An electrical connector is provided. The electrical connector is to be attached to a cloth in which a conductive pattern is formed. The electrical connector includes an insulating housing having a boss portion provided on a surface of the housing, where the surface is to be in contact with the cloth, and the boss portion is inserted into the cloth; a connection terminal provided to the housing; and a conductive pad provided around the boss portion on the surface of the housing, where the surface is to be in contact with the cloth, and the conductive pad is electrically connected to the connection terminal. The conductive pad has a protrusion protruding in the same direction as the boss portion of the housing protrudes.

A camera module according to an embodiment of the present technology includes a first component-mounting board, a second component-mounting board, and a spacer component. The first component-mounting board includes an imaging device. The second component-mounting board is electrically connected to the first component-mounting board. The spacer component is arranged between the first component-mounting board and the second component-mounting board. The spacer component includes a component body that is made of a first insulating material. The component body including a first primary-surface portion that includes a plurality of first reference surfaces including at least three first reference surfaces, a second primary-surface portion that includes a plurality of second reference surfaces including at least three second reference surfaces, and a component accommodation portion with or without a bottom, the first primary-surface portion being brought into contact with the first component-mounting board, the second primary-surface portion being brought into contact with the second component-mounting board, the component accommodation portion being provided to at least one of the first primary-surface portion or the second primary-surface portion.

Provided is a method of manufacturing an electrical connection structure which includes a female connection structure having an inner conductive material inside an insertion hole of a female connection member, and a male connection structure having a conductive column configured to be inserted into and fixed to the insertion hole to be in contact with the inner conductive material, and formed to protrude from a male connection member. The method includes preparing insulating members used for the female connection member and the male connection member, and forming the inner conductive material and the column by patterning a conductive material on each of the insulating member using a photolithography process.

A plug-in connector device has a printed circuit board element, a first plug-in connector element which is electrically and mechanically connected to the printed circuit board element by a soldered connection, and a second plug-in connector element which is electrically and mechanically connected to the printed circuit board element by electrical press-in contacts. The second plug-in connector element has a housing section with a recess in which the first plug-in connector element is arranged in such a way that outer surfaces of the first plug-in connector element make contact with inner surfaces of the recess.

A stacked module arrangement includes: a first molded electronic module; a second molded electronic module; and an interface by which the first molded electronic module and the second molded electronic module are physically and electrically connected to one another in a stacked configuration. The first molded electronic module is a power electronic module having a maximum breakdown voltage of at least 40 V and a maximum DC current of at least 10 A.

An apparatus may include a press-fit connection for a printed circuit board and a connecting element, where the connecting element is pressed into the printed circuit board in that the connecting element is tapered at the end facing the printed circuit board, and where an insertion depth to which the tapered section is inserted in the printed circuit board ensures a compensation for tolerances.

A semiconductor device, including a semiconductor module, a positioning member and a printed board. The semiconductor module includes a case that stores a semiconductor chip, a plurality of external terminals electrically connected to the semiconductor chip and extending upward from a front surface of the case, and a reference pin extending upward from the front surface of the case. The positioning member has a reference hole and a plurality of supporting holes penetrating therethrough. The printed board including a plurality of terminal holes that respectively correspond to the plurality of external terminals. The printed board is disposed on the front surface of the case via the positioning member. The plurality of external terminals of the semiconductor module are respectively attached to the plurality of terminal holes.

A preformed solder-in-pin system for use with electrical connectors. The preformed solder-in-pin system generally includes a connector pin having an open cavity at one end, into which a preformed solder member can be first inserted and then pressed, rather than melted, in place, such that voids and air spaces within the cavity are eliminated. The preformed solder-in-pin system can be assembled in high quantities, where the preformed solder members are placed in a fixture and the fixture is placed on a shaker table, so that large numbers of connector pins, pre-installed in connector grommets, can be inserted largely simultaneously.

This invention provides a method for mounting an electroacoustic component on a PCB and an electroacoustic component structure, so as to improve the problem that the traditional electroacoustic component affects the electrical characteristics due to the high temperature baking action in a reflow oven. The method comprises a step of separating and constructing a housing of the electroacoustic component. The housing comprises a shell seat and a base seat, the shell seat is provided with a plurality of sound producing components, and the base seat is provided with at least two conducting terminals for adhering the base seat to the PCB. The conducting terminals on the base seat and the at least two contacts on the PCB are adhered to each other and electrically connected in the reflow oven, and then the shell seat and the base seat are combined to make the shell seat and the base seat with the PCB combined outside the reflow oven into a single body to form an electroacoustic component that is mounted on the PCB.

Power electronics arrangement including a printed circuit board and at least one power module fastened on the printed circuit board, which has one or more electronic components potted by a potting compound. At least one module connecting point of the power module is electrically contacted with at least one board connecting point of the printed circuit board by an electrically conductive pin. A base section of the pin is fastened on the module connecting point or on the board connecting point, and the end of the pin opposite to the base section is pressed in the installation position into a contacting opening assigned or assignable to the respective other connecting point.