A power converter includes a semiconductor element disposed on a substrate, a thermistor element for detecting the temperature of the substrate, the thermistor element being disposed on the substrate, a current detection resistor having one end connected to a ground side node and another end that is grounded, a first voltage detection unit configured to detect a first potential at the other end of the current detection resistor and a second potential at the ground side node, and output a first detection signal, a control unit configured to control the semiconductor element based on the first detection signal, a temperature detection resistor having one end that is connected to a reference potential and another end that is connected to a detection node, and a temperature detection unit configured to detect a temperature based on a third potential at the detection node, and output a temperature information signal.

An integrated circuit having a plurality of selectable modes, functions and/or characteristics may be configured at the time of product manufacture by providing an appropriate resistance value pull-up resistor at an external connection (pin) of the integrated circuit package. At least one external connection (pin) may be used for such configuration of the integrated circuit. This is done without having to program the integrated circuit before placing on the product printed circuit board. The same integrated circuit may thus be used for a plurality of different products without requiring any pre-programming thereof. The integrated circuit's personality (desired characteristics) will be programmed automatically as soon as power is first applied to the finished product printed circuit board. Once the integrated circuit has been configured at power up, the external at least one connection (pin), initially used for configuration, can be used for either analog or digital input, output or input/output.

A programmable device, having an analog component coupled with an analog bus and a digital component coupled with a digital bus together with a set of 10 pads, each of which capable of being coupled to a bus line of one segment of the analog bus as well as to at least one digital bus line, and where the analog bus is capable of being used to connect a pair of the pads to each other.

An IGBT provided on the high voltage side uses the sensing function of the IGBT to detect a current and prevents the IGBT from breaking due to an overcurrent through a gate drive unit when the current detected by the short-circuit protection unit is determined to be an overcurrent. When detecting an overcurrent, the short-circuit protection unit outputs an alarm signal to a composition unit. Also, it detects the temperature of the power semiconductor module by using a temperature detection element, converts the detected temperature into a digital signal in the temperature information generating unit, and outputs the digitized temperature information to the composition unit. The composition unit composites the temperature information and the alarm signal and one resultant composite output is transmitted to a control unit on the low voltage side.

A circuit structure for realizing circuit pin multiplexing, comprising an MCU module, a temperature sensing circuit and a functional module circuit. The output end of the temperature sensing circuit is connected with an enable signal interface of the MCU module, the output voltage of the temperature sensing circuit is always higher than the threshold voltage of the enable signal, and the MCU module is connected with the functional module circuit. The circuit structure of the present invention realizes the mutual influence of analog signal output and digital signal transmission by designing a temperature sensing output curve, and achieves multi-function multiplexing of a single pin, so that the output of the analog signal and the input of the digital signal can share the pins, it solves the problem of the limitation of the number of pins, and promotes the transmission of the signal and improves the cost performance of the circuit.

An IC includes a bare die and a multiplexed pin. The multiplexed pin is electrically connected to first and second switch circuits, the first and second switch circuits are respectively connected to first and second circuit modules disposed on the bare die and control a connection between the first and second circuit modules and the multiplexed pin, the first switch circuit is connected to a first die pad by a metal layer trace within the bare die, the second switch circuit is connected to a second die pad by a metal layer trace within the bare die, and the first and second die pads are connected to the multiplexed pin through a bond wire respectively. The bare die with a larger number of die pads can be packaged into an IC package with a smaller number of chip pins.

An IC includes a bare die and a multiplexed pin. The multiplexed pin is electrically connected to first and second switch circuits, the first and second switch circuits are respectively connected to first and second circuit modules disposed on the bare die and control a connection between the first and second circuit modules and the multiplexed pin, the first switch circuit is connected to a first die pad by a metal layer trace within the bare die, the second switch circuit is connected to a second die pad by a metal layer trace within the bare die, and the first and second die pads are connected to the multiplexed pin through a bond wire respectively. The bare die with a larger number of die pads can be packaged into an IC package with a smaller number of chip pins.

A programmable device, having an analog component coupled with an analog bus and a digital component coupled with a digital bus together with a set of 10 pads, each of which capable of being coupled to a bus line of one segment of the analog bus as well as to at least one digital bus line, and where the analog bus is capable of being used to connect a pair of the pads to each other.

A circuit includes a voltage source, a transistor, a load current sensor, a hardware latch and a logic circuit. The transistor is connected between the voltage source and a load. The sensor emits a fault signal when the load current exceeds a predetermined value. The hardware latch sets a latch signal when it receives the fault signal and maintains the latch signal until it receives a rearm signal. The logic circuit receives the latch signal from the hardware latch and also receives a software command for controlling turning on and off of the circuit. When the latch signal is not set, the logic circuit converts the software command to a control voltage applied at a gate of the transistor, turning on the transistor to allow power delivery to the load. A system includes a microcontroller providing software commands and rearm signals to a plurality of circuits.

An IC includes a bare die and a multiplexed pin. The multiplexed pin is electrically connected to first and second switch circuits, the first and second switch circuits are respectively connected to first and second circuit modules disposed on the bare die and control a connection between the first and second circuit modules and the multiplexed pin, the first switch circuit is connected to a first die pad by a metal layer trace within the bare die, the second switch circuit is connected to a second die pad by a metal layer trace within the bare die, and the first and second die pads are connected to the multiplexed pin through a bond wire respectively. The bare die with a larger number of die pads can be packaged into an IC package with a smaller number of chip pins.