An electronic component sub-mount includes a body having a top surface, a bottom surface, and a supporting surface. The top and bottom surfaces are located on opposite sides of the body. The supporting surface is located on one side of the body, and an angle that is not equal to 0 degrees is formed between the supporting surface and the bottom surface. A first conductive layer is disposed on the bottom surface and includes multiple first conductive lines. A second conductive layer is disposed on the supporting surface, extending to the top surface, and includes multiple second conductive lines. The second conductive lines on the supporting surface have a first pin layout, and the second conductive lines on the top surface have a second pin layout different from the first pin layout. The second pin layout matches the pin layout of first conductive lines on the bottom surface.

A printed structure comprises a device comprising device electrical contacts disposed on a common side of the device and a substrate non-native to the device comprising substrate electrical contacts disposed on a surface of the substrate. At least one of the substrate electrical contacts has a rounded shape. The device electrical contacts are in physical and electrical contact with corresponding substrate electrical contacts. The substrate electrical contacts can comprise a polymer core coated with a patterned contact electrical conductor on a surface of the polymer core. A method of making polymer cores comprising patterning a polymer on the substrate and reflowing the patterned polymer to form one or more rounded shapes of the polymer and coating and then patterning the one or more rounded shapes with a conductive material.

A printed structure comprises a device comprising device electrical contacts disposed on a common side of the device and a substrate non-native to the device comprising substrate electrical contacts disposed on a surface of the substrate. At least one of the substrate electrical contacts has a rounded shape. The device electrical contacts are in physical and electrical contact with corresponding substrate electrical contacts. The substrate electrical contacts can comprise a polymer core coated with a patterned contact electrical conductor on a surface of the polymer core. A method of making polymer cores comprising patterning a polymer on the substrate and reflowing the patterned polymer to form one or more rounded shapes of the polymer and coating and then patterning the one or more rounded shapes with a conductive material.

A control module of an appliance is provided. The control module includes a housing having a film integrally molded onto an outer surface of the housing. The film includes conductive ink embedded in the film. A header on the film is in electrical communication with the conductive ink embedded in the film. The control module also includes a printed circuit board mounted within the housing proximate an inner surface of the housing. The film is connected to the printed circuit board via the header. With this connection, the printed circuit board is in operative communication with the conductive ink embedded in the film.

A printed structure comprises a device comprising device electrical contacts disposed on a common side of the device and a substrate non-native to the device comprising substrate electrical contacts disposed on a surface of the substrate. At least one of the substrate electrical contacts has a rounded shape. The device electrical contacts are in physical and electrical contact with corresponding substrate electrical contacts. The substrate electrical contacts can comprise a polymer core coated with a patterned contact electrical conductor on a surface of the polymer core. A method of making polymer cores comprising patterning a polymer on the substrate and reflowing the patterned polymer to form one or more rounded shapes of the polymer and coating and then patterning the one or more rounded shapes with a conductive material.

A printed structure comprises a device comprising device electrical contacts disposed on a common side of the device and a substrate non-native to the device comprising substrate electrical contacts disposed on a surface of the substrate. At least one of the substrate electrical contacts has a rounded shape. The device electrical contacts are in physical and electrical contact with corresponding substrate electrical contacts. The substrate electrical contacts can comprise a polymer core coated with a patterned contact electrical conductor on a surface of the polymer core. A method of making polymer cores comprising patterning a polymer on the substrate and reflowing the patterned polymer to form one or more rounded shapes of the polymer and coating and then patterning the one or more rounded shapes with a conductive material.

A lighting device is described. The lighting device includes a support structure, which includes a central mounting face and at least one first lateral mounting face adjacent the central mounting face and forming an included angle with the central mounting face of 60° to 90°. The device also includes at least one central light emitting element on the central mounting face and in contact with the support structure and at least one first lateral light emitting element on the first lateral mounting face and in contact with the support structure.

A connection body for use with an endoscope that provides an electrical connection between at least one electrical component arranged in a proximal end region of the endoscope and an internal electrical connection provided in the proximal end region. The connection body including: a dimensionally stable three-dimensional circuit carrier: and a flexible elongate circuit board. Where, in a first region of the circuit carrier, the electrical component is mechanically directly connected to the circuit carrier and is contacted by conductor tracks provided in the circuit carrier; in a second region different from the first region, a first end of the circuit board is mechanically directly connected to the circuit carrier and contacts the conductor tracks for electrical connection to the electrical component and a second end of the circuit board opposite the first end in a longitudinal direction of the circuit board, contacts the internal electrical connection.

An electronic device (1), is provided that comprises an electronic component (30) that is arranged on a component carrier (23) in a cavity (14) of a stack (10) of layers. One or more layers carry electrical conductors (15). The cavity (14) extends through the stack of layers from one of said layers (12n) to another one of said layers (12x). The component carrier (23) comprises electrically conductive tracks (24) from electric contacts (31) of the electronic component (30) to electric terminals (25) of the component carrier to a wall of the cavity to form an electrical connection with a respective one of said electrical conductors (15).

A spacer is provided to allow a surface mount device (SMD) to be surface mounted onto a PCB with greater degrees of freedom. The spacer is designed to be surface mountable to the PCB and includes an electrically non-conducting body that has a first surface facing the SMD, a second surface facing the PCB, and through holes and/or indents in the electrically non-conducting body to accommodate electrical conductors that provide electrical connections between the SMD and the PCB. The spacer may provide one or more of: an elevated height (so that the SMD is elevated above the PCB), an offset along the surface of the PCB relative to a designated position for the SMD on the PCB, or a tilt in one or more directions relative to a surface of the PCB.