A circuit assembly may include a substrate and a pattern of contact points formed from deformable conductive material supported by the substrate. The assembly may further include an electric component supported by the substrate and having terminals arranged in a pattern corresponding to the pattern of contacts points. The one or more of the terminals of the electric component may contact one or more of the corresponding contact points to form one or more electrical connections between the electric component and the contact points.

A method and device are described to transfer a viscous functional material onto a receiving substrate. A plate is provided having a cavity surface that includes a cavity. A plurality of individually addressable resistive heater elements are provided that are in thermal contact with respective zones of the cavity. Viscous functional material is provided in the cavity with a material composition that, when sufficiently heated, generates a gas at an interface between the cavity surface in the cavity and the functional material, to transfer the functional material from the cavity by the gas generation onto the receiving substrate. Respective portions of the viscous functional material in respective zones of the cavity are heated by supplying respective ones of the plurality of individually addressable heater elements with an electric power having a respective time dependent magnitude.

A method for manufacturing a wiring board includes: disposing a first resist material on a substrate; forming a first resist layer by curing the first resist material; forming a resin layer on a release film; forming a conductor portion on the resin layer; covering the conductor portion by disposing a second resist material on the resin layer; forming a second resist layer by curing the second resist material; bringing the first resist layer into contact with the second resist layer, and thereafter bonding the first resist layer and the second resist layer by thermocompression bonding; and releasing the release film from the resin layer.

In manufacturing a printed circuit board using a semi-additive method, a removal liquid that has been used in removing a nickel-chromium-containing layer (5) is regenerated by contacting the removal liquid with a chelate resin having a functional group represented by a following formula (1) :

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where a plurality of Rs are identical divalent hydrocarbon groups having 1 to 5 carbons, and a portion of hydrogen atoms may be substituted with halogen atoms.

A method to manufacture an article comprises applying an ink to a substrate. The ink includes a liquid vehicle, a plurality of solid metal particles, a plurality of gallium-containing particles, and a thermally activated flux. The method further comprises curing the ink by heating the substrate to within an activation temperature range of the flux. The article manufactured by this method comprises a substrate, an electronically conductive film arranged on the substrate, and an adherent barrier layer covering both the substrate and the film. The film includes a plurality of solid metal particles with a gallium-based liquid metal bridging the plurality of solid metal particles.

An LED panel light includes a flexible base film, a plurality of circuits arranged on the flexible base film and a plurality of LED lamp beads arranged on the flexible base film, each circuit is connected with at least one LED lamp bead and is provided with at least two mutually parallel conductive wires. The conductive wire consists of a plurality of secondary conductive wires, and a plurality of the secondary conductive wires form a mesh. A method of making a LED panel light includes the following specific steps: S1: providing a flexible base film; S2: manufacturing a plurality of mesh-type conductive wires on the flexible base film by using a mould with circuit patterns of LED panel light; conductive wires forming a circuit, and a plurality of the circuits forming an LED panel light circuit; S3: connecting LED lamp beads with the conductive wires in the circuits.

A shielding cover shields and protects a component in an electronic device. The shielding cover includes a cover body and a flexible printed circuit board disposed on the cover body. A first opening is disposed on an end face of the cover body, and the flexible printed circuit board may be affixed to an outer side of the end face of the cover body through soldering, bonding, or the like, blocking the first opening.

An LED panel light includes a flexible base film, a plurality of circuits arranged on the flexible base film and a plurality of LED lamp beads arranged on the flexible base film, each circuit is connected with at least one LED lamp bead and is provided with at least two mutually parallel conductive wires. The conductive wire consists of a plurality of secondary conductive wires, and a plurality of the secondary conductive wires form a mesh. A method of making a LED panel light includes the following specific steps: S1: providing a flexible base film; S2: manufacturing a plurality of mesh-type conductive wires on the flexible base film by using a mould with circuit patterns of LED panel light; conductive wires forming a circuit, and a plurality of the circuits forming an LED panel light circuit; S3: connecting LED lamp beads with the conductive wires in the circuits.

The present invention includes a method of creating high temperature mechanically and thermally stabilized PCB fabrication on a photo-definable glass substrate or photosensitive glass substrate.

A component carrier includes a stack including at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, a magnetic element assembled to the stack, and a dielectric layer structure on the stack. The magnetic element includes an embedded inductive element. The dielectric layer structure at least partially surrounds the magnetic element. Further, a manufacturing method and a use of photo-imaging are described.