Provided is a wiring circuit board that includes a first insulating layer, a conductive pattern disposed on the first insulating layer, and a second protective layer disposed between the first insulating layer and protecting the conductive pattern. The second protective layer consists of a metal oxide.

There is provided an electronic circuit apparatus in which the heat generated at an electronic component can be transferred to a heat spreader efficiently. An electronic circuit apparatus includes a dielectric substrate, an electronic component, a heat spreader, and a conductive via. The conductive via electrically and thermally connects the electronic component and the heat spreader. The conductive via extends from the first surface to at least an interior of the heat spreader and is in surface-contact with the heat spreader.

A method of manufacturing a component carrier includes (i) forming a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure; (ii) assembling a component to the stack; and (iii) forming a thermally conductive tongue having an embedded portion embedded in the stack and having an exposed portion protruding beyond the stack, where a first width of the tongue in the embedded portion is different from a second width of the tongue in the exposed portion. A corresponding component carrier includes analogous features.

A selective segment via plating process for manufacturing a circuit board selectively interconnects inner conductive layers as separate segments within the same via. Plating resist is plugged into an inner core through hole and then stripped off after an electroless plating process. Stripping of the electroless plating on the plating resist results in a plating discontinuity on the via wall. In a subsequent electroplating process, the inner core layer can not be plated due to the plating discontinuity. The resulting circuit board structure has separate electrically interconnected segments within the via.

Provided is an FPC, including a first row of gold fingers and a second row of gold fingers disposed on a same layer, and multiple first connection lines. The first row of gold fingers includes multiple first gold fingers extending in a first direction and arranged in a second direction. The second row of gold fingers includes multiple second gold fingers extending in the first direction and arranged in the second direction. The multiple first connection lines are disposed in a different layer from the second row of gold fingers, electrically connected to the multiple first gold fingers, and insulated from the multiple second gold fingers and extend to an area where the second row of gold fingers is located. The first connection line includes a first wire and a second wire. The first wire includes a first portion, a second portion and a third portion connected in sequence.

An electrical power assembly, comprising: at least one multilayer base structure, at least one power device embedded in the at least one multilayer base structure, an internal electrically conductive layer positioned on each side of the multilayer base structure, the internal electrically conductive layer being connected to a respective electrical contact of the power device through connections arranged in the multilayer base structure; at least one external electrically conductive layers positioned on each side of the base structure, each external electrically conductive layer comprising at least one pre-drilled through hole, at least one internal electrically insulating layer positioned between the internal electrically conductive layer of the base structure and a respective external electrically conductive layer, at least one hole arranged in the internal electrically insulating layer and the external electrically conductive layer, a portion of each hole being formed by the pre-drilled through hole, the at least one hole being filled with electrically conductive material to form external conductive vias to connect the internal electrically conductive layer to the respective external electrically conductive layer.

A method of manufacturing a component carrier includes (i) forming a stack having at least one electrically conductive layer structure and/or at least one electrically insulating layer structure; (ii) assembling a component to the stack; and (iii) forming a thermally conductive tongue having an embedded portion embedded in the stack and having an exposed portion protruding beyond the stack, where a first width of the tongue in the embedded portion is different from a second width of the tongue in the exposed portion. A corresponding component carrier includes analogous features.

A wiring circuit board includes a metal support board, a first metal thin film, an insulating layer, a second metal thin film, and a conductive layer in a thickness direction order. The insulating layer includes a through hole penetrating in the thickness direction, which includes a first opening end at the first metal thin film side, a second opening end opposite to the first opening end, and an inner wall surface between the first and-the second opening ends. The first metal thin film includes a first opening portion, which overlaps the first opening end in a projection view in the thickness direction. The second metal thin film includes a second opening portion, which overlaps the first opening portion and the second opening end in a projection view in the thickness direction. The conductive layer has a via portion disposed in the through hole and connected to the metal support board.

A printed circuit board includes an insulating layer, and a first wiring layer at least partially embedded in one surface of the insulating layer, one surface of the first wiring layer being exposed from the one surface of the insulating layer. The insulating layer includes a first insulating layer covering at least a portion of a side surface of the first wiring layer, and a second insulating layer disposed on the first insulating layer and the first wiring layer, and the first and second insulating layers include different insulating materials.

Provided is an FPC, including a first row of gold fingers and a second row of gold fingers disposed on a same layer, and multiple first connection lines. The first row of gold fingers includes multiple first gold fingers extending in a first direction and arranged in a second direction. The second row of gold fingers includes multiple second gold fingers extending in the first direction and arranged in the second direction. The multiple first connection lines are disposed in a different layer from the second row of gold fingers, electrically connected to the multiple first gold fingers, and insulated from the multiple second gold fingers and extend to an area where the second row of gold fingers is located. The first connection line includes a first wire and a second wire. The first wire includes a first portion, a second portion and a third portion connected in sequence.