A method of forming an optical aperture of a vertical cavity surface emitting laser includes the steps of providing a layer stack of semiconductor layers, the semiconductor layers including an intermediate layer comprising a semiconductor material suitable to be oxidized and oxidizing the intermediate layer to an oxidation width so as to form an oxidized outer region and a non-oxidized central region in the intermediate layer. The method also includes removing at least a part of the oxidized outer region so as to form a gap where the oxidized outer region or the part of the oxidized outer region has been removed, depositing an electrically non-conducting material on walls of the gap with a thickness smaller than a thickness of the gap, and filling a remaining void of the gap with a further material.

A semiconductor light-emitting element having a structure in which a substrate, a first reflector, a resonator cavity including an active layer, a second reflector and a transparent conductive film are stacked in this sequence, the semiconductor light-emitting element comprising: a first current constriction portion configured with an oxidation constriction layer; and a second current constriction portion configured with an insulation film, which is formed on an upper face of the second reflector and has an opening, and a contact portion between the transparent conductive film and a semiconductor layer with which the transparent conductive film is in contact, wherein a width d2 of the second current constriction portion is smaller than a width d1 of the first current constriction portion.

An embodiment relates to a surface emitting laser device and a light emitting device including the same. The surface emitting laser device according to the embodiment may include a first reflective layer; an active layer disposed on the first reflective layer; an active region disposed on the active layer and having an aperture and an insulation region disposed around the aperture; and a second reflective layer disposed on the active region. The second reflective layer may include a core reflective layer disposed in a position vertically corresponding to the aperture. The embodiment may include a cladding insulation layer disposed around the core reflective layer. The horizontal cross-section of the aperture may be different from the horizontal cross-section of the core reflective layer.

A surface-emitting laser includes a substrate; semiconductor layers provided on the substrate, the semiconductor layers including a lower reflector layer, an active layer, and an upper reflector layer, the semiconductor layers forming a mesa; a first insulating film covering the mesa; and a second insulating film covering the first insulating film, wherein the mesa has a polygonal shape in a direction in which the substrate extends, and a vertex of the mesa in the direction in which the substrate extends has a chamfered portion.

A semiconductor device comprises a substrate and a plurality of emitters disposed on the substrate. The emitter may comprise: a first conductive reflection layer having a first reflectivity; an active layer disposed on the first conductive reflection layer; an aperture layer disposed on the active layer and comprising an aperture region and a blocking region surrounding the aperture region; and a second conductive reflection layer disposed on the aperture layer and having a second reflectivity smaller than the first reflectivity. A diameter-to-pitch ratio of the aperture region of the aperture layer is 1:3 to 1:5, wherein the pitch may be defined as the distance between centers of aperture regions of aperture layers of adjacent emitters.

A surface emitting laser includes a first reflective layer, an active layer provided on the first reflective layer, and a second reflective layer provided on the active layer. The first reflective layer, the active layer, and the second reflective layer form a mesa, and the mesa has an electrically insulating region and an electrically conductive region. The electrically insulating region is positioned at a center portion of the mesa in a surface direction, and the electrically conductive region includes the first reflective layer, the active layer, and the second reflective layer and is positioned outside the electrically insulating region in such a manner as to surround the electrically insulating region.

A surface-emitting laser includes a lower DBR layer, a cavity layer, and an upper DBR layer that are stacked in this order on top of a substrate, wherein the lower DBR layer has a first DBR layer, a contact layer, and a second DBR layer that are stacked in this order on top of the substrate, wherein the first DBR layer and the second DBR layer each include a plurality of first layers and a plurality of second layers that are alternately stacked, wherein the first layers and the second layers are each a semiconductor layer including aluminum, wherein a composition ratio of the aluminum of each first layer is lower than a composition ratio of the aluminum of each second layer, and wherein the second DBR layer includes 12 or more and 20 or fewer pairs of the first layers and the second layers.

A method of fabricating a radiation emitter including fabricating a layer stack that includes a first reflector, at least one intermediate layer, an active region and a second reflector; locally oxidizing the intermediate layer and thereby forming at least one unoxidized aperture; and locally removing the layer stack, and thereby forming a mesa that includes the first reflector, the unoxidized aperture, the active region, and the second reflector. Before or after locally removing the layer stack and forming the mesa: forming at least a first unoxidized aperture and at least a second unoxidized aperture inside the intermediate layer; etching a trench inside the layer stack, the trench defining a first portion and a second portion of the mesa, wherein the trench severs the intermediate layer(s) so that the first aperture is located in the first portion and the second aperture is located in the second portion of the mesa.

A vertical cavity surface emitting laser includes: a substrate; a first mirror layer; an active layer; a second mirror layer; a current constriction layer; a first area connected to the first mirror layer and including a plurality of oxide layers; and a second area connected to the second mirror layer and including a plurality of oxide layers. The first mirror layer, the active layer, the second mirror layer, the current constriction layer, the first area, and the second area configure a laminated body. The laminated body includes a first portion, a second portion, and a third portion between the first portion and the second portion. When a width of the oxide area is W1 and a width of an upper surface of the first portion is W2, W2/W1≦3.3.

The aspects of the disclosed embodiments relates to an optoelectronic device including a substrate layer having a first surface plane and a second surface plane opposite and parallel to the first surface plane. The device also includes a mesa structure arranged on the first surface plane of the substrate layer. The mesa structure includes at least one layer of material; and a first surface arranged at an angle α with respect to the first surface plane of the substrate layer, wherein the angle α is different from 0° and 180°. The device still further includes a first terminating oxide layer of a first type arranged on the first surface of the mesa structure and the first surface of the mesa structure has been cleaned by removing at least 75% of native oxides on the first surface of the mesa structure before arranging the first terminating oxide layer of a first type thereon.