A method of manufacturing an electronic component includes applying a paste at two locations on a board main surface of a board made of alumina and applying a glass paste between the two locations, heating the board, cutting two locations where a fired layer is provided, forming a layer on an outer periphery in a vicinity of a board end surface, forming a plated layer on an outer periphery of the layer, forming a second plated layer on an outer periphery of the plated layer, providing a solder on the board main surface in a vicinity of an electronic element, and providing the electronic element on the board main surface and attaching the electronic element to an interposer board.

The method for removing partial metal wall of hole of the present invention includes the following steps. First, a circuit board is provided. The circuit board includes a plurality of circuit layers, a plurality of dielectric layers, and a plated through hole. Each of the dielectric layers is between two adjacent circuit layers. The wall of the plated through hole includes at least one residual copper. The circuit layer immediately below the residual copper is defined as a signal layer. Next, a position of the signal layer and a position of the residual copper in the plated through hole are obtained. Next, a drill is provided, the drill includes a main body and at least one needle, and the drill is moved to the position of the residual copper. The main body is rotated around the central axis of the main body, so the needle can remove part of the residual copper.

A method for manufacturing a double-sided, single conductor laminate includes providing a laminated substrate that includes a conductive layer, an adhesive layer and a support layer; dry milling a trace pattern in the laminated substrate by removing selected areas of the conductive layer and the adhesive layer; and attaching a first cover layer using a first adhesive layer to the conductive layer. The first cover layer includes one or more precut access holes that align with one or more traces of the trace pattern.

A method can be used for manufacturing a metal substrate structure for a semiconductor power module. A plurality of terminals are welded to a metal top layer. After the welding, a dielectric layer is coupled between the metal top layer and a metal bottom layer. The dielectric can be laminated or molded, as examples.

A method for forming a printed circuit board includes: forming on a substrate a first conductive layer for a first edge connector pin and a first conductive layer for a second edge connector pin, wherein the first conductive layer for the first edge connector pin and the first conductive layer for the second edge connector pin are electrically coupled to one another via a first conductive layer for an electrical bridging element; electroplating a second conductive layer onto both the first conductive layer for the first edge connector pin and the first conductive layer for the second edge connector pin via a plating current conductor; and removing at least a portion of the electrical bridging element to electrically separate the first edge connector pin from the second edge connector pin.

A wiring board manufacturing method includes forming a conductor pattern within a waste board section of a wiring board including a product section and the waste board section, the conductor pattern in which a plurality of polygonal lands made of a conductor are arranged along a first direction and a second direction crossing the first direction, each of the plurality of polygonal lands making contact with an adjacent one of the plurality of polygonal lands at each apex of the plurality of polygonal lands; and selectively removing the conductor at the apex of at least part of the plurality of polygonal lands.

A substrate that enables increasing an allowable current value of a current path in a thickness direction of the substrate and narrowing spaces between multiple current paths, and the like are provided. To solve this subject, a substrate includes a sheet-shaped first base material (1) having a penetrating hole (1B) in the thickness direction and includes a second base material (2) fitted into the penetrating hole (1B). The second base material (2) includes multiple metal bodies (2B). The metal bodies (2B) penetrate in the thickness direction of the first base material (1) in a state of having an end exposed at each of a first surface and a second surface of the second base material (2) that face each other in the thickness direction.

A film composite with electrical functionality for application on a substrate includes at least one conductive structure, a first bonding coat, a film layer and a second bonding coat. The first bonding coat is disposed on an underside of the at least one conductive structure, wherein the first bonding coat has an adhesive effect for application of the at least one conductive structure on the substrate. The second bonding coat is disposed between an upper side of the at least one conductive structure and the film layer. The second bonding coat has an adhesive effect, by which the film layer adheres to the at least one conductive structure.

A method of manufacturing a flexible circuit comprises providing a laminated substrate that includes a conductive layer, an adhesive layer, and a support layer. The method comprises forming conductive traces by removing selected portions of the conductive layer and the adhesive layer by dry milling the laminated substrate. The method comprises applying a protective coating to the conductive traces. The method comprises dispensing a solder material on the protective coating at a first connection point and arranging a first component at the first connection point. The method comprises heating the solder material to remove the protective coating from the first connection point and to connect the first component to one of the conductive traces at the first connection point. The method comprises attaching a second component to the conductive layer at a second connection point that is free of the protective coating by a process other than soldering.

A method for milling flex foil includes providing a web (14) of flex foil including a substrate; a first conductive layer arranged on one surface of the substrate; a second conductive layer arranged on an opposite surface of the substrate; a first insulating layer arranged adjacent to the first conductive layer; and a second insulating layer arranged adjacent to the second conductive layer. The method includes dry milling one side of the web using a milling wheel (20-1) and a first cliche pattern (25-1) (including a rotating drum (24-1) and a flexible substrate (26-1)) including raised portions and non-raised portions to selectively remove at least one of the first conductive layer and the first insulating layer. The method includes dry milling an opposite side of the web using a milling wheel (20-2) and a second cliche pattern (25-2) including upper raised portions, lower raised portions and non-raised portions to selectively remove the second insulating layer.