A wiring module includes a first flexible printed circuit and a second flexible printed circuit that is separate from the first flexible printed circuit. The first flexible printed circuit and the second flexible printed circuit are arranged so as to be continuous in a first direction and are shaped as a band that extends in the first direction. A connector is mounted to each of the first flexible printed circuit and the second flexible printed circuit. The fitting direction in which the connector mounted to the first flexible printed circuit is fitted to a partner connector is different from the fitting direction in which the connector mounted to the second flexible printed circuit is fitted to a partner connector.

A sensor apparatus according to an embodiment of the present technology includes a substrate, one or more first IMU sensors, and one or more second IMU sensors. The substrate has a first surface and a second surface opposite to the first surface. The one or more first IMU sensors are arranged on the first surface. The one or more second IMU sensors are arranged on the second surface. By arranging the IMU sensors on both the first surface and the second surface, it is possible to reduce the size the apparatus and to suppress a deformation of the substrate due to heat. This makes it possible to realize a highly accurate measurement based on a detection result (sensing result) of a plurality of IMU sensors.

A display device includes a pixel array substrate and a circuit board. The pixel array substrate has a first surface, a second surface opposite to the first surface, and a first side surface connecting the first surface and the second surface. Multiple bonding pads are located on the first surface. The circuit board is bent from above the first surface of the pixel array substrate to below the second surface. The circuit board is electrically connected to the bonding pads and includes a thermoplastic substrate. The thermoplastic substrate includes a third surface facing the pixel array substrate and a fourth surface opposite to the third surface. The thermoplastic substrate includes a first bend formed by thermoplastics.

An electronic module, comprising an inductor, a first circuit board, and a second circuit board, wherein the first circuit board is disposed on a lateral surface of the body of the inductor with at least one electronic device being disposed on the first circuit board, wherein the second circuit board is disposed under the body of the inductor and electrically connected to the inductor.

Provided is an electronic device including a first housing, a second housing, a flexible housing including a hinge structure, a first printed circuit board disposed in the first housing, a second printed circuit board disposed in the first housing, laminated on one surface of the first printed circuit board facing a second direction and including a connector on one surface facing the second direction, a flexible printed circuit board connected with the connector, extending from the second housing through the hinge structure to the first housing, a rib supporting the first printed circuit board, disposed between the first printed circuit board and a first surface, including a through hole through which part of the flexible printed circuit board passes, extending in the second direction from one end, and at least one sealing member sealing a space between the through hole and part of the flexible printed circuit board.

An electronic device may include a display module, a connecting member including a bending portion connected to a display panel of the display module and extending toward a rear surface of the display module, and a protective layer formed of an insulating material to cover the bending portion, a printed circuit board disposed on a rear surface of the display module and connected to the display module by the connecting member, a frame disposed to surround at least a portion of the display module and formed of a conductive material, a side member including a first partition wall portion disposed between the frame and the display module to be spaced apart from the frame and a second partition wall portion disposed to be spaced apart from the display module and coveting at least a portion of an outer periphery of the display module.

An optical device may include an optical subassembly and a digital signal processor (DSP). The optical device may include a radio frequency (RF) interconnect that electrically connects the optical subassembly and the DSP. The optical device may include a passive RF filter on one or more transmission lines of the RF interconnect.

The present invention relates to a substrate unit and a substrate assembly, and a camera module using the same. The present invention may comprise: a first substrate part having rigidity; a second substrate part stacked on one surface of the first substrate part and having flexibility; a third substrate part extending outwardly from the second substrate part and having flexibility; and a reinforcing part which is disposed at a portion where the edge portions of the first substrate part and the third substrate part meet, the reinforcing part having a recessed portion which is formed by recessing the first substrate part inwardly so as to inhibit interference between the first substrate part and the third substrate part. The present invention is capable of resolving the interference between a rigid PCB and a flexible PCB and the tearing thereof by providing a reinforcing part in a connection portion of the rigid PCB and the flexible PCB.

A display device may include a display panel having a display area and a non-display area located in a first direction from the display area, a printed circuit board located in the first direction from the non-display area and configured to generate a signal, a driving film connected to the non-display area of the display panel and configured to drive the display panel in response to the signal, and a connecting film having a first end connected to the non-display area of the display panel and a second end connected to the printed circuit board. The connecting film electrically connects the printed circuit board and the driving film.

A package board according to an embodiment includes a first core layer having a first surface and a second surface that face each other, a feeding wiring extending on the first surface of the first core layer, a first via structure penetrating through the first core layer, a first connection pad disposed on the second surface of the first core layer to be electrically connected to the feeding wiring through the first via structure, the first connection pad including a head portion in contact with the first via structure and an extension portion protruding from the head portion, and a first connector mounted on the second surface of the first core layer, the first connector including a first terminal electrically connected to the extension portion of the first connection pad.