A double-sided flexible circuit board includes a flexible substrate, through circuit lines, first circuit lines and second circuit lines. The first circuit lines are formed on a top surface of the flexible substrate and each includes a first segment, a bent segment and a second segment. One end of the first segment is connected to a first connection end of one of the through circuit lines. Both ends of the bent segment are connected to the other end of the first segment and one end of the second segment, respectively. A second distance between the adjacent second segments is greater than a first distance between the adjacent first segments. The second circuit lines are formed on a bottom surface of the flexible substrate and each is connected to a second connection end of one of the through circuit lines.

This application relates to a circuit board assembly. The circuit board assembly includes: a first circuit board. The first circuit board is connected to a connector; and a second circuit board. A first connecting portion is disposed on the second circuit board. The first connecting portion is electrically connected to the connector. The second circuit board includes a top surface and a side surface. The top surface intersects and is perpendicular to the side surface. The first connecting portion is disposed on the top surface, and extends towards the side surface. In this disclosure, the top surface intersects and is perpendicular to the side surface, to improve stability of connection between the connector and the first connecting portion, and improve working stability of the second circuit board, so as to improve working performance of the circuit board assembly and improve user experience.

A circuit board has an edge connector with signal traces. The signal traces are formed on a dielectric layer of the circuit board. A reference trace is formed within the dielectric layer or on another surface of the dielectric layer. Parameters of the reference trace are adjusted to set an impedance of a single-ended signal trace or a differential impedance of two adjacent signal traces.

A display apparatus includes a flexible circuit board including a plurality of first substrate pads and a plurality of second substrate pads, a main circuit board connected to the flexible circuit board, and a display panel including a plurality of first display pads and a plurality of second display pads, where the plurality of first display pads is connected to the main circuit board through the flexible circuit board and each of the plurality of first display pads at least partially overlaps corresponding substrate pad of the plurality of first substrate pads, respectively, and each of the plurality of second display pads at least partially overlaps corresponding substrate pad of the plurality of second substrate pads, respectively.

A single-layer redistribution plate functioning as a space translator between a device under testing (“DUT”) and a testing PCB may comprise a hard ceramic plate. A DUT side of the plate may have pads configured to interface with a device under testing. Both sides of the plate may comprise traces, vias, and pads to fan out the DUT pad pattern so that the plate side opposite the DUT side has spatially translated pads configured to interface with the pads on a testing PCB. Fabricating a redistribution plate may comprise calibrating and aligning, laser milling vias, laser milling trenches and pads, copper plating, grinding and polishing, removing residual copper, and coating the copper surfaces.

A single-layer redistribution plate functioning as a space translator between a device under testing (“DUT”) and a testing PCB may comprise a hard ceramic plate. A DUT side of the plate may have pads configured to interface with a device under testing. Both sides of the plate may comprise traces, vias, and pads to fan out the DUT pad pattern so that the plate side opposite the DUT side has spatially translated pads configured to interface with the pads on a testing PCB. Fabricating a redistribution plate may comprise calibrating and aligning, laser milling vias, laser milling trenches and pads, copper plating, grinding and polishing, removing residual copper, and coating the copper surfaces.

[Object] Provided is a printed circuit board ensuring a degree of freedom in circuit design and unlikely to cause a circuit connection failure.

[Solving Means] A middle interlayer circuit 11, an upper surface side interlayer circuit 12, and a lower surface side interlayer circuit 13 are formed from a connection surface-less integral conductor. In addition, a connection surface 33 between the upper surface side interlayer circuit 12 and an upper surface side surface layer circuit 14 and a connection surface 34 between the lower surface side interlayer circuit 13 and a lower surface side surface layer circuit 15 lack a connection surface in a plate thickness direction, and thus a satisfactory connection state is achieved. Accordingly, a first circuit 10 is unlikely to cause a connection failure. In addition, the upper surface side interlayer circuit 12 and the lower surface side interlayer circuit 13 can be disposed at misaligned positions in the plane direction of the printed circuit board, and thus the degree of freedom in circuit design increases. Plane circuits 24 and 16 not connected to the first circuit can be disposed with insulating layers 31 and 32 sandwiched below the upper surface side interlayer circuit 12 or above the lower surface side interlayer circuit 13.

An electrical connector assembly including an electrical connector and a circuit board is provided. The electrical connector has a metallic plate and a plurality of terminals. The metallic plate separates the terminals into two different areas. The metallic plate has a first lateral surface. The circuit board is assembled to the electrical connector. The circuit board has a plurality of pads, a second lateral surface, and top and bottom surfaces opposite to each other. The pads are disposed on the top and bottom surfaces respectively. The second lateral surface is boarded between the top and bottom surfaces. The circuit board further includes at least one grounding circuit exposed from the second lateral surface and facing toward the first lateral surface. The metallic plate is electrically conducted to the grounding circuit by the first lateral surface when the circuit board is assembled to the electrical connector.

Connector paddle cards are provided with an improved wiring connection geometry that reduces impedance mismatch. One illustrative embodiment is a printed circuit board having, on at least one surface: edge connector traces arranged along a first edge for contacting electrical conductors in a socket connector; an outer set of electrodes arranged parallel to a second edge for attaching exposed ends of sheathed wires in a cable (“outer wires”); and an inner set of electrodes arranged parallel to the second edge for attaching exposed ends of sheathed wires in a cable (“inner wires”), with the electrodes in the inner set being staggered relative to the electrodes in the outer set.

The present disclosure provides a light bar, a backlight assembly and a display device. The light bar includes a substrate; a first metal layer disposed on a first side of the substrate and comprising a plurality of first metal segments disposed at intervals along a length direction of the light bar; a second metal layer disposed on a second side opposite to the first side of the substrate and comprising a plurality of second metal segments disposed at intervals along the length direction of the light bar, a projection of the interval between two adjacent first metal segments on the substrate falls into projections of the second metal segments on the substrate, and a projection of the interval between two adjacent second metal segments on the substrate falls into projections of the first metal segments on the substrate.