A device is described that includes a carrier that has a plurality of light-emitting diode (LED) mounting areas. Each of the LED mounting areas includes a pair of contact pads, which are electrically coupled to the LED mounting area in a first subset of the plurality of LED mounting areas or electrically connected in series with a shunting element in the respective LED mounting area in a second subset of the plurality of LED mounting areas. In some embodiments, LEDs may be placed in the first subset of the plurality of LED mounting areas.

An electronic card comprising: a first card portion including lightning protection components, a first ground plane and a first ground zone; a second card portion comprising functional components, a second ground plane and a second ground zone; a third card portion, which separates and electrically isolates the first ground plane and the first ground zone from the second ground plane and from the second ground zone; the first ground zone and the second ground zone being unvarnished; the first ground zone and the second ground zone being arranged in order to be applied onto a housing element that is electrically conductive and that belongs to a housing in which the electronic card is integrated.

A high-frequency line substrate is mounted on a printed circuit board. The printed circuit board includes a first high-frequency line. The high-frequency line substrate includes a second high-frequency line and lead pins that connect the first high-frequency line and the second high-frequency line. At the contact portions between the signal lead pins and the second high-frequency line of the high-frequency line substrate, and at the contact portions between the ground lead pins and the second high-frequency line of the high-frequency line substrate, the height of the ground lead pins from an upper surface of the printed circuit board is greater than the height of the signal lead pins.

A method for producing a panel with integrated conductor tracks and electronic components. The panel includes a panel body, wherein the panel body is in particular a sandwich structure, and a membrane. The membrane is connected to the panel body and has integrated conductor tracks and electronic components. At the beginning of the method, an operation for attaching the conductor tracks and the electronic components to the membrane is provided. The subsequent step includes an operation for connecting the membrane, fitted with the conductor tracks and the electronic components, to the panel body.

A microwave or radio frequency (RF) device includes an insulating substrate having a first surface and a second surface opposing the first surface. The device also includes a crossover conductor disposed on the first surface extending between a first edge of the first surface and a second edge of the first surface. The device also includes a depression in the second surface defined at least in part by (i) a third surface recessed in relation to the second surface, and (ii) at least one sidewall that extends between the second surface and the third surface. The device further includes a conductive coating formed over at least a portion of the second surface, the third surface, and the at least one sidewall, where the conductive coating is insulated from the crossover conductor by the insulating substrate.

Printed circuit boards for a base station antenna include a substrate layer, and a first conductive trace and a second conductive trace which are printed on the substrate layer and cross each other. The first conductive trace has two trace sections separated by the second conductive trace. Adjacent ends of the two trace sections separated by the second conductive trace are connected electrically by a jumper. The jumper has an electrical conductor, is isolated electrically from the second conductive trace and is fixed on the printed circuit board. The electrical conductor and the two trace sections are connected electrically at adjacent ends. The printed circuit board allows flexible wiring of the conductive traces on the printed circuit board.

The invention provides a PCB for gallium nitride device, on which has been formed: a gallium nitride welding position to which first and second gallium nitride elements having different packages are interchangeably welded; a first/second driving circuit welding position to which a first/second driving circuit of the first/second gallium nitride element is welded; wherein the gallium nitride welding position includes: a first and second gate pad respectively welded to gate electrode of the first and second gallium nitride element and respectively connected to gate signal terminal of the first and second driving circuit; a first and a second ground pad; a first contact contactless connected to the first ground pad and directly connected to ground terminal of the first driving circuit; and a second contact contactless connected to the second ground pad and directly connected to ground terminal of the second driving circuit.

A power semiconductor module includes a semiconductor board and a number of semiconductor chips attached to the semiconductor board. Each semiconductor chip has two power electrodes. An adapter board is attached to the semiconductor board above the semiconductor chips. The adapter board includes a terminal area for each semiconductor chip on a side facing away from the semiconductor board. The adapter board, in each terminal area, provides a power terminal for each power electrode of the semiconductor chip associated with the terminal area. Each power terminal is electrically connected via a respective vertical post below the terminal area with a respective semiconductor chip and each of the power terminals has at least two plug connectors. Jumper connectors interconnect the plug connectors for electrically connecting power electrodes of different semiconductor chips.

A microwave or radio frequency (RF) device includes an insulating substrate having a first surface and a second surface opposing the first surface. The device also includes a crossover conductor disposed on the first surface extending between a first edge of the first surface and a second edge of the first surface. The device also includes a depression in the second surface defined at least in part by (i) a third surface recessed in relation to the second surface, and (ii) at least one sidewall that extends between the second surface and the third surface. The device further includes a conductive coating formed over at least a portion of the second surface, the third surface, and the at least one sidewall, where the conductive coating is insulated from the crossover conductor by the insulating substrate.

A circuit board assembly includes a circuit board having at least one conductive inner layer and at least one surface. Contact areas or surfaces and electrical and/or electronic components are disposed on the surface and electrically connected to the contact areas. At least two of the contact areas are connected to one another by an electrically conductive strip having ends each being connected to a respective one of the contact areas. The at least two contact areas and the electrically conductive strip have a width of at least 8 mm and the strip has a thickness that is at least double the thickness of the at least one inner layer.