A broadband choke inductor is used in a bias circuit for broadband high-power distributed amplifiers.

When a current-to-voltage converter is used at low temperatures, the frequency band of measurable small currents is limited. Stray capacitance of a coaxial cable that takes out an output voltage of the current-to-voltage converter from inside to outside a cooling device narrows the operating frequency band of the current-to-voltage converter. The current-to-voltage converter of the present disclosure uses elements exclusively optimized for low-temperature operation (e.g., HEMTs) as electronic elements for current-to-voltage conversion. This configuration realizes current-to-voltage conversion characteristics with significantly more excellent sensitivity than that of the conventional technique even when the current-to-voltage converter is operated at a low temperature of 150 K or less or in cryogenic temperature conditions close to absolute zero. Further, a source follower circuit is added to an output stage of the current-to-voltage conversion circuit to isolate the effect of stray capacitance added to the output side of the current-to-voltage conversion circuit and achieve a wider bandwidth.

A circuit for amplifying a source signal generated by a signal source having a first impedance includes a transmission line transformer (TLT) having a first, a second, a third, and a fourth port wherein the TLT is coupled to receive the source signal at the first port and configured to output a corresponding impedance matched signal at the second port, the second port is coupled to the third port of the TLT, the circuit also including a TLT load having a first terminal coupled to the fourth port of the TLT and a second terminal coupled to a reference potential. The circuit additionally includes an amplifier device responsive to the impedance matched signal to generate an amplified signal.

Apparatus and methods for power amplifiers with broadband matching networks are disclosed. In certain embodiments, a mobile device includes a transceiver that generates a radio frequency input signal, and a front-end system including a compound semiconductor die and a silicon switch die. The compound semiconductor die includes a power amplifier including one or more power amplifier stages that amplify the radio frequency input signal to generate a radio frequency output signal. The silicon switch die includes a band selection switch that receives the radio frequency output signal. The compound semiconductor die and the silicon switch die each include at least one controllable impedance for providing a bandwidth adjustment to the power amplifier.

Apparatus and methods for power amplifier systems with balun and shunt capacitor are disclosed. In certain embodiments, a front-end system includes a shunt capacitor, a balun having an input side and an output side, and power amplifier stages that operate in parallel with one another to amplify a radio frequency input signal. The power amplifier stages include a first power amplifier stage having a first output coupled to the shunt capacitor and to a first input terminal on the input side of the balun, and a second power amplifier stage having a second output coupled to a second input terminal on the input side of the balun.

A circuit an amplifier stage that amplifier stage includes a positive amplifier branch and a negative amplifier branch and has current flow paths therethrough cascaded in a flow line for a core current for the amplifier stage between a supply node and a ground node. The positive and negative amplifier branches have respective input nodes configured to receive an input signal applied therebetween. A current mirror loop can be coupled to the respective input nodes of the positive and negative amplifier branches and provides an adjustable high-impedance bias source for the core current for the amplifier stage. In addition to, or instead of the current mirror loop, the circuit can include stability network having a gain bandwidth range. The amplifier stage is configured to short-circuit the output signal from the amplifier stage within the gain bandwidth range based on an output voltage setting signal.

An image sensor and electronic apparatus comprise a pixel circuit configured to generate an analog signal; a vertical signal line configured to convey the analog signal from the pixel circuit; an analog amplifier circuit configured to receive the analog signal via the vertical signal line and generate an amplified signal; and a tail current boost circuit configured to modify an instantaneous gain bandwidth product of the analog amplifier circuit by temporarily modifying a tail current of the analog amplifier circuit.

An image sensor and processing method therein comprises a pixel circuit configured to generate a pixel signal; a vertical signal line configured to convey the pixel signal; and a charge amplifier circuit configured to receive the pixel signal, the charge amplifier circuit being switched between a low bandwidth state and a high bandwidth state in response to a control signal.

An image sensor and electronic apparatus comprise a pixel circuit configured to generate an analog signal; a vertical signal line configured to convey the analog signal from the pixel circuit; an analog amplifier circuit configured to receive the analog signal via the vertical signal line and generate an amplified signal; and a tail current boost circuit configured to modify an instantaneous gain bandwidth product of the analog amplifier circuit by temporarily modifying a tail current of the analog amplifier circuit.

The present disclosure provides a power amplifier and an electrical device. The two-stage power amplifier architecture is tuned staggered before power combining. A previous stage matching network and its input matching are split into a cascaded staggered tuning, such that the center frequency is at frequency point 1 less than the design frequency point and frequency point 2 greater than design frequency point, and then the power combining stage is tuned at the design frequency point. At advanced process nodes (such as 65 nm or below), compared with the known architecture, in-band signal quality and out-of-band filtering effect of the power amplifier chip integrating this architecture will be better when using the same number of transformers (same area), the reliability will be better. Due to its good flatness within the band, this architecture is especially suitable for carrier aggregation communication occasions.