A battery pack comprises a set of battery cells, a battery cell holder holding the battery cells, at least one battery strap having a first end connected to a terminal of one of the battery cells and a second end extending from the battery cell holder, a printed circuit board having a first side and a second side, components mounted on the second side of the printed circuit board, a trace on the second side of the printed circuit board extending from one components to a contact connected to the trace and mated with the second end of the at least one battery strap. Multiple vias extend from the first side to the second side, and the contact comprises a first portion having a through hole and a leg integrally formed with and approximately perpendicular to the first portion, the leg extending from the first side of the PCB to the second side of the PCB through a first via, the trace extending from the first via, the leg soldered to the second side of the PCB and the via and the through hole aligned with a second via adjacent to the first via, the through hole sized and configured to receive a PCB end of the strap, the PCB end of the strap soldered to the contact.

A circuit board soldering structure includes lead a plate inserted into a slit hole of a circuit board and soldered to a conductive pattern provided along the slit hole. The lead plate is made of an elastically-deformable metal plate thinner than an opening width (W) of slit hole. The lead plate includes insertion section inserted into the slit hole. The insertion section includes a bent section approaching from one of opposing inner surfaces of the slit hole facing each other toward another of the opposing inner surfaces of the slit hole. The bent section is disposed in the slit hole. The insertion section has both surfaces that are close to or contact corresponding opposing inner surfaces of the slit hole to solder the insertion section to the conductive pattern.

Provided is a MOSFET device for use with a printed circuit board (PCB) of a battery management system (BMS), the device including a semiconductor body; a metal conductor extending outwardly from a side of the semiconductor body; a plurality of power pins extending outwardly from at least one side of the semiconductor body, the power pins having tips bent downwardly; a gate pin extending outwardly from at least one side of the semiconductor body, wherein the tip of the gate pin is raised or elevated relative to the tips of the power pins so as to avoid electrical contact with the one of the spaced apart copper plates, and wherein the tip of the gate pin is connected to a circuit of the battery management system (BMS).

Discussed is a PCB assembly and a manufacturing method of a PCB assembly in which at least two PCBs are electrically connected. The PCB assembly includes a connection metal pin having a body and legs, the body having electric conductivity, and having a pin shape elongated in one direction, a portion of the body being bent according to a predetermined angle of the at least two PCBs arranged in a rotated state, portions of the legs being bent and respectively extended in another direction from opposite ends of the body, the bent and extended portions of the legs being inserted through connection holes respectively formed in the at least two PCBs, and bent and extended terminals of the legs respectively being bent inward to be tightly fixed to lower surfaces of the at least two PCBs.

A circuit arrangement (1), in particular for an electrically driven motor vehicle, has at least one bus bar (5) which is connected electrically to a supplier (2) and which is connected to a first consumer (3) at a first transfer point (6) and to a second consumer (4) at a second transfer point (7). Both the first and the second transfer point (6, 7) are formed as flexible contact points.

A power converter, for a vehicle that is at least partially electrically powered, has a first printed circuit board with DC link capacitors, a circuit breaker group for each alternating current phase, and terminals for alternating current busbars and direct current busbars. A second printed circuit board has a control apparatus for actuating the circuit breaker groups. Also, it has a respective signal pin carrier for the respective circuit breaker group. The signal pin carrier connects the first and the second printed circuit board. Thus, signals between the first and the second printed circuit board can be transmitted via the respective signal pin carrier. The signal pin carrier has six signal pins that are arranged on a plastic carrier.

A power semiconductor component is specified, having a power semiconductor device arranged within a housing, wherein a heat sink is exposed on a first surface of the housing; a wiring substrate which receives the housing with the power semiconductor device and which has a first main surface and a second main surface. A heat dissipation region with increased thermal conductivity is arranged on the second main surface. The housing is arranged on the wiring substrate in such a way that the heat sink is connected to the heat dissipation region via a solder layer. A number of spacers which are arranged between the heat sink and the heat dissipation region are embedded in the solder layer. Furthermore, a method for producing a power semiconductor component is specified.

A semiconductor device includes a semiconductor chip, an insulated circuit substrate including an insulating board and a circuit pattern on the insulating board electrically connected to the semiconductor chip, and a wiring member having a leg portion bonded to the circuit pattern. The leg portion includes a vertical portion, a first divided portion, and a second divided portion. The vertical portion extends in a vertical direction orthogonal to a plane of the circuit pattern, and has a split end provided at a side of the vertical portion at which the circuit pattern is disposed. The first divided portion extends from the split end in a first direction parallel to the plane of the circuit pattern and is bonded to the circuit pattern. The second divided portion extends from the split end in a second direction opposite the first direction and is bonded to the circuit pattern.

A semiconductor module includes a housing, a pin arranged in the housing and including a first contact region which has a press-fit connection, a semiconductor component arranged in the housing and electrically conductively connected to the pin, and a first substrate arranged in the housing and clamped in the housing via the pin by a non-positive locking connection, which, when formed, causes the press-fit connection to be deformed elastically and/or plastically with the first substrate. The first substrate has a first recess which is open and at least in part encompasses the pin in the first contact region. A metallic coating is applied to the first substrate at least in a region of the first recess so as to electrically conductively connect the first substrate to the semiconductor component, and a second substrate is in contact with the pin and connected within the housing in a non-releasable manner.

An inverter power assembly includes: a mounting frame; a power module mounted on the mounting frame; and a capacitor electrically connected to the power module. The inverter power assembly has the power module mounted on the mounting frame and the capacitor electrically connected to the power module, which leads to a simple and compact structure and a reasonable arrangement for the entire inverter power assembly.