The present disclosure introduces wide tunable band filters. In one embodiment, a wide tunable band filter apparatus is described. The filter apparatus may include a microstrip patch having a plurality of symmetrical slots etched into the microstrip patch. A plurality of diodes may be coupled to the microstrip patch. Furthermore, two asymmetrical feed lines may be connected to the microstrip patch. Other embodiments are also described.

Methods of forming flipped radio frequency (RF) filter components are provided. An example method for miniaturizing conventional planar RF filters comprises: determining radio frequency (RF) filtering characteristics of a conventional planar microstrip RF filter or a conventional stripline RF filter, determining distributed RF filter elements for emulating the RF filtering characteristics of the conventional planar microstrip RF filter or the conventional stripline RF filter, creating each distributed RF filter element on a substrate, laminating a stack of the distributed RF filter elements into a single solid RF filter module; and mounting the single solid RF filter module on a horizontal substrate to vertically dispose the distributed RF filter elements of the stack. The methods create laminated stacks of distributed RF filter elements that provide a dramatic reduction in size over the horizontal planar RF filters that they replace. Deposited conductive traces of an example flipped RF filter stack provide various stub configurations of an RF filter and emulate various distributed filter elements and their configuration geometries.

Radio frequency (RF) devices are provided. An RF device includes one or more resonators. The RF device includes an RF connector that is coupled to the resonator(s). Moreover, the RF device includes a printed circuit board that covers the resonator(s) and is coupled to the resonator(s) via the RF connector.

The embodiments herein provide a multiband reconfigurable filtenna comprising a monopole antenna coupled to a center split transmission line and a reconfigurable microstrip filter replacing a feed-in end of the center split transmission line to provide resonance to the monopole antenna at a plurality of frequency bands. The reconfigurable microstrip filter includes a C-shaped resonator (CSR), a meandered loop resonator (MLR), an Inverted Pulse Shaped Resonator (IPSR) and an Open Circuited Stub (OCS). Further, a plurality of switches is coupled to the reconfigurable microstrip filter to switch coupling of the monopole antenna between the CSR, the MLR, the IPSR and the OCS for operating the monopole antenna, at one of the plurality of frequency bands.

Flipped radio frequency (RF) and microwave filters and components for compact package assemblies are provided. An example RF filter is constructed by depositing a conductive trace, such as a redistribution layer, onto a flat surface of a substrate, to form an RF filter element. The substrate is vertically mounted on a motherboard, thereby saving dedicated area. Multiple layers of substrate can be laminated into a stack and mounted so that the RF filter elements of each layer are in vertical planes with respect to a horizontal motherboard, providing dramatic reduction in size. Deposited conductive traces of an example flipped RF filter stack can provide various stub configurations of an RF filter and emulate various distributed filter elements and their configuration geometries. The deposited conductive traces can also form other electronic components to be used in conjunction with the RF filter elements. A wirebond or bond via array (BVA) version can provide flipped RF and microwave filters.

Flipped radio frequency (RF) and microwave filters and components for compact package assemblies are provided. An example RF filter is constructed by depositing a conductive trace, such as a redistribution layer, onto a flat surface of a substrate, to form an RF filter element. The substrate is vertically mounted on a motherboard, thereby saving dedicated area. Multiple layers of substrate are laminated into a stack and mounted so that the RF filter elements of each layer are in vertical planes with respect to a horizontal motherboard, providing dramatic reduction in size. Deposited conductive traces of an example flipped RF filter stack provide various stub configurations of an RF filter and emulate various distributed filter elements and their configuration geometries. The deposited conductive traces also form other electronic components to be used in conjunction with the RF filter elements. A wirebond or bond via array (BVATM) version provides flipped RF and microwave filters.

Flipped radio frequency (RF) and microwave filters and components for compact package assemblies are provided. An example RF filter is constructed by depositing a conductive trace, such as a redistribution layer, onto a flat surface of a substrate, to form an RF filter element. The substrate is vertically mounted on a motherboard, thereby saving dedicated area. Multiple layers of substrate can be laminated into a stack and mounted so that the RF filter elements of each layer are in vertical planes with respect to a horizontal motherboard, providing dramatic reduction in size. Deposited conductive traces of an example flipped RF filter stack can provide various stub configurations of an RF filter and emulate various distributed filter elements and their configuration geometries. The deposited conductive traces can also form other electronic components to be used in conjunction with the RF filter elements. A wirebond or bond via array (BVA) version can provide flipped RF and microwave filters.