According to the present disclosure, techniques related to manufacturing and applications of power photodiode structures and devices based on group-III metal nitride and gallium-based substrates are provided. More specifically, embodiments of the disclosure include techniques for fabricating photodiode devices comprising one or more of GaN, AlN, InN, InGaN, AlGaN, and AlInGaN, structures and devices. Such structures or devices can be used for a variety of applications including optoelectronic devices, photodiodes, power-over-fiber receivers, and others.

A single photon detector (SPD) includes a resonator to store probe photons at a probe wavelength and an absorber disposed in the resonator to absorb a signal photon at a signal wavelength. The absorber is also substantially transparent to the probe photons. In the absence of the signal photon, the resonator is on resonance with the probe photons, thereby confining the probe photons within the resonator. Absorption of the signal photon by the absorber disturbs the resonant condition of the resonator, causing the resonator to release multiple probe photons. A photodetector (PD) then detects these multiple probe photons to determine the presence of the signal photon.

According to the present disclosure, techniques related to manufacturing and applications of power photodiode structures and devices based on group-III metal nitride and gallium-based substrates are provided. More specifically, embodiments of the disclosure include techniques for fabricating photodiode devices comprising one or more of GaN, AlN, InN, InGaN, AlGaN, and AlInGaN, structures and devices. Such structures or devices can be used for a variety of applications including optoelectronic devices, photodiodes, power-over-fiber receivers, and others.

The present disclosure is directed to methods for producing a photovoltaic junction that can include coating a bare junction with a composition. In one embodiment, the composition includes a plurality of quantum dots to create a film; exposing the film to a ligand to create a first layer; coating the first layer with the composition to form a film on the first layer; and exposing the film on the first layer to the ligand to create a second layer.

Disclosed herein are photonic materials. The photonic materials comprise a first layer, a second layer, and a third layer, wherein the second layer is disposed between and in contact with the first layer and the third layer, such that the second layer is sandwiched between the first layer and the third layer. In some examples, the first layer comprises In.sub.yGa.sub.1-.sub.yN, wherein y is from 0 to 0.8. In some examples, the second layer comprises (Zn.sub.aSn.sub.bGe.sub.c).sub.xGa.sub.dN.sub.2, wherein: x is from greater than 0 to 1; a, b, c, and d are each independently from 0 to 1; with the proviso that at least one of a, b, or c is greater than 0. In some examples, the third layer comprises In.sub.zGa.sub.1-.sub.zN, wherein z is from 0 to 0.8.

The present disclosure is directed to photovoltaic junctions and methods for producing the same. Embodiments of the disclosure may be incorporated in various devices for applications such as solar cells and light detectors and may demonstrate advantages compared to standard materials used for photovoltaic junctions such as silica. An example embodiment of the disclosure includes a photovoltaic junction, the junction including a light absorbing material, an electron acceptor for shuttling electrons, and a metallic contact. In general, embodiments of the disclosure as disclosed herein include photovoltaic junctions which provide absorption across one or more wavelengths in the range from about 200 nm to about 1000 nm, or from near IR (NIR) to ultra-violet (UV). Generally, these embodiments include a multi-layered light absorbing material that can be formed from quantum dots that are successively deposited on the surface of an electron acceptor (e.g., a semiconductor).

According to the present disclosure, techniques related to manufacturing and applications of power photodiode structures and devices based on group-III metal nitride and gallium-based substrates are provided. More specifically, embodiments of the disclosure include techniques for fabricating photodiode devices comprising one or more of GaN, AlN, InN, InGaN, AlGaN, and AlInGaN, structures and devices. Such structures or devices can be used for a variety of applications including optoelectronic devices, photodiodes, power-over-fiber receivers, and others.

An optoelectronic semiconductor device includes a semiconductor body in which an active layer configured to generate or detect electromagnetic radiation, a first interlayer and a p-conducting contact layer are formed, and a connection layer applied to the semiconductor body, wherein the contact layer is disposed between the first interlayer and the connection layer and adjoins the connection layer, the active layer is arranged on a side of the first interlayer remote from the contact layer, the first interlayer and the contact layer are based on a nitride compound semiconductor, the contact layer is doped with a p-dopant, the contact layer has a thickness of at most 50 nm, and the contact layer includes a lower aluminum content than the first interlayer.

An electrostatically controlled sensor includes a GaN/AlGaN heterostructure having a 2DEG channel in the GaN layer. Source and drain contacts are electrically coupled to the 2DEG channel through the AlGaN layer. A gate dielectric is formed over the AlGaN layer, and gate electrodes are formed over the gate dielectric, wherein each gate electrode extends substantially entirely between the source and drain contacts, wherein the gate electrodes are separated by one or more gaps (which also extend substantially entirely between the source and drain contacts). Each of the one or more gaps defines a corresponding sensing area between the gate electrodes for receiving an external influence. A bias voltage is applied to the gate electrodes, such that regions of the 2DEG channel below the gate electrodes are completely depleted, and regions of the 2DEG channel below the one or more gaps in the direction from source to drain are partially depleted.

An ICIP comprises: a number N.sub.s of IC stages, wherein N.sub.s is configured to achieve a fundamental limit of the detectivity D.sub.peak* the ICIP within a range, and wherein each of the IC stages comprises: a hole barrier; an absorber coupled to the hole barrier and comprising a thickness d, wherein d is configured to achieve D.sub.peak* within the range; and an electron barrier coupled to the absorber. A method of manufacturing an ICIP comprises: determining a number N.sub.s of IC stages of the ICIP, wherein N.sub.s is configured to achieve a peak detectivity D.sub.peak* of the ICIP within a range; determining a thickness d of an absorber, wherein d is configured to achieve D.sub.peak* within the range; obtaining a substrate; forming an electron barrier on the substrate, the absorber having d on the electron barrier, and a hole barrier on the absorber; and repeating the forming N.sub.s times.