A layout structure of flexible circuit board includes a flexible substrate, a circuit layer, a flip-chip element and an anti-stress circuit layer. A chip mounting area and a circuit area are defined on a top surface of the flexible substrate. Bonding circuits and transmission circuits of the circuit layer are disposed on the chip mounting area and the circuit area respectively. The flip-chip element is disposed on the chip mounting area and includes bumps and a chip having a long side margin and conductive pads, the bumps are provided to connect the conductive pads and the bonding circuits. Anti-stress circuits of the anti-stress circuit layer are disposed on the chip mounting area and parallel to the long side margin of the chip, and the bumps are located between the anti-stress circuits and the long side margin of the chip.

Semiconductor device assemblies are provided with a package substrate including one or more layers of thermally conductive material configured to conduct heat generated by one or more of semiconductor dies of the assemblies laterally outward towards an outer edge of the assembly. The layer of thermally conductive material can comprise one or more allotropes of carbon, such as diamond, graphene, graphite, carbon nanotubes, or a combination thereof. The layer of thermally conductive material can be provided via deposition (e.g., sputtering, PVD, CVD, or ALD), via adhering a film comprising the layer of thermally conductive material to an outer surface of the package substrate, or via embedding a film comprising the layer of thermally conductive material to within the package substrate.

A packaging substrate can include a first surface and a second opposing surface, the first surface having a mounting region configured to receive electronic components, and electrical contacts formed on the second opposing surface. A saw street region can surround the mounting region and the electrical contacts, a metal layer and a solder mask layer being formed within the saw street region on the second opposing surface, and the solder mask layer being formed over the metal layer. An electronic module can include a packaging substrate including a first surface and a second opposing surface, the first surface including a mounting region. A plurality of electronic components can be mounted on the mounting region. A ground pad can be formed on the second opposing surface of the packaging substrate, the ground pad including a solder mask layer formed thereon, the solder mask layer having a plurality of openings.

A multilayer printed circuit board includes a plurality of conductive layers formed by a conductive material, in which a blank region with the conductive material removed is formed in at least part of at least an intermediate conductive layer that is formed inside the multilayer printed circuit board, among the plurality of conductive layers, a plurality of island regions are formed by the conductive material included in the intermediate conductive layer in the blank region, and each of the plurality of island regions is not electrically connected to other regions included in the intermediate conductive layer and is disposed so as to be dispersed from one another.

Power amplifier systems including power amplifier modules (PAMs) and electromagnetic bandgap (EBG) isolation structures are disclosed. In embodiments, the power amplifier system includes a printed circuit board (PCB) and a PAM mounted to the PCB in an inverted orientation. The PCB has a PCB frontside on which a PAM mount region is provided, and radio frequency (RF) input and output bondpads. The PAM includes a topside input/output interface having RF input and output terminals electrically coupled to the RF input and output pads, respectively. The power amplifier system further includes a first EBG isolation structure containing a first grounded EBG cell array, at least a portion of which is located within or beneath the PAM mount region.

A flexible circuit board according to an embodiment of the present invention comprises: a substrate; a first wiring pattern layer disposed on a first surface of the substrate; a second wiring pattern layer disposed on a second surface opposite the first surface of the substrate; a first dummy pattern part disposed on the second surface of the substrate on which the second wiring pattern layer is not disposed; a first protection layer disposed on the first wiring pattern layer; and a second protection layer disposed on the second wiring pattern layer and the first dummy pattern part, wherein at least a part of the first dummy pattern part overlaps with the first wiring pattern layer in a vertical direction.

A package structure including a circuit board and a heat generating element is provided. The circuit board includes a plurality of circuit layers and a composite material layer. A thermal conductivity of the composite material layer is between 450 W/mK and 700 W/mK. The heat generating element is disposed on the circuit board and electrically connected to the circuit layers. Heat generated by the heat generating element is transmitted to an external environment through the composite material layer.

A printed circuit board includes: a base substrate; a pad region having a plurality of pad patterns disposed on one surface of the base substrate; and a dummy region having a plurality of conductive dummy patterns separated from the plurality of pad patterns to be disposed on the one surface of the base substrate. The pad region includes a first edge region, and a second edge region disposed in a diagonal direction of the first edge region on the one surface of the base substrate. The dummy region includes a third edge region, and a fourth edge region disposed in a diagonal direction of the third edge region on the one surface of the base substrate.

A multilayer substrate includes a stacked body including a first main surface, and a conductor pattern (including a mounting electrode provided on the first main surface, and a first auxiliary pattern provided on the first main surface). The stacked body includes a plurality of insulating base material layers made of a resin as a main material and stacked on one another. The first auxiliary pattern is located adjacent to or in a vicinity of the mounting electrode. The mounting electrode, in a plan view of the first main surface (when viewed in the Z-axis direction), is interposed between a different conductor pattern (the mounting electrode) and the first auxiliary pattern.

Provided is a method for manufacturing a flexible film. The method for the manufacturing the flexible film includes providing a parent film on which a plurality of film areas are defined, each of which having a detection pattern formed thereon, applying a voltage to each of the film areas to detect whether a defect exists, removing the detection pattern from respective ones of the film areas on which the defect is detected, and cutting out others of the film areas on which the defect is not detected.