A high-frequency high-linear input buffer includes a first MOS transistor, a second MOS transistor, a third MOS transistor, and a signal panning unit. A gate terminal of the first MOS transistor is used as an input terminal of the buffer. A current input terminal of the first MOS transistor is connected to a current output terminal of the second MOS transistor. A current output terminal of the first MOS transistor is connected to a current input terminal of the third MOS transistor. A current input terminal of the second MOS transistor is connected to a gate terminal of the third MOS transistor. An input terminal of the signal panning unit is connected to an input terminal of the buffer. An output terminal of the signal panning unit is connected to a gate terminal of the second MOS transistor. An output terminal of the third MOS transistor is connected to ground.

A high-frequency high-linear input buffer includes a first MOS transistor, a second MOS transistor, a third MOS transistor, and a signal panning unit. A gate terminal of the first MOS transistor is used as an input terminal of the buffer. A current input terminal of the first MOS transistor is connected to a current output terminal of the second MOS transistor. A current output terminal of the first MOS transistor is connected to a current input terminal of the third MOS transistor. A current input terminal of the second MOS transistor is connected to a gate terminal of the third MOS transistor. An input terminal of the signal panning unit is connected to an input terminal of the buffer. An output terminal of the signal panning unit is connected to a gate terminal of the second MOS transistor. An output terminal of the third MOS transistor is connected to ground.

A multi-chip package includes a field-programmable-gate-array (FPGA) integrated-circuit (IC) chip configured to perform a logic function based on a truth table, wherein the field-programmable-gate-array (FPGA) integrated-circuit (IC) chip comprises multiple non-volatile memory cells therein configured to store multiple resulting values of the truth table, and a programmable logic block therein configured to select, in accordance with one of the combinations of its inputs, one from the resulting values into its output; and a memory chip coupling to the field-programmable-gate-array (FPGA) integrated-circuit (IC) chip, wherein a data bit width between the field-programmable-gate-array (FPGA) integrated-circuit (IC) chip and the memory chip is greater than or equal to 64.

A multi-chip package includes a field-programmable-gate-array (FPGA) integrated-circuit (IC) chip configured to perform a logic function based on a truth table, wherein the field-programmable-gate-array (FPGA) integrated-circuit (IC) chip comprises multiple non-volatile memory cells therein configured to store multiple resulting values of the truth table, and a programmable logic block therein configured to select, in accordance with one of the combinations of its inputs, one from the resulting values into its output; and a memory chip coupling to the field-programmable-gate-array (FPGA) integrated-circuit (IC) chip, wherein a data bit width between the field-programmable-gate-array (FPGA) integrated-circuit (IC) chip and the memory chip is greater than or equal to 64.

An output driver includes a first pre-driver circuit, a first driver circuit, a second pre-driver circuit, a second driver circuit, and a feedback network. The first pre-driver circuit pre-drives a first data input signal to generate a first pre-driving output signal. The first driver circuit drives the first pre-driving output signal to generate a first data output signal. The second pre-driver circuit pre-drives a second data input signal to generate a second pre-driving output signal, wherein the first data input signal and the second data input signal are a differential input of the output driver. The second driver circuit drives the second pre-driving output signal to generate a second data output signal. The feedback network performs a latching operation upon the first pre-driving output signal and the second pre-driving output signal according to the first data output signal and the second data output signal.

An output driver includes a first pre-driver circuit, a first driver circuit, a second pre-driver circuit, a second driver circuit, and a feedback network. The first pre-driver circuit pre-drives a first data input signal to generate a first pre-driving output signal. The first driver circuit drives the first pre-driving output signal to generate a first data output signal. The second pre-driver circuit pre-drives a second data input signal to generate a second pre-driving output signal, wherein the first data input signal and the second data input signal are a differential input of the output driver. The second driver circuit drives the second pre-driving output signal to generate a second data output signal. The feedback network performs a latching operation upon the first pre-driving output signal and the second pre-driving output signal according to the first data output signal and the second data output signal.

An integrated circuit includes a first active region, a second active region, a first insulating region, a first contact and a second contact. The first and second active region extend in a first direction, are in a substrate, and are located on a first level. The second active region is separated from the first active region in a second direction. The first insulating region is over the first active region. The first contact extends in the second direction, overlaps the second active region, and is located on a second level different from the first level. The second contact extends in the first direction and the second direction, overlaps the first insulating region and the first contact. The second contact is electrically insulated from the first active region, and is located on a third level different from the first level and the second level.

An integrated circuit includes a first active region, a second active region, a first insulating region, a first contact and a second contact. The first and second active region extend in a first direction, are in a substrate, and are located on a first level. The second active region is separated from the first active region in a second direction. The first insulating region is over the first active region. The first contact extends in the second direction, overlaps the second active region, and is located on a second level different from the first level. The second contact extends in the first direction and the second direction, overlaps the first insulating region and the first contact. The second contact is electrically insulated from the first active region, and is located on a third level different from the first level and the second level.

Various embodiments may provide an integrated circuit layout cell. The integrated circuit layout cell may include a doped region of a first conductivity type, a doped region of a second conductivity type opposite of the first conductivity type, and a further doped region of the first conductivity type at least partially within the doped region of the second conductivity type, and continuous with the doped region of the first conductivity type. The integrated circuit cell may include a first transistor having a control terminal, a first controlled terminal, and a second controlled terminal. The first controlled terminal and the second controlled terminal of the first transistor may include terminal regions of the second conductivity type formed within the further doped region of the first conductivity type. The integrated circuit cell may also include a second transistor.

A multiplexer circuit includes first and second fins each extending in an X-axis direction. First, second, third and fourth gates extend in a Y-axis direction perpendicular to the X-axis direction and contact the first and second fins. The first, second, third and fourth gates are configured to receive first, second, third and fourth data signals, respectively. Fifth, sixth, seventh and eighth gates extend in the Y-axis direction and contact the first and second fins, the fifth, sixth, seventh and eighth gates, and are configured to receive the first, second, third and fourth select signals, respectively. An input logic circuit is configured to provide an output at an intermediate node. A ninth gate extends in the Y-axis direction and contacts the first and second fins. An output logic circuit is configured to provide a selected one of the first, second, third and fourth data signals at an output terminal.