A circuit board soldering structure includes lead a plate inserted into a slit hole of a circuit board and soldered to a conductive pattern provided along the slit hole. The lead plate is made of an elastically-deformable metal plate thinner than an opening width (W) of slit hole. The lead plate includes insertion section inserted into the slit hole. The insertion section includes a bent section approaching from one of opposing inner surfaces of the slit hole facing each other toward another of the opposing inner surfaces of the slit hole. The bent section is disposed in the slit hole. The insertion section has both surfaces that are close to or contact corresponding opposing inner surfaces of the slit hole to solder the insertion section to the conductive pattern.

Provided is a MOSFET device for use with a printed circuit board (PCB) of a battery management system (BMS), the device including a semiconductor body; a metal conductor extending outwardly from a side of the semiconductor body; a plurality of power pins extending outwardly from at least one side of the semiconductor body, the power pins having tips bent downwardly; a gate pin extending outwardly from at least one side of the semiconductor body, wherein the tip of the gate pin is raised or elevated relative to the tips of the power pins so as to avoid electrical contact with the one of the spaced apart copper plates, and wherein the tip of the gate pin is connected to a circuit of the battery management system (BMS).

A power distributor of an electrical system of a motor vehicle, including a circuit board, which has a main connection to a main circuit and multiple secondary connections. Each secondary connection is assigned to one secondary circuit and electrically contacted with the main connection via a respective circuit breaker that has two connections. The two connections of each circuit breaker are electrically contacted directly with the circuit board.

Power amplifier assemblies and components are disclosed. According to some embodiments, a power amplifier assembly (10) is provided that includes a power amplifier (12) having a gate lead (14) with a gate contact surface, a drain lead (13) with a drain contact surface and a source contact surface (15) having a length and width. An extended heat slug (11) is mounted against the source contact surface to conduct heat away (18) from the surface and to extend the electrical path of the source. The extended heat slug has at least a length that is greater than the length of the source contact surface.

A transformer is configured to include a pair of cores and that each have an inner leg, wherein a primary winding that is wound around a bobbin having a hollow into which the inner legs of the cores and are inserted, and a secondary winding that has a hollow into which the inner legs of the cores and are inserted and that is constituted of a conductor formed by die-cutting a metal plate into a ring, are dispersedly arranged over the inner legs of the cores and. The bobbin has bobbin support portions that come into contact with a surface of a printed circuit board on which the transformer is implemented.

A printed circuit assembly (PCA) that provides for a method of rebuilding an electrically operated automatic transmission solenoid module. The PCA allows for a repairable yet rugged interconnection of several solenoids that reside within the span of the module assembly.

Example embodiments relate to electronic packages and electronic devices that include the same. One embodiment includes an electronic package. The electronic package includes a package body. The electronic package also includes a heat-conducting substrate arranged inside the package body and having a bottom surface that is exposed to an outside of the package body. Additionally, the electronic package includes an electronic circuit arranged inside the package body and including a semiconductor die that has a bottom surface with which it is mounted to the heat-conducting substrate and an opposing upper surface. Further, the electronic package includes one or more leads partially extending from outside the package body to inside the package body and over the minimum bounding box, each lead having a first end that is arranged inside the package body. In addition, the electronic package includes one or more bondwires for connecting the first end(s) to the electronic circuit.

A multilayer ceramic electronic component and a board having the same are provided. The multilayer ceramic electronic component includes a multilayer ceramic capacitor including external electrodes including front portions and band portions extended from the front portions, terminal electrodes respectively surrounding the front portions and portions of lower surfaces of the band portions of the external electrodes and respectively having a ‘’ shaped groove portion formed in lower portions thereof, and conductive adhesive layers connecting the external electrodes and the terminal electrodes to each other.

An electrical component comprises a main body, a fulcrum portion and at least two terminals including a first terminal and a second terminal. Each of the terminals has a first portion and a second portion. The first portion of one of the first terminal and the second terminal is brought into contact with a circuit board when the main body is tilted relative to the circuit board with the fulcrum portion, which acts as a fulcrum, under an insertion state where the terminals are inserted into through-holes, respectively, while none of the terminals are soldered thereto. When the main body is tilted relative to the circuit board with the fulcrum portion, which acts as the fulcrum, under the insertion state, the second portion of one of the first terminal and the second terminal is brought into contact with the circuit board to regulate an excessive tilt of the main body.

A semiconductor-module external terminal includes a bottom portion to be soldered and a terminal body vertically bent from the bottom portion, and the terminal body includes a first groove on a left end side and a second groove on a right end side of a bending portion which is bent immediately above the bottom portion, and the first groove and the second groove are asymmetrical with respect to a center line passing the terminal body in a vertical direction.