A method for providing more than one function to pins of a programmable device used in a server system includes the programmable device and first and second devices. The programmable device is electrically connected to the first device and the second device. The programmable device includes a major logic communication device, a detection module, a storage module, and at least one multiplexing pin. The second device is powered on, sending an in-position signal to the detection module through the at least one multiplexing pin. The detection module transmits the in-position signal to the storage module. The major logic communication module communicates with the first device through the at least one multiplexing pin. A system applying the method are also disclosed.

A device includes a plurality of reconfigurable resources, a bus, and a configurator. The bus interconnects the plurality of reconfigurable resources. The configurator is configured to deterministically compute a segmented interconnect configuration for the bus based on operational parameters associated with the device and operational constraints associated with program modules to be executed by the plurality of reconfigurable resources.

A method for providing a high-speed data communication between a host and field-programmable gate array (“FPGA”) is disclosed. The method, in one embodiment, is capable of identifying a data rate on a bus containing a P-channel and an N-channel operable to transmit signals in accordance with a high-speed Universal Serial Bus (“USB”) protocol. Upon sampling, by a first input deserializer, first two samples of data signals carried by the P-channel in accordance with a first clock signals clocking twice as fast as the data rate of the P-channel, a second input deserializer is used to sample the second two samples of data signals transmitted by the N-channel in accordance with a second clock signal running twice as fast as the data rate of the N-channel with a ninety (90) degree phase shift. The method subsequently forwards the data signals to one or more configurable logic blocks (“LBs”) in FPGA.

Techniques and apparatus for reducing low frequency power supply spurs in clock signals in a clock distribution network. One example circuit for clock distribution generally includes a plurality of logic inverters coupled in series and configured to drive a clock signal and a current-starved inverter coupled in parallel (or in series) with a logic inverter in the plurality of logic inverters.

Some examples relate to a system including a pulse modulation (PM) circuit having a PM input and a PM output. The system also includes a load circuit having a load circuit input, and an I/O pad coupling the PM output to the load circuit input. An asymmetry detection circuit has a first asymmetry detection (AD) input coupled to the PM output via a first feedback path, a second AD input coupled to an output node of the I/O pad via a second feedback path, and an AD output coupled to the PM input of the pulse modulation circuit via a control path.

A sensor device may include a base layer, and an ASIC element disposed on the base layer. The ASIC element may include a plurality of electrical contact points. The sensor device may include a MEMS element. The MEMS element may include a plurality of through-silicon vias. The sensor device may include a plurality of conductive contact elements. Each conductive contact element may be disposed between, and electrically coupling, a respective through-silicon via and a respective electrical contact point. The sensor device may include a protective layer disposed between the ASIC element and the MEMS element. The protective layer may be composed of material(s) having a physical property defined to permit the protective layer to mitigate stress forces directed from the ASIC element to the MEMS element, to prevent corrosion, and/or to prevent leakage current between electrical connections due to pollution and/or humidity.

A sensor device may include a base layer, and an ASIC element disposed on the base layer. The ASIC element may include a plurality of electrical contact points. The sensor device may include a MEMS element. The MEMS element may include a plurality of through-silicon vias. The sensor device may include a plurality of conductive contact elements. Each conductive contact element may be disposed between, and electrically coupling, a respective through-silicon via and a respective electrical contact point. The sensor device may include a protective layer disposed between the ASIC element and the MEMS element. The protective layer may be composed of material(s) having a physical property defined to permit the protective layer to mitigate stress forces directed from the ASIC element to the MEMS element, to prevent corrosion, and/or to prevent leakage current between electrical connections due to pollution and/or humidity.

Systems or methods of the present disclosure may improve scalability (e.g., component scalability, product variation scalability) of integrated circuit systems by disaggregating periphery intellectual property (IP) circuitry into modular periphery IP tiles that can be installed as modules. Such an integrated circuit system may include a first die that includes programmable fabric circuitry and a second die that that includes a periphery IP tile. The periphery IP tile may be disaggregated from the programmable fabric die and may be communicatively coupled to the first die via a modular interface.

A system includes a first die having a first side with first die-to-die circuitry and first input output circuitry. The system also includes a second die comprising a second side with second die-to-die circuitry and second input output circuitry. The first and second sides are adjacent to each other in the electronic package device. The system also includes a semiconductor interconnect including multiple connections to interconnect the first and second die-to-die circuitries. The semiconductor interconnect also includes multiple through-silicon-vias to transmit data to or from the first and second input output circuitries through the semiconductor bridge.

A die includes one or more power delivery layers to deliver power within the die. Additionally, the die also includes one or more transistor layers to at least partially implement a programmable fabric for the die. Furthermore, the die further includes one or more signal routing layers to transmit signals for use by the programmable fabric. Moreover, the one or more transistor layers physically separate the one or more power delivery layers from the one or more signal routing layers.