A manufacturing method of the present disclosure is a method for manufacturing a wiring body. The manufacturing method includes a growth process, a transfer process, and a peeling process. In the growth process, a conductive layer of a wiring body is grown on a catalyst provided on a pattern plate. In the transfer process, the conductive layer on the pattern plate is transferred to an insulator. In the peeling process, the conductive layer is peeled off from the pattern plate together with the insulator. When the wiring body is manufactured a plurality of times, the growth process, the transfer process, and the peeling process are repeatedly executed using the same pattern plate.

A method of making an electrical component includes transmitting electrical energy from a power source through one or more deposition anodes, through an electrolyte solution, and to an intralayer electrical-connection feature of a build plate, such that material is electrochemically deposited onto the intralayer electrical-connection feature and forms an interlayer electrical-connection feature. The method also includes securing a dielectric material so that the dielectric material contacts and electrically insulates the intralayer electrical-connection feature and contacts and at least partially electrically insulates the interlayer electrical-connection feature. The method additionally includes depositing a seed layer onto the dielectric material and the interlayer electrical-connection feature, electrochemically depositing material onto the seed layer, to form at least one second intralayer electrical-connection feature of the electrical component, and removing any one or more portions of the seed layer onto which no portion of the at least one second intralayer electrical-connection feature is formed.

A conductive pattern having high dispersion stability and a low resistance over a board is formed. A dispersing element (1) contains a copper oxide (2), a dispersing agent (3), and a reductant. Content of the reductant is in a range of a following formula (1). Content of the dispersing agent is in a range of a following formula (2).
0.0001≤(reductant mass/copper oxide mass)≤0.10  (1)
0.0050≤(dispersing agent mass/copper oxide mass)≤0.30  (2) The dispersing element containing the reductant promotes reduction of copper oxide to copper in firing and promotes sintering of the copper.

The present disclosure provides a manufacturing method of a display panel which includes forming a pattern of a first electrode layer on a first substrate; coating a nano particle solution on the pattern of the first electrode layer and the first substrate; providing a second substrate formed with a pattern of a second electrode layer, wherein the pattern of the first electrode layer corresponds to the pattern of the second electrode layer; and connecting the pattern of the first electrode layer and the pattern of the second electrode layer to a power supply to perform a patterning treatment on the nano particle solution to make the nano particle solution form a pattern of a nano particle layer.

A conductive pattern having high dispersion stability and a low resistance over a board is formed. A dispersing element (1) contains a copper oxide (2), a dispersing agent (3), and a reductant. Content of the reductant is in a range of a following formula (1). Content of the dispersing agent is in a range of a following formula (2).
0.0001≤(reductant mass/copper oxide mass)≤0.10  (1)
0.0050≤(dispersing agent mass/copper oxide mass)≤0.30  (2)
The dispersing element containing the reductant promotes reduction of copper oxide to copper in firing and promotes sintering of the copper.

The present disclosure provides a manufacturing method of a display panel which includes forming a pattern of a first electrode layer on a first substrate; coating a nano particle solution on the pattern of the first electrode layer and the first substrate; providing a second substrate formed with a pattern of a second electrode layer, wherein the pattern of the first electrode layer corresponds to the pattern of the second electrode layer; and connecting the pattern of the first electrode layer and the pattern of the second electrode layer to a power supply to perform a patterning treatment on the nano particle solution to make the nano particle solution form a pattern of a nano particle layer.

A conductive pattern having high dispersion stability and a low resistance over a board is formed. A dispersing element (1) contains a copper oxide (2), a dispersing agent (3), and a reductant. Content of the reductant is in a range of a following formula (1). Content of the dispersing agent is in a range of a following formula (2).

0.0001≤(reductant mass/copper oxide mass)≤0.10  (1)

0.0050≤(dispersing agent mass/copper oxide mass)≤0.30  (2)

The dispersing element containing the reductant promotes reduction of copper oxide to copper in firing and promotes sintering of the copper.

An array-type electrode, which may include a substrate, an isolating layer, an electrode and a micro-structure layer. The isolating layer may be disposed on one side of the substrate. The first part of the electrode may be disposed on one side of the substrate and covered by the isolating layer; the second part of the electrode penetrates through the substrate; the third part of the electrode may be disposed on the other side of the substrate; the first part may be connected to the third part via the second part. The micro-structure layer may be disposed on the isolating layer.

A conductive pattern having high dispersion stability and a low resistance over a board is formed. A dispersing element (1) contains a copper oxide (2), a dispersing agent (3), and a reductant. Content of the reductant is in a range of a following formula (1). Content of the dispersing agent is in a range of a following formula (2).

0.0001(reductant mass/copper oxide mass)0.10(1)

0.0050(dispersing agent mass/copper oxide mass)0.30(2)

The dispersing element containing the reductant promotes reduction of copper oxide to copper in firing and promotes sintering of the copper.

A light-emitting module includes one or more light-emitting devices, and a wiring substrate. Each of the light-emitting devices includes light-emitting elements, and a package including a lower surface having a wiring region. The wiring substrate includes a metal portion, an electrode portion, and an insulating portion, and defines one or more first through holes. The mounting surface of the wiring substrate includes a first region where the metal portion defines an uppermost surface, a second region where the electrode portion defines an uppermost surface, and a third region where the insulating portion defines an uppermost surface. The first region and the second region are separated from each other by the third region. A boundary of each of the first through holes is defined in the first region. The wiring region of each of the light-emitting devices is bonded to the electrode portion of the wiring substrate.