The invention relates to a motor vehicle component support, in particular a motor vehicle door lock (1), and to a method for the production thereof. Said motor vehicle component support is equipped with a strip conductor structure (3) composed of several strip conductors (7). According to the invention, the strip conductor structure (3) comprises at least two conductor strip sub-structures (3a, 3b) which are electrically interconnected by means of at least one connecting element (8) which is applied later.

A printed circuit board assembly comprises a printed circuit board (PCB) defining a mounting end and an opposite contacting end, a row of first pads on the mounting end, a row of second pads on the contacting end, and an edge connector on the contacting end electrically contacted with the second pads, and a high speed line module mounted on a top side of the PCB and including a group of conductive lines, the conductive lines extending parallel to each other over the plane of the PCB, each conductive line having two ends electrically connected to corresponding first and second pads, respectively.

An electronic device includes a package substrate, at least one integrated circuit (IC) die including a substrate having a semiconductor surface including circuitry electrically coupled to bond pads positioned onto contact pads on a top surface of a package substrate. At least one surface mount device (SMD) component including at least a first terminal and a second terminal is on the package substrate positioned lateral to the IC die. There is at least one SMD interconnect electrically connecting to at least one of the first terminal and the second terminal to the bond pads. The SMD interconnect includes a portion of a tie bar that extends to an outer edge of the electronic device.

A semiconductor package includes a first substrate, a first conductive layer, a first surface mount device (SMD) and a first bonding wire. The first substrate has a first top surface. The first conductive layer is formed on the first top surface and has a first conductive element and a second conductive element separated from each other. The first SMD is mounted on the first top surface, overlapping with but electrically isolated from the first conductive element. The first bonding wire electrically connects the first SMD with the first conductive layer.

Flexible interconnection between substrates, where the substrates include one or more solid state light sources, mounted at varying angles are provided. A multi-dimensional lighting device is formed using such substrates. The multi-dimensional lighting device includes external mounting surfaces, each configured to provide mounting positions for one or more substrates. A flexible jumper device electrically couples a given substrate to an adjacent substrate, and provides a predefined clearance between surfaces of the same and exposed conductive surfaces of the lighting device. Each flexible jumper includes a surface mount device (SMD) capable of being placed by automated process, such as by pick-and-place machines. Such lighting devices are thus possible using automated processes in a high-volume, highly-precise manner.

Provided is a master printed circuit board (PCB). The master PCB includes panels defined by grooves cut in the master PCB, the grooves separating one panel from another. A final PCB is formable via use of one or more jumpers, wherein the jumpers are configured to extend across at least one of the grooves to electrically connect one panel to another panel. The electrically connected panels form the final PCB.

Disclosed are various embodiments relating to a circuit board included in an electronic device and, according to one embodiment, the circuit board can comprise: at least one wire included on the circuit board, at least one conductive structure arranged on the circuit board in order to reinforce the circuit board, and arranged in order to electrically connect the at least one wire; and at least one conductive member included on the circuit board, and electrically connecting the at least one wire with the at least one conductive structure, and additional other various embodiments are possible.

A battery bridge for an electronic device, preferably for an electronic implant, has an electrically conductive first contact element, an electrically conductive second contact element and an insulator. The first contact element and the second contact element comprise a weldable material. In a first state of the battery bridge, the first contact element is distanced from the second contact element via a predefined air gap and the first contact element is electrically insulated from the second contact element by the air gap and the insulator. The battery bridge is formed in such a way that it can be transferred, by welding the first contact element and the second contact element together, into a second state, in which the air gap between the first contact element and the second contact element is closed electrically conductively, at least in part. A method for activating such an electronic device is also disclosed.

The electrical circuit can include a line circuit portion having a number of shared resistor pads, where each shared resistor pad is electrically coupled to an electrically conductive line lead, where the electrically conductive line lead carries a voltage capable of operating an electrical load. The electrical circuit can also include a load circuit portion comprising a number of unshared resistor pads. The electrical circuit can further include at least one zero ohm resistor electrically coupled to at least one shared resistor pad. The at least one zero ohm resistor can be configurable after manufacturing the printed circuit board. The load circuit portion can be electrically isolated from the line circuit portion in the absence of the at least one zero ohm resistor being further electrically coupled to at least one unshared resistor pad.

The invention provides a PCB for gallium nitride device, on which has been formed: a gallium nitride welding position to which first and second gallium nitride elements having different packages are interchangeably welded; a first/second driving circuit welding position to which a first/second driving circuit of the first/second gallium nitride element is welded; wherein the gallium nitride welding position includes: a first and second gate pad respectively welded to gate electrode of the first and second gallium nitride element and respectively connected to gate signal terminal of the first and second driving circuit; a first and a second ground pad; a first contact contactless connected to the first ground pad and directly connected to ground terminal of the first driving circuit; and a second contact contactless connected to the second ground pad and directly connected to ground terminal of the second driving circuit.