An electrical connector is provided. The electrical connector is to be attached to a cloth in which a conductive pattern is formed. The electrical connector includes an insulating housing having a boss portion provided on a surface of the housing, where the surface is to be in contact with the cloth, and the boss portion is inserted into the cloth; a connection terminal provided to the housing; and a conductive pad provided around the boss portion on the surface of the housing, where the surface is to be in contact with the cloth, and the conductive pad is electrically connected to the connection terminal. The conductive pad has a protrusion protruding in the same direction as the boss portion of the housing protrudes.

An electrical connector comprises an insulative shell having a floor; a first plurality of contacts extending through the floor, wherein the first plurality of contacts are disposed in a plurality of columns; a second plurality of contacts extending through the floor, wherein the second plurality of contacts are interspersed with the first plurality of contacts within the plurality of columns; and a conductive member adjacent the floor. The conductive member comprises a first plurality of openings, wherein the first plurality of contacts extend through the openings of the first plurality of openings; a second plurality of openings, wherein the second plurality of contacts extend through the openings of the second plurality of openings; and a first plurality of tabs, extending into openings in the insulative shell.

A plug-in connector device has a printed circuit board element, a first plug-in connector element which is electrically and mechanically connected to the printed circuit board element by a soldered connection, and a second plug-in connector element which is electrically and mechanically connected to the printed circuit board element by electrical press-in contacts. The second plug-in connector element has a housing section with a recess in which the first plug-in connector element is arranged in such a way that outer surfaces of the first plug-in connector element make contact with inner surfaces of the recess.

The present disclosure relates to an electronic device comprising a wafer comprising a first upper surface having at least one first contact arranged thereon; and at least one die comprising a second upper surface having at least one second contact arranged thereon, and at least one first lateral surface orthogonal to the second upper surface, said first contact being coupled to said second contact by a connector comprising one first conductive pillar formed on said first contact of said wafer; one second conductive pillar formed on said second contact of said die; and at least one conductive ball positioned in contact with at least a first upper portion of said first pillar(s) and in contact with at least one second upper portion of said second pillar(s).

Power electronics arrangement including a printed circuit board and at least one power module fastened on the printed circuit board, which has one or more electronic components potted by a potting compound. At least one module connecting point of the power module is electrically contacted with at least one board connecting point of the printed circuit board by an electrically conductive pin. A base section of the pin is fastened on the module connecting point or on the board connecting point, and the end of the pin opposite to the base section is pressed in the installation position into a contacting opening assigned or assignable to the respective other connecting point.

A circuit board assembly includes a circuit board substrate defining an aperture extending therethrough and configured to accept a planar male terminal from a first side of the circuit board substrate. The assembly further includes a female terminal extending from a second side of the circuit board substrate opposite the first side that defines a slot in a U-shaped portion on the second side of the circuit board substrate. The slot has an open end and a closed end. The slot is sized and arranged to receive the male terminal extending through the aperture be in an interference fit with the male terminal. The female terminal has a pair of tines, each tine having a fixed end attached to a base portion and a free end. The free end of one of the tines is disposed within a mounting hole in the circuit board substrate located adjacent the aperture.

A layout method applied to a connector is provided. The connector is electrically connected between a flexible printed circuit (FPC) and a printed circuit board (PCB). The FPC includes M pairs of differential lines and X shield lines. The PCB includes M pairs of differential lines and Z shield lines. The layout method includes following steps. Firstly, M pairs of conductive lines are disposed on the connector. The M conductive lines are correspondingly electrically connected to the M differential lines of the FPC and the M differential lines of the PCB. Then; Y conductive lines are disposed on the connector, wherein Y is smaller than X. Furthermore, at least one of the Y conductive lines is electrically connected to at least one of the X shield lines and at least one of the Z shield lines.

An electronic apparatus includes a connection target member that has a first connection portion including copper or copper alloy, a connection terminal that has a second connection portion including copper or copper alloy, the second connection portion mechanically connecting with the first connection portion by spring reaction force of the connection terminal, and a joint portion that is provided with a contact point between the first connection portion and the second connection portion. At least one of the first connection portion and the second connection portion includes an oxide film at a periphery of the joint portion on a surface thereof, the oxide film including copper oxide. The joint portion directly joints copper included in the first connection portion and copper included in the second connection portion metallurgically.

A wiring circuit board includes an insulating base layer, a conductive layer disposed on a one-side surface in a thickness direction of the insulating base layer, a cover insulating layer disposed on the one-side surface in the thickness direction of the insulating base layer to cover the conductive layer, and a shield layer disposed on the other-side surface in the thickness direction of the insulating base layer and both side surfaces in the width direction of the insulating base layer and on a one-side surface in the thickness direction of the cover insulating layer and both side surfaces in the width direction of the cover insulating layer. At least one of the insulating base layer and the cover insulating layer has a porous resin layer.

A circuit board including a through-hole into which a press-fit terminal portion is inserted in a depth direction; an inner wall land provided on an inner wall of the through-hole; and a plurality of inner layer lands which are provided in an inner layer of the circuit board, are planes substantially parallel to a mounting surface of the circuit board, and are in contact with the inner wall land. The inner wall land has a first region that is in contact with the press-fit terminal portion and a second region that is not in contact with the press-fit terminal portion. Among the plurality of inner layer lands, a first inner layer land, which is an inner layer land disposed on an identical surface with the first region of the inner wall land, is wider than a second inner layer land which is an inner layer land disposed on an identical surface with the second region of the inner wall land.