The present disclosure provides an electronic package. The electronic package includes a substrate, a first electronic component, an encapsulant, and a shielding layer. The substrate has a first upper surface, a second upper surface, and a first lateral surface extending between the first upper surface and the second upper surface. The first electronic component is disposed on the substrate. The encapsulant coves the first electronic component and the first lateral surface of the substrate. The shielding layer covers the encapsulant. The shielding layer is spaced apart from the first lateral surface of the substrate.

The solar cell includes a plurality of light-receiving-side finger electrodes on a light-receiving surface of a photoelectric conversion section having a semiconductor junction. The light-receiving surface of the photoelectric conversion section is covered with a first insulating layer. Each light-receiving-side finger electrodes include: a first metal seed layer provided between the photoelectric conversion section and the first insulating layer; and a first plating metal layer being conduction with the first metal seed layer through openings formed in the first insulating layer. The solar cell includes an isolated plating metal layer pieces contacting neither the light-receiving-side finger electrodes nor the back-side finger electrodes. On the surface of the first insulating layer, an isolated plating metal crowded region is present in a form of a band-shape extending parallel to an extending direction of the light-receiving-side finger electrodes.

An optical sensor includes a substrate having a plurality of first light receiving elements in a surface, and a light blocking film having a plurality of first openings. The first light receiving elements are provided such that a direction of travel of incident light defined by each of the first openings is different from a thickness direction of the substrate and form at least one light receiving element set in which an angle of incidence defined between the direction of travel of the incident light and the thickness direction is the same with respect to the light receiving elements. In a view projected in the thickness direction, a positional relationship between the first light receiving elements included in a light receiving element set and the corresponding first openings has rotational symmetry of order 3 or more about an axis along the thickness direction.

A sensing device includes a substrate, two chips, and a shielding structure. The two chips are respectively defined as an emitting chip and a receiving chip. The emitting chip can emit a sensing light beam, the receiving chip can receive the sensing light beam, and the two chips are fixed in position on the substrate at intervals. At least one of the chips is electrically connected to the substrate through at least one wire, and a position where the wire is connected to the substrate is located between the two chips. The shielding structure is formed on the substrate. The shielding structure is located between the two chips, and the shielding structure covers the wire and a portion of the chip connected to the wire. Compared with the conventional photo-plethysmography sensor, the sensing device has the advantage of a smaller size.

The present invention provides a normal-incident photodiode structure with a dark current self-compensation function, including a photosensitive photodiode and a compensating photodiode, where a photosensitive surface of the compensating photodiode is provided with a light-blocking layer, and dark currents of the photosensitive photodiode and the compensating photodiode are equal. According to the present invention, the dark current self-compensation function may be implemented at a chip level without an external circuit and an operational amplifier; the normal-incident photodiode structure according to the present invention has the photosensitive photodiode and the compensating photodiode, and the compensating photodiode may counteract the dark current of the photosensitive photodiode during operation, thus reducing noise caused by the dark current of the photosensitive photodiode; and bias voltages of the photosensitive photodiode and the compensating photodiode according to the present invention are controlled separately, and thus may be applied to more usage scenarios.

The present embodiments provide a transparent electrode having a laminate structure of: a metal oxide layer having an amorphous structure and electroconductivity, and a metal nanowire layer; and further comprising an auxiliary metal wiring. The auxiliary metal wiring covers a part of the metal nanowire layer or of the metal oxide layer, and is connected to the metal nanowire layer.

A shielding element comprises a rigid substrate and at least one electrically conductive two-dimensional structure which is placed on one of the faces of the substrate. The substrate and the electrically conductive two-dimensional structure are such that the shielding element has optical-transmission and shielding-efficiency values at least one of which varies between two zones of the shielding element. Such a shielding element enables easier assembly of a detection system comprising multiple optical sensors.

The present disclosure provides an electronic package. The electronic package includes a substrate, a first component disposed on the substrate and configured to detect an external signal, and an encapsulant disposed on the substrate. The electronic package also includes a protection element disposed on the substrate and physically separating the first device from the encapsulant and exposing the first device. The present disclosure also provides an electronic device.

A filter for infrared radiation is provided as a photonic cooler coating. The filter for infrared radiation includes a first metal oxide; a second metal oxide; and a metal layer, wherein the first metal oxide layer is provided between the second metal oxide layer and the metal layer.

An image capturing and display apparatus comprises a plurality of photoelectric conversion elements for converting incident light from the outside of the image capturing and display apparatus to electrical charge signals, and a plurality of light-emitting elements for emitting light of an intensity corresponding to the electrical charge signals acquired by the plurality of photoelectric conversion elements. A pixel region is defined as a region in which the plurality of photoelectric conversion elements are arranged in an array. Signal paths for transmitting signals from the plurality of photoelectric conversion elements to the plurality of light-emitting elements lie within the pixel region.