Provided is a structure including a first conductor plane (101); a second conductor plane (102); a first transmission line (104) that is formed in a layer different from the first conductor plane (101) and the second conductor plane (102); a second transmission line (105) that is disposed so as to face the second conductor plane (102) in a layer opposite to the first transmission line (104) with respect to the second conductor plane (102); a first conductor via (103) that connects one end of the first transmission line (104) with the first conductor plane (101); a second conductor via (106) that connects another end of the first transmission line (104) with one end of the second transmission line (105); and a slit (107) that is formed on the second conductor plane (102).

A power line structure includes a dielectric layer, a first conductive component, a second conductive component, and a third conductive component. The first conductive component is disposed at a first side of the dielectric layer. The second conductive component is disposed at the first side of the dielectric layer. The third conductive component is disposed at the first side of the dielectric layer and between the first conductive component and the second conductive component. Each of the voltage of the first conductive component and the second conductive component is equal to a ground voltage. The third conductive component is configured to receive a first power voltage.

In one embodiment, an apparatus generally comprises a printed circuit board comprising a first side, a second side, and a plurality of power vias extending from the first side to the second side, the first side configured for receiving an application specific integrated circuit (ASIC), and a power delivery board mounted on the second side of the printed circuit board and comprising a power plane interconnected with power vias in the power delivery board to electrically couple voltage regulator modules and the ASIC. The voltage regulator modules are mounted on the second side of the printed circuit board.

A package structure including a circuit board and a heat generating element is provided. The circuit board includes a plurality of circuit layers and a composite material layer. A thermal conductivity of the composite material layer is between 450 W/mK and 700 W/mK. The heat generating element is disposed on the circuit board and electrically connected to the circuit layers. Heat generated by the heat generating element is transmitted to an external environment through the composite material layer.

A multilayer substrate includes a pair of first capacitor electrodes, a pair of second capacitor electrodes, and a dielectric substrate. Electrodes of the pair of first capacitor electrodes are disposed in dielectric substrate so as to face each other in a thickness direction of the dielectric substrate. Electrodes of the pair of second capacitor electrodes are disposed in the dielectric substrate so as to face each other in the thickness direction. A first element and a second element that are disposed in or on the dielectric substrate, and the pair of second capacitor electrodes, the pair of first capacitor electrodes, and a ground electrode that are disposed in the dielectric substrate are arranged in the stated order in the thickness direction. The pair of second capacitor electrodes at least partially overlaps the pair of first capacitor electrodes when viewed in plan in the thickness direction.

A multiple layer printed circuit board (PCB) in which the cores (or core layers) are removed and replaced with prepreg layers, which provide structure integrity for the PCB. Such a multi-layer PCB may include a plurality of layers that include a plurality of signal layers, a plurality of ground plane layers, a plurality of inner signal layers, and a single core substrate layer. Each layer in the plurality of layers may be separated from every other layer in the plurality of layers by at least one prepreg substrate layer.

An apparatus includes a substrate, a switching device, a capacitor device, a first via, a second via, a third via and a fourth via. The substrate has a first surface and a second surface and includes a plurality of copper layers including M positive copper layers and N negative copper layers. The M positive copper layers and the N negative copper layers are alternated. The switching device is disposed on the first surface and includes a switching positive terminal and a switching negative terminal. The capacitor device is disposed on the first surface and includes a capacitor positive terminal and a capacitor negative terminal, and the capacitor device forms a capacitor area. The projections of the adjacent positive and negative copper layers and the capacitor area on the first surface at least partially overlap with each other.

A LED based lighting apparatus is disclosed. The light engine used in the lighting apparatus may use printed circuit board and have a plurality of LED groups that are independently controllable by a control unit. The power supply input and return paths connected to each LED group may be implemented on different layers to allow a compact footprint that may be used with traditional fluorescent encasements with relatively little modification. The LEDs may comprise a subset of LEDs having a first colour and a subset of LEDs having a second colour different from said first colour intertwined on the light engine.

A flexible cable includes an elongated flexible substrate including first and second surfaces on opposite sides thereof, a first capacitor electrode provided on the first surface side of the flexible substrate, the first capacitor electrode extending from a first end of the flexible substrate toward a second end of the flexible substrate, a second capacitor electrode provided on the second surface side of the flexible substrate, the second capacitor electrode extending from the second end of the flexible substrate toward the first end of the flexible substrate, a first connection portion provided at an end of the first capacitor electrode located at the first end of the flexible substrate, and a second connection portion provided at an end of the second capacitor electrode located at the second end of the flexible substrate.

A capacitor module includes a circuit board including a positive conductor part and a negative conductor part, and capacitors mounted on the circuit board. The capacitors have the same capacitance and the same inner current path structure. The capacitors are arranged in a direction perpendicular to main current directions of the inner current path structures of the capacitors. Each adjacent two of the capacitors are connected to the positive conductor part and the negative conductor part such that the main current directions thereof are opposite in direction to each other.