An electronic module, comprising an inductor, a first circuit board, and a second circuit board, wherein the first circuit board is disposed on a lateral surface of the body of the inductor with at least one electronic device being disposed on the first circuit board, wherein the second circuit board is disposed under the body of the inductor and electrically connected to the inductor.

The present invention relates to a substrate unit and a substrate assembly, and a camera module using the same. The present invention may comprise: a first substrate part having rigidity; a second substrate part stacked on one surface of the first substrate part and having flexibility; a third substrate part extending outwardly from the second substrate part and having flexibility; and a reinforcing part which is disposed at a portion where the edge portions of the first substrate part and the third substrate part meet, the reinforcing part having a recessed portion which is formed by recessing the first substrate part inwardly so as to inhibit interference between the first substrate part and the third substrate part. The present invention is capable of resolving the interference between a rigid PCB and a flexible PCB and the tearing thereof by providing a reinforcing part in a connection portion of the rigid PCB and the flexible PCB.

An automated and/or motorized spatial frame including a control unit and a plurality of motorized struts is disclosed. The control unit being configured as a controller for exchanging data with an external computing system, exchanging data with the plurality of motorized struts, and delivering power to the motorized struts. Thus arranged, the control unit may be configured as a fully integrated power supply and controller for powering and controlling the motorized struts. In some embodiments, the control unit includes a plurality of PCB modules, each positioned within the spaces or pockets formed between adjacent tabs on a ring of the frame. The PCB modules being detachably coupled to the ring. In some embodiments, the PCB modules may be detachably coupled to the ring via interconnecting male and female connectors. Alternatively, the PCB modules may be detachably coupled to the ring via a plurality of brackets.

Provided according to an exemplary embodiment is a heater for an aerosol generation device, the heater comprising a plurality of segments combined together to form an insertion portion into which an object-to-be-heated is inserted; one or more electrically conductive tracks printed on one surface of each of the plurality of segments and disposed toward the object-to-be-heated; and an elastic member configured to surround at least a part of the plurality of segments.

An electrical device heat dissipation structure includes an air blowing device, a casing, and a mating connector. The casing is disposed with at least one air outlet, an electrical connector and a power supply. The power supply provides power to the air blowing device. The mating connector has a chip. The mating connector is electrically connected with the electrical connector. The air blowing device is configured to blow air to the mating connector through the at least one air outlet, so as to improve dissipation of heat generated by the chip at work, and to reduce a temperature of the mating connector.

A sensor device includes a mounting member having fixation surfaces inside, and at least one electronic component directly or indirectly fixed to the fixation surfaces of the mounting member, and the mounting member constitutes a part of a casing for housing the electronic component. Further, the fixation surfaces are perpendicular to each other.

The present disclosure provides a chip packaging structure including at least one chip packaging unit. The chip packaging unit includes a flexible substrate and a rigid substrate. The flexible substrate includes a first flexible substrate body, and a plurality of input pads and a plurality of output pads arranged on the first flexible substrate body, wherein the input pads and the output pads are connected in one-to-one correspondence. The rigid substrate includes a rigid substrate body and a chip arranged on the rigid substrate body, wherein the rigid substrate is bonded to a drive printed circuit board of a display device. Two opposite sides of the flexible substrate are respectively bonded to the rigid substrate and a display panel of the display device. The plurality of input pads are electrically connected to the chip, and the plurality of output pads are configured to transmit signals to the display panel.

An object of the present invention is to decrease the resistance of a power supply line, to suppress a voltage drop in the power supply line, and to prevent defective display. A connection terminal portion includes a plurality of connection terminals. The plurality of connection terminals is provided with a plurality of connection pads which is part of the connection terminal. The plurality of connection pads includes a first connection pad and a second connection pad having a line width different from that of the first connection pad. Pitches between the plurality of connection pads are equal to each other.

Disclosed is an electronic device comprising a first component, a second component, and a signal path interface coupled between the first component and the second component, the signal path interface including a printed circuit board (PCB) having a rigid PCB portion and a flexible PCB portion, wherein a first signal line and a second signal line extend through the rigid PCB portion and the flexible PCB portion for transmitting signals from the first component to the second components, and a plurality of ground lines extend through the rigid PCB portion and the flexible PCB portion, and wherein each of the plurality of ground lines extending through the rigid PCB portion is connected to one or more conductive layers through conductive vias.

A system for the assembly of circuit boards is shown. The system includes an assembly device and a circuit board. The assembly device comprises a substantially planar base plate and guide members. The circuit board includes multiple rigid portions connected by flexible members. The guide members extend into a space partially or completely enclosed in the horizontal direction by the circuit board, and determine the position and orientation of the rigid portions relative to the base plate.