A printed wiring board includes a first outer surface, a second outer surface, and an electronic circuit. The second outer surface is opposite to the first outer surface. The electronic circuit includes at least one specific design circuit block and at least one common design circuit block. The at least one specific design circuit block is provided on the first outer surface and designed in accordance with a specification of a device to which the printed wiring board is applied. The at least one common design circuit block is for a common use regardless of the specification of the device. The at least one common design circuit block is provided on the second outer surface.

A surface mount module form factor comprises a substrate having a bottom surface, a top surface, and an outer periphery, with at least one electronic component mounted on the substrate, and a plurality of land grid array pads mounted on the bottom surface of the substrate. At least some of the land grid array pads are coupled to the at least one electronic component. A plurality of castellated edge pads are mounted around the outer periphery of the substrate, with at least some of the castellated edge pads coupled to the at least one electronic component. At least some of the land grid array pads are mapped to at least some of the castellated edge pads.

A printed wiring board includes a first resin insulating layer, a conductor layer on the first resin insulating layer, and a second resin insulating layer formed on the first resin insulating layer such that the second resin insulating layer is covering the conductor layer. The conductor layer includes a first circuit having a width of 15 μm or less and a rectangular cross-sectional shape, a second circuit having a trapezoidal cross-sectional shape, a third circuit, a fourth circuit, a fifth circuit, and a sixth circuit, a space between the first and third circuits has a width of 14 μm or less, a space between the first and fourth circuits has a width of 14 μm or less, a space between the second and fifth circuits has a width of 20 μm or more, and a space between the second and sixth circuits has a width of 20 μm or more.

In an embodiment a carrier includes a base substrate, at least one insulating layer, at least one inner wiring layer, at least one outer wiring layer and at least one through-via in the insulating layer extending through the insulating layer, wherein the base substrate and the insulating layer are formed from different materials, wherein the base substrate is formed for mechanically stabilizing the carrier and supports the insulating layer, wherein the inner wiring layer is arranged in a vertical direction at least in places between the base substrate and the insulating layer, wherein the outer wiring layer is spatially separated from the inner wiring layer at least in places by the insulating layer, and wherein the through-via electrically conductively connects the inner wiring layer to the outer wiring layer and has a lateral cross-section having a maximum lateral extent of at most 100 μm.

An apparatus and method simulates cable routing for determining signal integrity between electronic components within a computer chassis. The apparatus includes a base plate simulating a computer chassis base. The base plate includes a top surface. A plurality of reconfigurable mounting fixtures each allow temporary mounting of a printed circuit board assembly (PCBA) to a respective reconfigurable mounting fixture. The plurality of reconfigurable mounting fixtures is temporarily mountable anywhere on the top surface of the base plate. A cable including a first end connector allows a connection to a first PCBA, and a second end connector allows a connection to a second PCBA.

In accordance with various embodiments, lighting systems features multiple inter-connectable light panels each having multiple light-emitting elements thereon. One or more of the light panels features one or more connectors, and associated conductors, for the transmission of power, communication signals, and/or control signals.

Flexible lighting apparatus and method of manufacturing the same disclosed. The flexible light apparatus includes a net-structured flexible printed circuit board (FPCB), being manufactured in shape of net structure in which a plurality of through-holes are formed separately from each other in a body of the net-structured FPCB, and having predetermined circuit patterns formed thereon, a plurality of light sources, being mounted on at least one of predetermined mounting location among intersection and branch of the net-structured FPCB, and a supporting layer, having apertures formed thereon and being fixed to support the net-structured FPCB at bottom surface.

Methods, apparatus and systems are described. An apparatus includes a module body made of a polymer material. The module body includes a mounting surface adjacent a potting area. At least two lead frame elements are embedded in the polymer material of the module body. Each of the at least two lead frame elements has a first terminal side and a second terminal side in the component potting area. An LED element is on the mounting surface of the module body and electrically coupled to the first terminal side of the at least two lead frame elements.

Electronic apparatus includes a dielectric substrate and alternating layers of conducting and dielectric materials disposed over the dielectric substrate, including at least first and second patterned layers of the conducting material separated by an intervening layer of the dielectric material. A conductive trace is disposed within the first patterned layer of the conducting material. A conductive mesh extends within the second patterned layer of the conducting material over a region that overlaps transversely with at least a part of the conductive trace in the first patterned layer.

A wiring board includes: a substrate having transparency; a plurality of first wirings which are arranged on an upper surface of the substrate and extend in a first direction and each of which has a back surface in contact with the substrate and a front surface facing an opposite side of the back surface; and has a back surface in contact with the substrate and a front surface facing an opposite side of the back surface. The first wiring has a pair of side surfaces which extend in the first direction and are adjacent to the back surface of the first wiring, and each of the pair of side surfaces of the second wiring is recessed inward. The second wiring has a pair of side surfaces which extend in the second direction and are adjacent to the back surface of the second wiring.