which includes pixels for sensing a reflected signal, incident on the pixel array to form reflected light spots separated from each other. Each pixel includes a photodetector and a readout circuit. The photodetector is configured to detect the reflected signal and output a photo response signal. The readout circuit is configured to generate a pixel output according to the photo response signal. The pixels include a first pixel and a second pixel adjacent to the first pixel along a first predetermined direction. The readout circuit of the first pixel is adjacent to the photodetector of the second pixel along the first predetermined direction, and adjacent to the photodetector of the first pixel along a second predetermined direction perpendicular to the first predetermined direction. The pixel array has a small pixel pitch and a high fill factor.
IMAGING ELEMENT, STACKED IMAGING ELEMENT, AND SOLID-STATE IMAGING APPARATUS
An imaging element includes a photoelectric conversion unit including a first electrode 11, a photoelectric conversion layer 13, and a second electrode 12 that are stacked, in which the photoelectric conversion unit further includes a charge storage electrode 14 arranged apart from the first electrode 11 and arranged to face the photoelectric conversion layer 13 through an insulating layer 82, and when photoelectric conversion occurs in the photoelectric conversion layer 13 after light enters the photoelectric conversion layer 13, an absolute value of a potential applied to a part 13.sub.C of the photoelectric conversion layer 13 facing the charge storage electrode 14 is a value larger than an absolute value of a potential applied to a region 13.sub.B of the photoelectric conversion layer 13 positioned between the imaging element and an adjacent imaging element.
PHOTODETECTOR ADAPTED TO PROVIDE ADDITIONAL COLOR INFORMATION
An apparatus for forming a color image of a scene and a method for utilizing that apparatus are disclosed. The apparatus includes a plurality of pixel sensors. Each pixel sensor includes a first photodetector includes first main photodiode and a first floating diffusion node. The first main photodiode is characterized by a first light conversion efficiency as a function of wavelength of a light signal incident thereon. The first floating diffusion node includes a parasitic photodiode characterized by a second light conversion efficiency as a function of the wavelength. The second light conversion efficiency is different from the first light conversion efficiency as a function of wavelength. A controller generates an intensity of light in each of a plurality of wavelength bands for the pixel sensor utilizing a measurement of the light signal by each of the first main photodiode and the first parasitic photodiode in that photodetector.
IMAGING PIXELS HAVING PROGRAMMABLE DYNAMIC RANGE
An image sensor may include one or more pixels having a charge overflow structure for increased dynamic range. A charge overflow structure adjacent to the photodiode may form a potential barrier. When the amount of charge in the photodiode exceeds the potential barrier, the charge may overflow from the photodiode. The overflow charge may be disposed of when a transistor is asserted and funnels the charge to a power supply voltage. The overflow charge may be stored in a storage capacitor when the transistor is deasserted. Control circuitry may cycle the transistor between an asserted state and a deasserted state during the integration time of the imaging pixel. The known percentage of time that the overflow charge is disposed of may be used to extrapolate how much overflow charge was generated, thus increasing the dynamic range of the pixel.
EMBEDDED LIGHT SHIELD STRUCTURE FOR CMOS IMAGE SENSOR
In some embodiments, an image sensor is provided. The image sensor comprises a first photodetector disposed within a front-side surface of a semiconductor substrate. A trench isolation structure is disposed over a back-side surface of the semiconductor substrate. The trench isolation structure includes a buffer layer and a dielectric liner. The buffer layer covers the back-side surface of the semiconductor substrate and fills trenches that extend downward into the back-side surface of the semiconductor substrate. The dielectric liner is disposed between the buffer layer and the semiconductor substrate. A composite grid structure has composite grid segments that are aligned over the trenches, respectively. The buffer layer separates the dielectric liner from the composite grid structure. A light shield structure is disposed within the buffer layer and directly overlies the first photodetector.
Multi-photodiode pixel cell
In one example, an apparatus comprises: a semiconductor substrate including a front side surface, a first photodiode to generate a first charge, a second photodiode to generate a second charge, a barrier layer between the first photodiode and the second photodiode and configured to control flow of the second charge from the second photodiode to the first photodiode, and a drain region to store the first charge and at least a first part of the second charge. The apparatus further comprises a gate on the front side surface over a first channel region between the first photodiode and the drain region to control the flow of the first charge and the at least the first part of the second charge to the drain region, and a second channel region to conduct at least a second part of the second charge away from the barrier layer when the second photodiode saturates.
IMAGING SYSTEM, PIXEL ARRAY OF IMAGING SYSTEM AND IMAGE SENSOR
An image sensor including a pixel array which includes pixels for sensing a reflected signal, incident on the pixel array to form reflected light spots separated from each other. Each pixel includes a photodetector and a readout circuit. The photodetector is configured to detect the reflected signal and output a photo response signal. The readout circuit is configured to generate a pixel output according to the photo response signal. The pixels include a first pixel and a second pixel adjacent to the first pixel along a first predetermined direction. The readout circuit of the first pixel is adjacent to the photodetector of the second pixel along the first predetermined direction, and adjacent to the photodetector of the first pixel along a second predetermined direction perpendicular to the first predetermined direction. The pixel array has a small pixel pitch and a high fill factor.
Image sensors comprising an organic photo-detector, a photo-detector array and dual floating diffusion nodes and electronic devices including the same
An image sensor may include an organic photo-detector configured to selectively detect a near infrared wavelength spectrum of light and photoelectrically convert the detected near infrared wavelength spectrum of light, and a photo-detector array on the organic photo-detector, the photo-detector array including a photo-detector configured to detect a limited wavelength spectrum of visible light and photoelectrically convert the limited wavelength spectrum of visible light. The image sensor may discharge charges photoelectrically converted by the photo-detector to a first floating diffusion node, and the image sensor may discharge charges photoelectrically converted by the organic photo-detector to a second floating diffusion node. An area of the first floating diffusion node may be greater than an area of the second floating diffusion node.