An object includes an electro-optic display device provided with an optically active element, the optical properties thereof can be modified by applying an electric voltage or current between at least one electrode and one corresponding auxiliary electrode, between which the optically active element is disposed. The object further includes a middle part which delimits an opening closed by a crystal including a bottom surface beneath which the electro-optic display device is arranged. The crystal is provided with an opaque frame which is made remotely from the edges of the opening and which covers the contour of the electro-optic display device so as to conceal electrical connection elements. The electro-optic display device defines an active display area which is confined by the opaque frame, such that, when the electro-optic display device is activated and displaying information, a transparent area remains between the opaque frame and the edges of the opening.

An information handling system may include an organic light-emitting diode (OLED) display layer of a video display to display an image to a user; an A-cover forming a housing behind the OLED display layer; and a physically bifurcated display daughter board between the OLED display layer and the A-cover, the physically bifurcated display daughter board including: a first portion of the display daughter board including a source driver integrated circuit (IC) operatively coupled to a processor to receive graphics data; and a second portion of the display daughter board comprising a power management integrated circuit (PMIC) operatively coupled to the first portion and a power source; the second portion of the display daughter board being mechanically coupled to an interior surface of the A-cover to dissipate heat away from the OLED display layer.

A display device includes a display panel including panel pads adjacent to the side surface of a display panel; connection pads disposed on the side surface of the display panel and connected to the panel pads; and a circuit board disposed on the side surface of the display panel and including lead signal lines directly bonded to the connection pads, wherein the connection pads include a first connection pad, a second connection pad disposed on the first connection pad, and a third connection pad disposed on the second connection pad, and the first connection pad is in contact with corresponding one of the panel pads, and the third connection pad is directly bonded to corresponding one of the lead signal lines.

The present disclosure relates to a display apparatus and an electronic device, relating to the technical field of display. The display apparatus may comprise a display panel, a main circuit board, a bridging circuit board, and a first shielding adhesive tape. The main circuit board may be provided on the back surface of the display panel; the bridging circuit board may be provided at the side of the main circuit board distant from the display panel, and may be connected to the main circuit board in a binding mode; and the first shielding adhesive tape may be provided at the side of the main circuit board distant from the display panel, and expose the bridging circuit board.

An integrated electro-optical circuit board comprises a first flexible substrate having a top side and a bottom side, at least one first optical circuit on the bottom side of the first flexible substrate connected to the top surface through a filled via, at least one first metal trace on the top side of the first flexible substrate, an optical adhesive layer connecting the bottom side of the first flexible substrate to a top side of a second flexible substrate, and at least one second metal trace on a bottom side of the second flexible substrate connected by a filled via through the second flexible substrate, the optical adhesive layer, and the first flexible substrate to the at least one first metal trace.

A vibration isolator and method of assembly utilize “flex circuits” to provide both vibration/shock isolation and integrated electrically isolated conductive paths to support lightweight devices (<100 grams) such as crystal oscillators, IC chips, MEMs devices and the like. Each flex circuit includes a least one polymer layer and at least one of the flex circuits includes at least one patterned conductive layer. The isolator may be integrally formed from a stack of polymer layers and patterned conductive layers to provide the plurality of flex circuits, platform and connectors. Most typically, flex circuits are Type 4 in which the multiple polymer layers have a loose leaf or bonded configuration. Flex circuits are easy to produce in large quantities at low cost with standardized and repeatable performance characteristics.

The application discloses a dual-layer display assembly and a display device. The dual-layer display assembly includes a first display screen, a second display screen, a first print circuit board, a second print circuit board and a fixing structure, where the second display screen is arranged in layers with the first display screen; the first print circuit board drives the first display screen; the second print circuit board drives the second display screen; and the fixing structure connects and fixes the first print circuit board and the second print circuit board.

A display unit includes a display panel, a circuit board bent from a front surface of the display panel toward a rear surface of the display panel, a window disposed on the front surface of the display panel to cover an active area, and a cover panel film disposed on the rear surface of the display panel and disposed between the display panel and the circuit board. The cover panel film includes a first portion overlapping with the display panel, and a second portion extending from the first portion to protrude from the display panel when viewed in a plan view. The second portion is disposed between the circuit board and the window when viewed in a cross-sectional view.

An array substrate includes a glass substrate GS, an alignment mark 29, and first traces 19. The glass substrate GS has a corner portion 30 having an outline defined by a first edge portion 11b1 and a second edge portion 11b2 crossing the first edge portion 11b1. The alignment mark 29 is disposed at the corner portion 30 and used as the positioning index in mounting a driver 21 and a flexible printed circuit board 13. The alignment mark 29 at least includes first and second side portions 29a, 29b parallel to the first and second edge portions 11b1, 11b2, respectively. One end of the second side portion 29b is continuous to one end of the first side portion 29a. The alignment mark 29 has an outline that is on a same plane with a reference line BL connecting other ends of the first side portion 29a and the second side portion 29b linearly. The first traces 19 include inclined portions 31 that are inclined with respect to the first and second side portions 29a, 29b along the reference line BL.

An electrical device heat dissipation structure includes an air blowing device, a casing, and a mating connector. The casing is disposed with at least one air outlet, an electrical connector and a power supply. The power supply provides power to the air blowing device. The mating connector has a chip. The mating connector is electrically connected with the electrical connector. The air blowing device is configured to blow air to the mating connector through the at least one air outlet, so as to improve dissipation of heat generated by the chip at work, and to reduce a temperature of the mating connector.