In some embodiments, an apparatus can include a printed circuit board (PCB) that has layers and includes a first portion and a second portion. The first portion can have a data port and a power port. A first layer is associated with data of the first portion of the PCB, and a second layer is associated with power of the first portion of the PCB. The second portion can have a data port and a power port. A third layer is associated with data of the second portion, and a fourth layer is associated with power of the second portion. The first portion or the second portion can have vias defining an electromagnetic interference (EMI) shield. The apparatus can include a power filter and a data filter that can, respectively, isolate power and data of the first portion from the second portion.

Disclosed is an electronic device comprising a first component, a second component, and a signal path interface coupled between the first component and the second component, the signal path interface including a printed circuit board (PCB) having a rigid PCB portion and a flexible PCB portion, wherein a first signal line and a second signal line extend through the rigid PCB portion and the flexible PCB portion for transmitting signals from the first component to the second components, and a plurality of ground lines extend through the rigid PCB portion and the flexible PCB portion, and wherein each of the plurality of ground lines extending through the rigid PCB portion is connected to one or more conductive layers through conductive vias.

A casing for housing a fiber optic transceiver for use in a fiber optic connector can include a top surface, a bottom surface and one or more lateral surfaces, wherein the top surface and at least one or more lateral surfaces are at least in parts electrically conductive, and wherein the bottom surface of the casing comprises one or more solder pads.

An circuit board assembly includes a first circuit board, a second circuit board stacked with the first circuit board, and a connection plate connected between the first circuit board and the second circuit board. The connection plate includes a signal transmission part and at least one ground part at a spacing to the signal transmission part. The ground part can be used as a reference ground for a signal transmitted by the signal transmission part, so that the characteristic impedance of the signal transmission part is controllable, and the signal transmitted by the signal transmission part has strong continuity, thereby maintaining good matching performance and reducing an insertion loss caused by characteristic impedance mismatch.

A high-frequency circuit includes a first electric conductor layer, a first dielectric layer, a circuit layer, a second dielectric layer, a second electric conductor layer arranged in this order, and the circuit layer includes a ground pattern and a transmission line of a high-frequency signal. An electromagnetic wave shield is disposed around the transmission line. The electromagnetic wave shield includes a ground electric conductor on inner surfaces of a plurality of holes extending through the first dielectric layer, the ground pattern, the second dielectric layer, the first electric conductor layer, and the second electric conductor layer. The plurality of holes are a plurality of elongated holes provided at an interval in a direction in which the transmission line is surrounded. In each of the plurality of elongated holes, a longitudinal dimension in the direction in which the transmission line is surrounded is larger than a width dimension.

An apparatus is disclosed comprising first printed circuit board—PCB—and second PCB structure each having a first surface and a second surface and a layer of electrically conductive material on the first surface thereof and being attached to each other in a substantially parallel configuration. A stripline is positioned between the two PCBs. Each one of the first PCB and the second PCB has a plurality of via-holes that are electrically conductive and are connected at one end to the layer of electrically conductive material on the first surface and to an electrically conductive pad on the second surface of the PCB. At least a first electrically conductive pad associated with the first PCB is located in proximity with a first electrically conductive pad associated with the second PCB thereby forming a capacitive configuration.

A circuit board includes a first layer, a second layer, a third layer, a plurality of plating through holes, at least one first intermediate layer and at least one second intermediate layer. The first layer and the second layer are used as reference voltage planes. A plurality of transmission wires are disposed on the third layer. The transmission wires are coupled to a wireless signal transceiver and a plurality of antenna arrays; wherein the third layer is disposed between the first layer and the second layer. The plating through holes are disposed at sides of the third layer, wherein the plurality of plating through holes are configured to connect the first reference voltage plane with the second reference voltage plane. The first intermediate layer is disposed between the first layer and the third layer, and the second intermediate layer is disposed between the second layer and the third layer.

A quantum computer includes a refrigeration system under vacuum including a containment vessel, a qubit chip contained within a refrigerated vacuum environment defined by the containment vessel. The quantum computer further includes a plurality of interior electromagnetic waveguides and a plurality of exterior electromagnetic waveguides. The quantum computer further includes a hermetic connector assembly operatively connecting the interior electromagnetic waveguides to the exterior electromagnetic waveguides while maintaining the refrigerated vacuum environment. The hermetic connector assembly includes an exterior multi-waveguide connector, an interior multi-waveguide connector, and a dielectric plate arranged between and hermetically sealed with the exterior multi-waveguide connector and the interior multi-waveguide connector. The dielectric plate permits electromagnetic energy when carried by the interior and exterior pluralities of electromagnetic waveguides to pass therethrough.

Systems for shielding bent signal lines provide ways to couple different antenna arrays for radio frequency (RF) integrated circuits (ICs) (RFICs) associated therewith where the antenna arrays are oriented in different directions. Because the antenna arrays are oriented in different directions, the antenna structures containing the antennas may be arranged in different planes, and signal lines extending therebetween may include a bend. To prevent electromagnetic interference (EMI) or electromagnetic crosstalk (EMC) from negatively impacting signals on the signal lines, the signal lines may be shielded. The shields may further include vias connecting the mesh ground planes and positioned exteriorly of the signal lines. The density of the vias may be varied to provide a desired rigidity in planes containing the antenna arrays while providing a desired flexibility at a desired bending location in the signal lines to help bending process accuracy.

Proposed are an anodic aluminum oxide structure made of anodic aluminum oxide, a probe head having the same, and a probe card having the same. More particularly, proposed are an anodic aluminum oxide structure that has a fine size and pitch guide hole and facilitates insertion of a probe, a probe head having the same, and a probe card having the same.