Disclosed is a motor or generator comprises a rotor and a stator, wherein the rotor has an axis of rotation and is configured to generate first magnetic flux parallel to the axis of rotation, the stator is configured to generate second magnetic flux parallel to the axis of rotation, and at least one of the rotor or the stator is configured to generate a magnetic flux profile that is non-uniformly distributed about the axis of rotation. Also disclosed is a method that involves arranging one or more magnetic flux producing windings of a stator non-uniformly about an axis of rotation of a rotor of an axial flux motor or generator.

An electrical device heat dissipation structure includes an air blowing device, a casing, and a mating connector. The casing is disposed with at least one air outlet, an electrical connector and a power supply. The power supply provides power to the air blowing device. The mating connector has a chip. The mating connector is electrically connected with the electrical connector. The air blowing device is configured to blow air to the mating connector through the at least one air outlet, so as to improve dissipation of heat generated by the chip at work, and to reduce a temperature of the mating connector.

Disclosed is an electronic device comprising a first component, a second component, and a signal path interface coupled between the first component and the second component, the signal path interface including a printed circuit board (PCB) having a rigid PCB portion and a flexible PCB portion, wherein a first signal line and a second signal line extend through the rigid PCB portion and the flexible PCB portion for transmitting signals from the first component to the second components, and a plurality of ground lines extend through the rigid PCB portion and the flexible PCB portion, and wherein each of the plurality of ground lines extending through the rigid PCB portion is connected to one or more conductive layers through conductive vias.

An electronic device includes a circuit board having a signal detection terminal disposed on a first surface thereof and a ground terminal disposed on a second surface thereof and extending vertically so that the first surface and the second surface face each other in a horizontal direction, a monitoring terminal connected with the signal detection terminal, and a microcontroller unit (MCU) determining whether there is submersion by monitoring a voltage at the monitoring terminal. According to the present embodiments, it is possible to prevent hypersensitivity-induced misdetection due to condensation and dew. It is also possible to stepwise respond to submersion and determine whether the monitoring circuit normally operates to precisely detect submersion.

A telematics device includes a housing, and first and second circuit boards. An electronic control unit of the telematics device is arranged on the first circuit board. At least one antenna of the telematics device is arranged on the second circuit board. The first circuit board and the second circuit board are arranged together in the housing. The first circuit board and the second circuit board are coupled by means of at least one electrical connecting element.

A connector with a tolerance module includes a socket and a plug adapted to the socket, wherein the socket includes a first housing, the plug includes a tolerance module and a third housing, the tolerance module includes a second housing, the second housing includes second contact members, the second housing is movably arranged on the third housing in a direction perpendicular to the axial direction of the connector, and the second contact members are floatingly assembled in the second housing to enable displacement in the direction perpendicular to the axial direction of the connector. The second housing only generates translational motion without displacement when the connector is inserted. The tolerance of the plug and the socket is realized by the floating assembly of the second contact members in the second housing.

A pressing device includes a screw body. The screw body includes a screw head that comprises a driver interface. The screw body also includes a screw shaft that comprises a screw tip opposite the screw head with respect to the screw shaft, exterior spiral threads between the screw head and screw tip, and an interior cavity with an opening at the screw tip. The pressing device also includes a pin partially inserted into the interior cavity. The pin comprises a first pin end inserted into the interior cavity, a pin shaft that is connected to the first pin end, and a second pin end that is connected to the pin shaft and that is exterior to the interior cavity. Applying a force to the second pin end in a direction towards the screw head causes the pin shaft to advance into to interior cavity.

A display device includes a display panel, a first circuit board, a control unit disposed on the first circuit board, a second circuit board, and a coupling film which electrically couples the control unit and the second circuit board to each other. The coupling film includes a first coupling part including a first region attached to the first circuit board, and a second region overlapping the display panel when viewed in a thickness direction of the display panel, a second coupling part including a third region attached to the second circuit board, and a fourth region overlapping the display panel when viewed in the thickness direction of the display panel, and a third coupling part coupled to each of the second region and the fourth region to electrically couple the first coupling part and the second coupling part to each other.

The present disclosure relates to a transition system, which includes a monolithic microwave integrated circuit (MMIC) package and a printed-circuit-board (PCB) with a number of PCB vias. The MMIC package has a laminate-based body, which includes a substrate integrated waveguide (SIW) structure with a number of SIW vias, and a MMIC die over the laminate-based body. Herein, the SIW structure faces the PCB and is separate from the PCB with a gap in between. The SIW structure is configured to radiate radio frequency (RF) signals received from the MMIC die to the PCB. An arrangement of the PCB vias is scaling-mirrored to an arrangement of the SIW vias, such that each PCB via and a corresponding SIW via have a same relative position. The arrangement of PCB vias is about aligned with the arrangement of the SIW vias.

A motherboard including a main circuit board, a first connector, a power circuit board and a second connector. The first connector is disposed on the main circuit board. A periphery of the power circuit board is spaced apart from a periphery of the main circuit board. The second connector is disposed on the power circuit board. The first cable electrically connects the first connector with the second connector.