A semiconductor package can include a semiconductor chip on a substrate inside the semiconductor package and an electrode pad spaced apart from the semiconductor chip on the substrate inside the semiconductor package. A wire can be inside the semiconductor package, to connect the electrode pad to the semiconductor chip and a barrier member can be on the substrate fencing-in the semiconductor chip, where the electrode pad and the wire can be in an interior portion of the substrate. A sealing material can be in the interior portion of the substrate fenced-in by the barrier member, where the sealing material covering the semiconductor chip, the electrode pad, and the wire.

A quantum device includes a quantum chip and a holder. The holder includes a pedestal, a recess portion formed in a main surface of the pedestal so as to be opposed to the quantum chip, and a suction tube provided such that in the recess portion, a suction opening is positioned in a bottom surface of the quantum chip.

A flexible semiconductor device includes a first tape having bonding pads and conductive traces formed. A semiconductor die having a bottom surface is attached to the first tape and electrically connected to the bond pads by way of electrical contacts. A second tape is attached to a top surface of the semiconductor die. The first and second tapes encapsulate the semiconductor die, the electrical contacts, and at least a part of the conductive traces.

The invention provides methods and devices for fabricating printable semiconductor elements and assembling printable semiconductor elements onto substrate surfaces. Methods, devices and device components of the present invention are capable of generating a wide range of flexible electronic and optoelectronic devices and arrays of devices on substrates comprising polymeric materials. The present invention also provides stretchable semiconductor structures and stretchable electronic devices capable of good performance in stretched configurations.

A semiconductor package structure includes a substrate. The substrate includes a first ground layer. The first ground layer has a body and a first tooth protruding from a side of the body. The first tooth has a first lateral side. The first lateral side of the first tooth is inclined relative to the side of the body in a top view of the first ground layer.

An electronic element mounting substrate includes a substrate including, on a first upper surface, a mounting region in which an electronic element is mounted, a frame body located on the first upper surface of the substrate and surrounding the mounting region, a channel extending through the frame body outward from an inner wall of the frame body, and an electrode pad located on the first upper surface of the substrate or an inner surface of the frame body. The channel is located above or below the electrode pad.

The present invention is intended to provide a semiconductor module and a semiconductor device that are compatible with various rated currents. A semiconductor module includes a lead frame, and a semiconductor element joined with the lead frame. The lead frame includes a first joining structure and a second joining structure. The first joining structure includes a void part as a part at which the lead frame does not exist, and the second joining structure includes a void part as a part at which the lead frame does not exist. Each of the first joining structure and the second joining structure has a shape such that one of the first joining structure and the second joining structure complements at least part of the void part of the other assuming that the first joining structure and the second joining structure are overlapped.

The semiconductor device includes first and second semiconductor elements. Each element has an obverse surface and a reverse surface, with a first electrode arranged on the reverse surface, and with a second electrode arranged on the obverse surface. The semiconductor device further includes: a first lead having an obverse surface and a reverse surface; an insulating layer covering the first lead, the first semiconductor element and the second semiconductor element; a first electrode connected to the second electrode of the first semiconductor element; and a second electrode connected to the first lead. The first semiconductor element and the first lead are bonded to each other with the reverse surface of the first semiconductor element facing the lead obverse surface. The second semiconductor element and the first lead are bonded to each other with the reverse surface of the second semiconductor element facing the lead reverse surface.

A wiring substrate includes: a plurality of wiring layers; and a plurality of insulating layers. The wiring substrate includes: a mounting region on which an electronic component is to be mounted; and a non-mounting region on which no electronic component is to be mounted and which is configured to be bent in a first direction. At least one of the wiring layers comprises a shield pattern. The shield pattern disposed in the non-mounting region is defined by a plurality of through holes arranged at predetermined intervals. Each of the through holes has a bent portion bent in plan view.

The power on wafer assembly can include: a compliant connector, an integrated circuit, a printed circuit board (PCB), a power component, and a set of compliant connectors. The power on wafer assembly can optionally include: a compression element, a cooling system, a set of mechanical clamping components, and a power source. However, the power on wafer assembly can additionally or alternately include any other suitable components.