An electronic device includes a circuit board and an electric element mounted on the circuit board. The electric element includes a multilayer body made of electrically insulating base materials, a transmission line portion, and connection portions. The transmission line portion and the connection portions are provided in the multilayer body. Each of the connection portions is continuous with a corresponding portion of the transmission line portion, and is connected to the circuit board by an electrically conductive bonding material. The transmission line portion other than the connection portions is not electrically connected to an electronic component on the circuit board. The electronic component not electrically connected to the electric element is disposed between the transmission line portion of the electric element and the circuit board.

According to one embodiment, a display device includes a first substrate, a second substrate opposing the first substrate, a liquid crystal layer and a light source that emits light to the liquid crystal layer, and the first substrate includes a first portion opposing the second substrate and having a first thickness and a second portion not opposing the second substrate and having a second thickness which is less than the first thickness, and the light source is disposed on the second portion, and the light source includes a first surface opposing the second portion and a second surface opposing the first surface, and a wiring substrate is disposed on the second surface so that the wiring substrate does not protrude with respect to the second substrate in a thickness direction.

A display device includes a circuit board and a plurality of light-emitting units disposed on the circuit board. The circuit board includes a substrate and a plurality of signal lines disposed on the substrate. Each light-emitting unit includes a base board, at least one light-emitting element and a driving circuit layer. The light-emitting element is between the base board and the substrate. The driving circuit layer is between the light-emitting element and the base board, and electrically connected to the light-emitting element and the signal line.

In one embodiment, an electronic assembly can include: a first electronic device package configured to be mounted on and electrically connected with a system substrate; a second electronic device package electrically connected to the system substrate; and an electrical pathway configured to extend from the system substrate through the first electronic device package and connected to an input terminal of the second electronic device package, the electrical pathway bypassing processing circuitry of the first electronic device package.

The present disclosure relates to an electronic component, a voltage regulation module and a voltage stabilizer. The electronic component may include a substrate, a first electronic element and a second electronic element. The substrate may be provided with a first surface and a second surface that are opposite to each other. The first electronic element may be embedded in the substrate, and may be provided with a first electrical connection terminal and a second electrical connection terminal. The first electrical connection terminal may connect with a first surface of the substrate, the second electrical connection terminal may connect with a second surface of the substrate. The second electronic element may be arranged on the second surface of the substrate and electrically connected to the second electrical connection terminal. The second electronic element may form a stack with the substrate along the first direction.

A multilayer electronic device may include a plurality of dielectric layers stacked in a Z-direction that is perpendicular to an X-Y plane. The device may include a first conductive layer overlying one of the plurality of dielectric layers. The multilayer electronic device may include a second conductive layer overlying another of the plurality of dielectric layers and spaced apart from the first conductive layer in the Z-direction. The second conductive layer may overlap the first conductive layer in the X-Y plane at an overlapping area to form a capacitor. The first conductive layer may have a pair of parallel edges at a boundary of the overlapping area and an offset edge within the overlapping area that is parallel with the pair of parallel edges. An offset distance between the offset edge and at least one of the pair of parallel edges may be less than about 500 microns.

An electronic module includes at least one electronic component including a first principal surface, first and second electrodes on the first principal surface, a wiring board including a second principal surface, third and fourth electrodes on the second principal surface, and a conductive resin portion. The conductive resin portion includes at least one first conductive resin portion joining the first and third electrodes, and at least one second conductive resin portion joining the second and fourth electrodes. The electronic module further includes at least one reinforcing resin portion that is disposed between at least one first and at least one second conductive resin portions and joins the first principal surface of the electronic component with the second principal surface of the wiring board.

A stackable via package includes a substrate having an upper surface and a trace on the upper surface, the trace including a terminal. A solder ball is on the terminal. The solder ball has a solder ball diameter A and a solder ball height D. A via aperture is formed in a package body enclosing the solder ball to expose the solder ball. The via aperture includes a via bottom having a via bottom diameter B and a via bottom height C from the upper surface of the substrate, where A<B and 0=<C<1/2×D. The shape of the via aperture prevents solder deformation of the solder column formed from the solder ball as well as prevents solder bridging between adjacent solder columns.

According to one embodiment, a capacitor includes a conductive substrate, a conductive layer, a dielectric layer, and first and second external electrodes. The conductive substrate has a first main surface provided with recess(s), a second main surface, and an end face extending between edges of the first and second main surfaces. The conductive layer covers the first main surface and side walls and bottom surfaces of the recess(s). The dielectric layer is interposed between the conductive substrate and the conductive layer. The first external electrode includes a first electrode portion facing the end face and is electrically connected to the conductive layer. The second external electrode includes a second electrode portion facing the end face and is electrically connected to the conductive substrate.

A connector with a tolerance module includes a socket and a plug adapted to the socket, wherein the socket includes a first housing, the plug includes a tolerance module and a third housing, the tolerance module includes a second housing, the second housing includes second contact members, the second housing is movably arranged on the third housing in a direction perpendicular to the axial direction of the connector, and the second contact members are floatingly assembled in the second housing to enable displacement in the direction perpendicular to the axial direction of the connector. The second housing only generates translational motion without displacement when the connector is inserted. The tolerance of the plug and the socket is realized by the floating assembly of the second contact members in the second housing.