A cooling device (1) for cooling an electrical component (4), in particular a laser diode, including a base body (2) with at least one outer face (20) and at least one integrated cooling channel (5), in particular a micro-cooling channel, a connecting surface (21) on the outer face (20) of the base body (2) for connecting the electrical component (4) to the base body (2) and a first stabilising layer (11),
wherein the first stabilising layer (11) and the connecting surface (21) are arranged at least partially one above the other along a primary direction (P), and
wherein the first stabilising layer (11) is offset relative to the outer face (20) towards the interior of the base body (2) by a distance (A) along a direction parallel to the primary direction (P).

A first calculation unit calculates an acceleration factor of lifetime consumption of the light source with as case of a standard temperature and standard drive condition as a reference, a second calculation unit calculates a whole lifetime or remaining lifetime of individual light sources relative to a performance index of the individual light sources or a change rate of the performance index, a computation unit obtains an effective cumulative driving time at which the magnitude of influence imparted on the lifetime is equivalent with a case of driving at the standard temperature and standard drive condition, by calculating a time integral of the acceleration factor, and a recording unit records the effective cumulative driving time and the whole lifetime or remaining lifetime together with an optical output characteristic of the light source.

Embodiments of the present application provide a laser light source and a laser projection device. The laser light source includes a laser assembly, where the laser assembly includes a laser and a circuit board, the laser includes a substrate and a light emitting chip arranged on the substrate, a lateral surface of the substrate is provided with a plurality of pins extending outwards therefrom, the circuit board is arranged on a side where the pins extend, and the circuit board is electrically connected to the pins. The laser light source of the present application features simple assembling and disassembling, reliable performance and relatively low cost.

A heat source package, comprising a housing having a metal base portion with one or more channels formed therein, the one or more channels having an inner surface, a coating of an anti-corrosive material adhered to a portion of the inner surface of the one or more channels wherein the anti-corrosive material is selected to have a thermal conductivity within a threshold range such that the coating changes the thermal resistance of a coated portion of the channel less than 25% with respect to an uncoated portion of the metal base portion. In examples, a heat source may be thermally coupled to the inner surface of the channels and the channels may be formed to conduct a liquid coolant from a liquid inlet to a liquid outlet to dissipate heat away from the heat source.

A high-efficiency laser pumping device is provided, wherein a dielectric with or without a tapered aperture is used to accept, guide, and concentrate a pump light toward a laser gain material. Preferably, the dielectric is also a heat insulator between the pump-light source and the laser gain material. The pump-light source includes an array of light-emitting diodes, or an array of laser diodes, or an array of mixed light-emitting-diodes and laser diodes. Preferably, the input and output faces of the dielectric are optically coated with dielectric layers to maximize the pump brightness toward the laser gain material. A high-efficiency laser-pumping system with active cooling apparatus is further provided, wherein a plural number of the optical-guiding and thermal-insulation dielectrics are arranged to receive the pump lights from a plural number of pump-light sources, configured to concentrate all the pump light toward a laser gain material.

Thermal management systems include an open-circuit refrigeration system featuring a receiver configurable to store a refrigerant fluid, an evaporator configurable to extract heat from a heat load when the heat load contacts the evaporator, and an exhaust line, where the receiver, the evaporator, and the exhaust line are connected to form a refrigerant fluid flow path, and a first control device configurable to control a vapor quality of the refrigerant fluid at an outlet of the evaporator along the refrigerant fluid flow path.

A semiconductor laser module includes a semiconductor laser element that outputs a laser beam, a cathode that is for causing a current to flow through the semiconductor laser element, and a heat sink that dissipates heat generated in the semiconductor laser element. The heat sink includes an anode, a first insulating layer located at a position farther away from the semiconductor laser element than the anode, and a water passage portion located at a position farther away from the semiconductor laser element than the first insulating layer. The water passage portion is formed by metal and includes a part of a flow path of water for dissipation of heat generated in the semiconductor laser element.

A testing device may include a stage associated with holding an emitter wafer during testing of an emitter. The stage may be arranged such that light emitted by the emitter passes through the stage. The testing device may include a heat sink arranged such that the light emitted by the emitter during the testing is emitted in a direction away from the heat sink, and such that a first surface of the heat sink is near a surface of the emitter wafer during the testing but does not contact the surface of the emitter wafer. The testing device may include a probe card, associated with performing the testing of the emitter, that is arranged over a second surface of the heat sink such that, during the testing of the emitter, a probe of the probe card contacts a probe pad for the emitter through an opening in the heat sink.

In various embodiments, laser systems or resonators incorporate two separate cooling loops that may be operated at different cooling temperatures. One cooling loop, which may be operated at a lower temperature, cools beam emitters. The other cooling loop, which may be operated at a higher temperature, cools other mechanical and/or optical components, for example optical elements such as lenses and/or reflectors.

A method of manufacturing a cooling element, including: providing at least one first metal layer and at least one second metal layer, oxidizing the at least one first metal layer and/or the at least one second metal layer, structuring the at least one first metal layer and/or the at least one second metal layer to form at least one recess, joining the at least one first metal layer and the at least one second metal layer to form the cooling element, wherein, in the joined state, at least a partial section of a cooling channel in the cooling element is formed by the recess in the at least one first metal layer and/or the at least one second metal layer, and wherein, prior to the joining, an inner side of the recess is provided at least in sections free of an oxidized surface.