A flexible printed wiring board according to an aspect of the present disclosure is a flexible printed wiring board including a base film and a plurality of wiring lines disposed on a front surface of the base film. Each of the wiring lines has a front end surface extending in a longitudinal direction of the wiring line and two side surfaces extending in the longitudinal direction, and the side surfaces have an arithmetical mean roughness Ra of 0.05 .Math.m to 2.0 .Math.m. The wiring lines have an average height of 40 .Math.m to 120 .Math.m. The wiring lines have an average spacing of 1 .Math.m to 30 .Math.m.

A folding displayer support and a display apparatus are provided. The folding displayer support includes a support body, the support body is provided with at least one first bending region extending in a first direction, at least one second bending region extending in a second direction, and at least one bidirectional bending region located at a position where the first bending region intersects with the second bending region, and an included angle is formed between the first direction and the second direction. The first bending region is provided with a first mesh pattern, the second bending region is provided with a second mesh pattern, the bidirectional bending region is provided with a third mesh pattern, a proportion of holes of the first mesh pattern and a proportion of holes of the second mesh pattern are less than a proportion of holes of the third mesh pattern.

The capillary transfer technology presented here represents a powerful approach to transfer soft films from surface of liquid onto a solid substrate in a fast and defect-free manner. The fundamental theoretical model and transfer criteria validated with comprehensive experiments and finite element analyses, for the first time provides a quantitative guide and optimization for the choice of material systems, operating conditions and environments for scalable on-demand transfers with high yield. The intrinsically moderate capillary transfer force and externally selectable transfer direction offer robust capabilities for achieving deterministic assembly and surface properties of structures with complex layouts and patterns for potentially broad applications in the fabrication of flexible/stretchable electronics, surface wetting structures and optical devices. Integration of this technology with other advanced manufacturing technologies associated with material self-assembly, growth and layout alignment represents promising future topics and would help create emerging new manufacturing technologies that leverage unique fluidity of liquid environments.

The circuit board according to the present invention includes a wiring portion and a non-wiring portion, the wiring portion having a metal layer and a resin layer, the non-wiring portion having a resin layer, the resin layer at a frequency 10 GHZ having a relative permittivity of from 2 to 3 at 23° C., and the circuit hoard satisfying a relationship: (A−B)/B≤0.1 wherein A is the maximum value of the thickness in the wiring portion (μm) and B is the minimum value of the thickness in the non-wiring portion (μm).

A method for manufacturing a flexible circuit board capable of transmitting high frequency signals with reduced attenuation includes providing an inner wiring board including a first conductive wiring layer and a first substrate layer, the first conductive wiring layer including a signal line and two ground lines on both sides of the signal line, the first substrate layer covering a side of the first conductive wiring layer and defining first through holes which expose the signal line; providing two copper clad laminates including a second substrate layer and a copper foil, the second substrate layer having second through hole aligned with the first through holes; laminating the two copper clad laminates onto two sides of the inner wiring board via two adhesive layers, each adhesive layer defining third through holes aligned with the first and second through holes; and forming a second conductive wiring layer from the copper foil.

A composite metal foil and a preparation method thereof are provided. The composite metal foil includes a carrier layer, a barrier layer, a striping layer, and a metal foil layer. The carrier layer, the barrier layer, the striping layer, and the metal foil layer are sequentially stacked, the barrier layer includes a metal bonding layer and a high-temperature resistant layer stacked, and the metal bonding layer is disposed between the carrier layer and the high-temperature resistant layer. The striping layer is disposed between the carrier layer and the metal foil layer so as to facilitate peeling of the carrier layer, and the barrier layer is disposed between the carrier layer and the metal foil layer so as to prevent the carrier layer and the metal foil layer from diffusing mutually to cause bonding at a high temperature, so that the carrier layer and the metal foil layer are easy to peel off. In addition, the metal bonding layer is disposed between the carrier layer and the high-temperature resistant layer, so that the barrier layer is not easy to separate from the carrier layer, and peeling between the barrier layer and the carrier layer is prevented.

An electronic device includes a housing including a front plate and a rear plate disposed opposite the front plate, and a display disposed in a space between the front plate and the rear plate, and disposed at least partially along the front plate. The electronic device further includes a first antenna structure disposed in the space and configured to transmit or receive a first signal in a first frequency band, wherein the first antenna structure includes at least one first conductive pattern. The electronic device also includes a second antenna structure disposed in the space without being overlapped with the first conductive pattern when viewed from above the rear plate, and configured to transmit or receive a second signal in a second frequency band different from the first frequency band. In addition, the electronic device includes a conductive sheet disposed in the space and on the rear plate. The conductive sheet is physically separated from the first conductive pattern, and at least partially overlapped with the first conductive pattern when viewed from above the rear plate.

A preparation method of a conductive elastomer includes the following steps: (1) according to the mass percent of 20˜75%, dissolving the metallic salts into deionized water to form an electrolyte solution, wherein said metallic salts is either of magnesium nitrate, sodium nitrate, zinc nitrate, cesium nitrate, calcium nitrate, neodymium nitrate, aluminum nitrate, potassium nitrate, potassium chloride, magnesium chloride, calcium chloride, sodium chloride, zinc chloride, cesium chloride, aluminum chloride or their combinations; (2) according to the mass percent of 10˜40%, mixing starches into the electrolyte solution prepared in step (1), then at the temperature of 33˜120 ° C., stirring to gelatinize the starches, forming a viscous liquid; (3) standing the viscous liquid obtained in step (2) at 25˜90° C. for 10 min to 48 h to obtain the conductive elastomer.

A method of making an electronic device may include forming at least one circuit layer that includes solder pads on a substrate and forming at least one liquid crystal polymer (LCP) solder mask having mask openings therein. The method may also include forming at least one thin film resistor on the LCP solder mask and coupling the at least one LCP solder mask to the substrate so that the at least one thin film resistor is coupled to the at least one circuit layer and so that the solder pads are aligned with the mask openings.

A package carrier including a flexible substrate, a first build-up structure and a second build-up structure is provided. The flexible substrate has a first surface and a second surface opposite to each other, and has a first opening connected between the first surface and the second surface. The first build-up structure is disposed on the first surface and covers the first opening. The second build-up structure is disposed on the second surface and has a second opening, and the first opening and the second opening are connected to each other to form a chip accommodating cavity together. In addition, a manufacturing method of the package carrier and a chip package structure having the package carrier are also provided.