RF transistor amplifiers include an RF transistor amplifier die having a Group III nitride-based semiconductor layer structure and a plurality of gate terminals, a plurality of drain terminals, and at least one source terminal that are each on an upper surface of the semiconductor layer structure, an interconnect structure on an upper surface of the RF transistor amplifier die, and a coupling element between the RF transistor amplifier die and the interconnect structure that electrically connects the gate terminals, the drain terminals and the source terminal to the interconnect structure.

A circuit board may include a traditional via electrically coupled to a first layer of the circuit board and coupled to a second layer of the circuit board and a slotted via formed within the circuit board proximate to the traditional via, the slotted via comprising an opening through a first surface and a second surface of the circuit board and a layer of conductive material formed on interior walls of the opening.

A printed circuit board includes an insulating layer; a recess portion disposed on one surface of the insulating layer; and a circuit layer disposed on the one surface of the insulating layer and including a signal pattern and a ground pattern. At least a portion of the ground pattern covers at least a portion of the recess portion.

A printed circuit board (PCB) is provided for transmitting a differential signal. The PCB includes first and second conductive signal layers. The first conductive signal layer includes a first positive trace of the differential signal and a first negative trace of the differential signal. The second conductive signal layer includes a second positive trace of the differential signal and a second negative trace of the differential signal. The first positive trace is adjacent to the first negative trace, and the second positive trace is adjacent to the second negative trace and directly below the first negative trace.

A multi-layer printed circuit board having a first landing pad in a first layer and along a first axis arranged to receive a positive signal and a second landing pad in the first layer and along a second axis that is spaced away from the first axis longitudinally in the first layer and where the second landing pad arranged to receive a negative signal. A first buried in a second layer and along the first axis is spaced away from the first landing pad along the first axis. A second buried in the second layer and along the second axis is spaced away from the second landing pad along the second axis. A first signal connector provides a first electrical connection between the first landing pad and the second buried via and a second signal connector provides a second electrical connection between the second landing pad and the first buried via.

A conductive pattern has been disclosed. The conductive pattern includes a pair of conductive traces. Each of the conductive traces comprises a linear portion and a terminal portion. The terminal portions are arranged adjacent to each other and comprises a pair of circular arc profile with a pair of complementary notches facing toward each other.

A flexible printed circuit includes an insulating base. The insulating base includes a body portion and at least one first extension portion connected to an edge of the body portion. The first extension portion includes a via region, a bending region and a banding region that are sequentially away from the body portion. A plurality of vias are disposed in the via region. The plurality of vias include at least one first via and at least one second via, a center of an orthogonal projection of a first via on a reference plane perpendicular to a thickness direction of the insulating base is located on a first straight line parallel to a bending axis of the bending region, and a center of an orthogonal projection of a second via on the reference plane is not located on the first straight line.

A substrate connection member according to various embodiments of the present invention can comprise a printed circuit board which has a plurality of layers that are stacked and which comprises a front surface, a rear surface, and a side surface encompassing the front surface and the rear surface. The printed circuit board can comprise: an opening part which encompasses a partial region of the printed circuit board and which is penetratingly formed from the front surface to the rear surface; at least one bridge connected between the partial region and the printed circuit board by crossing at least a portion of the opening part; and at least one through-hole wire formed in the partial region from the front surface to the rear surface, wherein the inner surface of the opening part and the side surface of the bridge can be formed from a conductive member. Other various embodiments, in addition to the embodiments disclosed in the present invention, are possible.

A circuit module includes: a multilayer board having a plurality of first through-holes each penetrating at least one layer thereof; a plurality of high frequency components disposed in the plurality of first through-holes, respectively; and a plurality of shield parts individually surrounding the plurality of high frequency components. The multilayer board has a second through-hole penetrating at least a layer in which each high frequency component is disposed. Each of the plurality of shield parts includes a first conductor, a second conductor, and a third conductor. The first conductor and the second conductor sandwich the high frequency component in a lamination direction of the multilayer board. The third conductor is disposed in the second through-hole.

An apparatus comprising a stack of printed circuit board (PCB) layers having a primary longitudinal structure forming a radio frequency (RE) via including a principal tuning section (223) and a constant longitudinal structure (227) along a conductive column support (255) journaled through the layers in the via. The principal section (221) comprising a first tuning sub-assembly (229 A) in a first portion of the RE via above the longitudinal structure (227) and at an entrance of the primary longitudinal structure (221) and comprising a first set of pad, anti-pad pairs (445, 545, 645) tuned to receive an RE band. A second principal tuning sub-assembly (229B) in a second portion of the via below the longitudinal structure (227) and at an exit of the primary longitudinal structure and comprising a second set of pad, anti-pad pairs (445, 545, 645) tuned to receive the band and mirroring the first set of pairs.