A lens module and a manufacturing method of the lens module are provided. The manufacturing method includes the following steps. Firstly, a circuit substrate is provided. Then, an image sensor chip is placed on a top surface of the circuit substrate. Then, plural electrical connection paths are formed between the image sensor chip and the circuit substrate. Then, plural stacking spacer structures are formed on a top surface of the image sensor chip by a stacking process. Then, plural protective sidewalls are formed to cover the electrical connection paths. Then, a glass substrate is placed over the stacking spacer structures. Then, a lens holder structure is placed on a substrate top surface of the glass substrate directly. The glass substrate is supported by the stacking spacer structures. Consequently, the glass substrate can be maintained at the position over the image sensor chip.

The present invention provides various aspects for processing multiple types of substrates within cleanspace fabricators or for processing multiple or single types of substrates in multiple types of cleanspace environments particularly to form hardware based encryption devices and hardware based encryption equipped communication devices and multi-chip modules such as chiplets. In some embodiments, a collocated composite cleanspace fabricator may be capable of processing semiconductor devices into integrated circuits and then performing assembly operations to result in product in packaged form. Customized smart devices, smart phones and touchscreen devices may be fabricated in examples of a cleanspace fabricator. The assembly processing may include steps to form hardware based encryption.

A ceramic carrier substrate for an electrical/electronic circuit. The substrate includes ceramic layers arranged one above the other in an interconnected structure and conductor tracks arranged on and/or in individual ceramic layers and connected to one another as the conductor structure for the electrical/electronic circuit. The interconnected structure is formed by a firing operation. A first conductor substructure is formed in a first interconnected structure subassembly which comprises at least one of the ceramic layers, and a second conductor substructure is formed in a second interconnected structure subassembly which is directly adjacent to the first interconnected structure subassembly and comprises at least one of the ceramic layers. The second conductor substructure substantially consists of high-current conductor tracks and is configured to contact a power circuit. The first conductor substructure substantially consists of signal conductor tracks and is configured to contact a drive circuit for the power circuit.

There is described a method of recovering parts of an electronic circuit having a self-supporting substrate having graphene oxide (GO) paper, and at least a conductive trace on the self-supporting substrate. The method generally has a step of immersing the electronic circuit into an environment-friendly solvent, the GO paper thereby dissociating from the conductive trace; and a step of recovering the GO paper from the environment-friendly solvent. The present disclosure also describes an electronic circuit generally having a self-supporting substrate having GO paper with a structural thickness being equal or above a given thickness threshold; and at least a conductive trace on said self-supporting substrate. Further, there is also described a substrate for an electronic circuit in which the substrate generally has a self-supporting substrate having GO paper with a structural thickness being equal or above a given thickness threshold.

A metal base plate is rectangular in plan view, has a joining region set on a front surface, and has a center line, which is parallel to a pair of short sides that face each other, set in a middle interposed between the pair of short sides. A ceramic circuit board includes a ceramic board that is rectangular in plan view, a circuit pattern that is formed on a front surface of the ceramic board and has a semiconductor chip joined thereto, and a metal plate that is formed on a rear surface of the ceramic board and is joined to the joining region by solder. Here, the solder contains voids and is provided with a stress relieving region at one edge portion that is away from the center line. A density of voids included in the stress relieving region is higher than other regions of the solder.

Disclosed herein a thin film capacitor that includes a lower electrode layer, an upper electrode layer, and a dielectric layer disposed between the lower electrode layer and the upper electrode layer. The lower electrode layer includes a first metal layer positioned on a side facing the dielectric layer and a second metal layer positioned on a side facing away from the dielectric layer. The first metal layer has a first surface positioned on a side facing the second metal layer and a second surface positioned on a side facing the dielectric layer. The first surface has a surface roughness higher than that of the second surface. The second metal layer reflects a surface property of the first surface.

A glass core wiring substrate incorporating a high-frequency filter having good high-frequency characteristics as a core material and allowing a more efficient arrangement of a conductor in the glass substrate, a module including the same, and a method of manufacturing the glass core wiring substrate incorporating a high-frequency filter. A conductive layer in a glass through a hole in a glass core substrate has a structure in which a hollow cylindrical conductor layer on a side wall of the glass through hole is connected to a cover conductor layer covering one of two openings of the glass through hole. To achieve such a structure, a carrier is attached to one surface of the glass core substrate to cover one of the openings of the glass through hole, and the carrier is peeled off and removed after lamination of the conductor.

A ceramic circuit board includes a ceramic base material, a metal layer (first metal layer), and a marker portion. The marker portion is formed on the surface of the first metal layer. The surface of the metal layer (first metal layer) may be plated. When the surface of the metal layer (first metal layer) is plated, the marker portion may be formed on the plating.

A stretchable mounting substrate that includes a first substrate including a stretchable base material and a stretchable wiring on the stretchable base material; a second substrate including a wiring for an electronic component, the second substrate overlapping at least a part of the first substrate in a plan view of the stretchable mounting substrate; and a connection member connecting the first substrate and the second substrate, the connection member including a connection base material and a connection wiring connecting the stretchable wiring of the first substrate and the wiring of the second substrate 20, wherein the connection member is configured to be deformed in accordance with an expansion/contraction direction of the first substrate so that an expansion/contraction ratio of a region of the first substrate overlapping the second substrate in the plan view is larger than an expansion/contraction ratio of the second substrate.

A circuit board for a light-emitting diode assembly according to an embodiment includes a substrate layer, dimming zones formed on one surface of the substrate layer, each of the dimming zones comprising a predetermined number of LED landing pads, and a wiring bundle disposed between the dimming zones neighboring in a row direction to extend in a column direction, the wiring bundle including wirings connected to the LED landing pads at the same level.