Technologies for acoustoelectronic manipulation of micro/nano particles include a system having a piezoelectric substrate coupled to one or more acoustic transducers and a fluid layer positioned above the substrate. Micro/nano particles are introduced to the fluid, which can be in the form of a droplet or in a confined channel, and a signal is applied to the acoustic transducer. One or more parameters of the signal are varied after introducing the micro/nano particles into the fluid. The parameters may include amplitude, frequency, or phase of the signal. The system may include one or more acoustic transducers. Multiple signals may be applied to the acoustic transducers. Wave superposition of acoustic waves in the substrate manipulates micro/nano particles in the fluid. The nanoparticles may include carbon nanotubes, nanowires, nanofibers, graphene flakes, quantum dots, SERS probes, exosomes, vesicles, DNA, RNA, antibodies, antigens, macromolecules, or proteins.

Electrical connections are created between the actuator frame of a piezoelectric MEMS scanning mirror system and the substrate separate from the structural adhesive creating the mechanical bond between the actuator frame and the substrate. A structural bond (with no conducive properties) is formed between the actuator frame and the substrate. After the bond is fully formed, separate electric connections can be created by one or both of: 1) coating the actuator frame with a coating that enables a surface of the actuator frame to be wire bondable and creating a wire bond between the actuator frame and the substrate; or 2) depositing a trace of conductive material on the outside edge of the mechanical bond between the actuator frame and the substrate and a final protection layer may be applied over the conductive trace to protect the trace from mechanical or environmental damage.

A micromechanical component comprising a bracket and an adjustable portion arranged in an adjustable manner on the bracket. The micromechanical component includes a first bender actuator and a first support structure for the first bender actuator. The first bender actuator is arranged in or on the first support structure and is configured to bend the first support structure at least in the area of the first bender actuator arranged in or on the first support structure, such that the adjustable portion is displaceable relative to the bracket about a first rotational axis. The first support structure is directly connected to the adjustable portion. The micromechanical component additionally includes a first spring configured to suspend the first support structure for the first bender actuator and the adjustable portion from the bracket.

Provided is an actuator including a piezoelectric element capable of satisfying three of a large amplitude, a high resonance frequency, and a large generated force. Actuator (100) is a drive source having a cantilever structure in which one end is a fixed end and the other end is displaced, and includes first piezoelectric body (110), second piezoelectric body (120), and shim member base (130) disposed between first piezoelectric body (110) and second piezoelectric body (120). In first piezoelectric body (110) and second piezoelectric body (120), piezoelectric body removal parts (110a) and (120a) are formed.

The disclosure provides a piezoelectric element and a method for manufacturing a piezoelectric element. The disclosure provides the piezoelectric element comprising: a base layer, a piezoelectric layer which is disposed on one surface of the base layer, and in which upwardly curved convex portions and downwardly curved concave portions are continuously disposed along a first direction; and contact members which are disposed on the concave portions of the piezoelectric layer and on the one surface of the base layer to connect the piezoelectric layer to the base layer.

A microelectromechanical structure includes a body of semiconductor material having a fixed frame internally defining a cavity, a mobile mass elastically suspended in the cavity and movable with a first resonant movement about a first rotation axis and with a second resonant movement about a second rotation axis, orthogonal to the first axis. First and second pairs of supporting elements, extending in cantilever fashion in the cavity, are rigidly coupled to the frame, and are piezoelectrically deformable to cause rotation of the mobile mass about the first and second rotation axes. First and second pairs of elastic-coupling elements are elastically coupled between the mobile mass and the first and the second pairs of supporting elements. The first and second movements of rotation of the mobile mass are decoupled from one another and do not interfere with one another due to the elastic-coupling elements of the first and second pairs.

A multi-axis MEMS assembly includes: a micro-electrical-mechanical system (MEMS) actuator configured to provide linear three-axis movement, the micro-electrical-mechanical system (MEMS) actuator including: an in-plane MEMS actuator, and an out-of-plane MEMS actuator including a multi-morph piezoelectric actuator; an optoelectronic device coupled to the in-plane MEMS actuator; and a lens barrel assembly coupled to the out-of-plane MEMS actuator.

The embodiments described herein include scanners that can provide improved scanning laser devices. Specifically, the embodiments described herein provide scanners with a modular construction that includes one or more separately formed piezoelectric actuators coupled to a microelectromechanical system (MEMS) scan plate, flexure structures, and scanner frame. Such modular scanners can provide improved scanning laser devices, including scanning laser projectors and laser depth scanners, LIDAR systems, 3D motion sensing devices, gesture recognition devices, etc.

A vibration motor includes a first vibrating body including a first projection and a second vibrating body including a second projection, the first vibrating body and the second vibrating body receiving electric power and vibrating to generate a driving force and transmitting the driving force to a driven section, a first coil spring configured to urge the first vibrating body and the second vibrating body in a driving direction and restrict positions of the first vibrating body and the second vibrating body in the driving direction, and a case housing the first vibrating body, the second vibrating body, and the first coil spring. The first vibrating body, the second vibrating body, and the first coil spring are arranged in the driving direction. The number of first coil springs is smaller than the number of first and second vibrating bodies in the urging direction.

Technologies for a microelectromechanical system (MEMS) made up of composable piezoelectric actuators is disclosed. An elongated piezoelectric rod is disposed between a top and a bottom electrode. The top electrode runs along one edge of the top of the piezoelectric rod for a first segment, then runs along the other edge of the top of the piezoelectric rod for the a second segment. When a voltage is applied across the electrodes, the piezoelectric rod bends in a first direction for the first segment and in a second direction opposite the first for the second segment, displacing the tip of the rod. Several such rods can be joined in parallel and/or series, allowing for large-scale systems to be composed.