An electronic device is provided. The electronic device includes an electronic device including a housing including a front plate, a rear plate, and a member surrounding at least part of a space between the front plate and the rear plate and operating as an antenna radiator by being formed of a metal material at least in part, a support member including a first face and a second face, disposed between a display and the rear plate, supporting the display on the first face, and bonded to part of the side member, a printed circuit board, a housing groove formed on a first portion of the member, a conductive body bonded to the housing groove through a press-fit process, and a connection terminal disposed on the printed circuit board and electrically coupling the press-fitted conductive body to the printed circuit board.

A method comprises inserting a press-fit element into a through hole on a substrate board. The method also comprises obtaining a target heat-application plan for the press-fit element. The method also comprises applying heat to the press-fit element. The method also comprises determining that the target heat-application plan has been completed. The method also comprises withdrawing heat from the press-fit element.

A process for producing a backplane circuit board (20) having an internal face (142) adapted to be connected to connectors (13) of circuit boards (12) and an external face (143) adapted to be connected to an external connector (15), blind holes (146, 148) opening on the internal face (142) and external face (143) of the backplane circuit board (20), wherein bonding layers (31, 32) having zones (41, 42) cleared of material facing the blind holes are used between the printed circuits (21, 22, 23).

An assembly is provided. The assembly includes a component, a solder pin arranged on the component, an electrical structural unit, and a soldering point which is arranged on the electrical structural unit and forms an opening, into which the solder pin is insertable along an insertion direction in order to produce a soldered joint. The solder pin has an insertion portion which, on sides of the solder pin that face away from each other, forms insertion walls which are arranged at an acute angle to one another in such a way that the insertion portion tapers in the insertion direction. A part of the insertion portion is arranged outside the opening in such a way that one or more portions of the insertion walls extend inside the opening and one or more portions of the insertion walls extend outside the opening.

A method for producing a device for measuring current intensities, including: providing a resistor arrangement having connection elements and a resistor element arranged therebetween in a current flow direction. The resistor element and the connection elements consist of different electrically conductive materials; forming a contact pin from the material of at least one connection element; positioning a printed circuit board with a conductor track and a passage bore on the resistor arrangement such that the contact pin projects through the passage bore and has on the side of the printed circuit board facing away from the resistor arrangement a protrusion; laterally widening the contact pin in the region of the protrusion by deforming the material such that the printed circuit board is mechanically fixed to the resistor arrangement; and producing an electrically conductive connection between the contact pin and the conductor track of the printed circuit board.

An electrical component comprises a main body, a fulcrum portion and at least two terminals including a first terminal and a second terminal. Each of the terminals has a first portion and a second portion. The first portion of one of the first terminal and the second terminal is brought into contact with a circuit board when the main body is tilted relative to the circuit board with the fulcrum portion, which acts as a fulcrum, under an insertion state where the terminals are inserted into through-holes, respectively, while none of the terminals are soldered thereto. When the main body is tilted relative to the circuit board with the fulcrum portion, which acts as the fulcrum, under the insertion state, the second portion of one of the first terminal and the second terminal is brought into contact with the circuit board to regulate an excessive tilt of the main body.

An apparatus includes a printed circuit board (PCB). The PCB includes a plurality of through-holes extending through the PCB between a PCB first surface and a PCB second surface that opposes the PCB first surface, where each through-hole includes a via extending from the PCB first surface to a depth within the through-hole that is distanced from the PCB second surface. An integrated circuit surface mount is connected at the PCB first surface with vias of the through-holes, and a cable interconnect assembly is surface mount connected at the PCB second surface. The cable interconnect assembly includes a plurality of contact pins, each contact pin extending within a corresponding through-hole and having a sufficient dimension to engage and electrically connect with the via of the corresponding through-hole so as to facilitate exchange of an electrical signal between the integrated circuit and the cable interconnect assembly.

A process for producing a backplane circuit board (20) having an internal face (142) adapted to be connected to connectors (13) of circuit boards (12) and an external face (143) adapted to be connected to an external connector (15), blind holes (146, 148) opening on the internal face (142) and external face (143) of the backplane circuit board (20), wherein bonding layers (31, 32) having zones (41, 42) cleared of material facing the blind holes are used between the printed circuits (21, 22, 23).

An electrical connector includes: an insulating housing; and plural terminals held in the insulating housing and arranged in terminal pairs, each of the terminals including: a holding portion held in the insulating housing; a cantilever extending forward from the holding portion, a slot being provided on the cantilever; a contact portion at a front of the cantilever; and a mounting portion for mounting on a circuit board; wherein the slot extends to the contact portion; and in each terminal pair, a first distance from a center of the contact portion of one terminal thereof to a center of the contact portion of the other terminal thereof is less than a second distance from a center of the mounting portion of one terminal thereof to a center of the mounting portion of the other terminal thereof.

An electrical connector comprises an insulative shell having a floor; a first plurality of contacts extending through the floor, wherein the first plurality of contacts are disposed in a plurality of columns; a second plurality of contacts extending through the floor, wherein the second plurality of contacts are interspersed with the first plurality of contacts within the plurality of columns; and a conductive member adjacent the floor. The conductive member comprises a first plurality of openings, wherein the first plurality of contacts extend through the openings of the first plurality of openings; a second plurality of openings, wherein the second plurality of contacts extend through the openings of the second plurality of openings; and a first plurality of tabs, extending into openings in the insulative shell.